MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA
部品番号: MPC855TZQ80D4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $92.78 | $92.78 |
| 10 | $88.5 | $885.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $68.95 | $34,475.00 |
| 1,000 | $61.4 | $61,400.00 |
MPC855TZQ80D4 概要
An MPU (Microprocessor Unit) is the central processing component of an embedded system, distinct from an MCU by typically lacking on-chip flash and relying on external memory. The MPC8xx PowerQUICC family sits in the hierarchy as: MPU -> embedded processor -> integrated communications processor -> telecom/networking SoC. The MPC855T specifically targets telecom access gear (DSLAMs, routers, switches) where wire-speed Fast Ethernet and serial-protocol termination are required without a separate MAC ASIC.
Key features include a 32-bit Power Architecture core, on-chip CPM with dedicated RISC engine, Fast Ethernet MAC (10/100 Mbps), ATM AAL support, HDLC/SS#7 channels, PCMCIA interface, memory controller for SDRAM/ROM/Flash, and a commercial 0 to +95 °C operating temperature grade ('Z' = no floor). The 'TQ80' suffix decodes to a 80 MHz core frequency at the Z (0 to 95 °C) commercial grade, and the 'D4' indicates revision 4.x silicon in the ZQ/ZU 357-BGA package family.
Typical applications include SOHO and SMB routers, xDSL gateway/CPE platforms, ISDN terminal adapters, Fast Ethernet bridges, industrial serial-protocol converters, and embedded telecom control boards. The integrated CPM offloads protocol processing from the core, allowing wire-rate handling of multiple WAN interfaces simultaneously.
When designing with this part, allocate at least four PCB layers for the PBGA fan-out, and follow NXP's PowerQUICC Hardware Specifications for memory-controller timing, decoupling, and thermal management. Stock is constrained because NXP has issued a Discontinuance and Replacement Product Change Notice for this EOL family.
ドロップイン代替品: MPC855TZQ80D4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC855TZQ80D4 （同一形状・フットプリント） — 相違点: Mounting Type, Core Architecture, Package, RoHS Status, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
MPC860DPZQ80D4
✅ ドロップイン✓ 在庫あり
$13.85 / 個
データシートを見る →MPC860DTZQ80D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860SRVR80D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860PCZQ66D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC855TZQ80D4 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Type | Microprocessor Unit (MPU) |
| Series | PowerQUICC MPC8xx (MPC855T) |
| Core Architecture | Power Architecture MPC8xx, 32-bit |
| Core Clock Frequency | 80 MHz |
| Communication Processor Module (CPM) | Integrated RISC engine with FCC/ATM/HDLC |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC |
| Serial Protocols | ATM, HDLC, SS#7 (via CPM) |
| PCMCIA Interface | Yes (1 or 2 slots) |
| Memory Bus Width | 32-bit (external) |
| データバス幅 | 32 bit |
| Process Technology | 0.32 um CMOS |
| 動作温度 | 0 °C to +95 °C (commercial 'Z' grade) |
| パッケージ | 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) |
| 実装タイプ | Surface Mount, BGA |
| RoHS ステータス | Not compliant (SnPb-ball BGA, pre-RoHS generation) |
| Lead-Free | No (SnPb solder balls) |
| Lifecycle | Discontinued — see Discontinuance PCN |
MPC855TZQ80D4 357-pin pbga, 25 x 25 mm (zq/zu tray) ピン配置ガイド
MPC855TZQ80D4 (357-pin pbga, 25 x 25 mm (zq/zu tray) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC855TZQ80D4.
詳細は データシート をご参照ください。
主な用途
MPC855TZQ80D4 の用途: 6 件s: SOHO Router & Broadband Gateway, ISDN Terminal Adapter / NT, Industrial Serial Protocol Converter, xDSL CPE Modem Platform, Fast Ethernet Bridge / Media Converter, Legacy Telecom Control Board (V5.x / E1).
SOHO Router & Broadband Gateway
The MPC855TZQ80D4's integrated Fast Ethernet MAC and wire-rate CPM offload make it a single-chip solution for SOHO/SMB routers and xDSL gateways. With a 80 MHz Power Architecture core and dedicated RISC engine for protocol handling, the device handles NAT, routing, and PPPoE termination without requiring an external ASIC. Placed at the heart of the gateway with 32 to 64 MB of SDRAM and a 4 to 8 MB boot Flash, it processes bidirectional Fast Ethernet traffic at wire speed. According to the NXP PowerQUICC Hardware Specifications, the on-chip FCC (Fast Communication Controller) sustains 100 Mbps full-duplex while the core runs the Linux networking stack, eliminating the need for a separate network processor.
おすすめ
ISDN Terminal Adapter / NT
The integrated HDLC channels and PCMCIA controller make the MPC855TZQ80D4 well suited to ISDN terminal adapters and Network Termination 1 (NT1) equipment that bridge BR/PRI ISDN to Ethernet. The CPM supports D-channel HDLC framing at full ISDN bit rates while the MPC8xx core runs the management/V.110/V.120 stack. With the 357-PBGA package providing ample I/O for parallel PRI buses, it consolidates what used to require a discrete HDLC controller. PowerQUICC parts in this family also handle D-channel X.25, frame relay, and SS#7 lower layers, making them attractive for legacy telecom gear where wire-rate protocol termination is mandatory.
おすすめ
Industrial Serial Protocol Converter
Factories deploying multi-protocol serial equipment benefit from the MPC855TZQ80D4's mix of SCC channels running UART, HDLC, and bit-sync protocols concurrently. The CPM independently handles each serial line at up to the SCC bit-rate limit while the Power Architecture core runs the conversion/aggregation application. The commercial 0–95 °C temperature grade is a fit for sealed control cabinets, and the 357-PBGA provides long-term reliability in vibration-heavy environments when paired with underfilled PCB assembly. Compared to a discrete microcontroller + external UART array, the PowerQUICC SBC approach reduces BOM count and shortens development time.
おすすめ
xDSL CPE Modem Platform
xDSL customer-premises equipment (CPE) historically paired a network processor with a DSL PHY; the MPC855TZQ80D4 acts as the network-side controller alongside the DSL analog front end. Its Ethernet MAC terminates the LAN, while the CPM provides the ATM AAL SAR needed for DSL upstream multiplexing. At 80 MHz the MPC8xx core comfortably runs a stripped-down Linux or VxWorks image managing PPP, IP, and ATM PVC setup. Per NXP documentation, the PowerQUICC MPC8xx CPM was the de-facto standard for early-generation ADSL CPE routers, and the MPC855T's lower cost versus the full MPC860 made it the sweet-spot SKU for sub-$100 gateways.
おすすめ
Fast Ethernet Bridge / Media Converter
A simple two-port Fast Ethernet bridge, or a fiber-to-copper media converter, requires wire-rate frame forwarding without complex routing — exactly what the MPC855TZQ80D4's CPM-FCC delivers. The device can be configured in cut-through or store-and-forward mode by dedicating one FCC to each port while the core handles learning-bridge table management. With only 32 MB of SDRAM and a small Flash, the BOM stays low for unmanaged bridges. Compared to using a generic microcontroller with software MAC, the on-chip CPM sustains full 100 Mbps full-duplex on both ports simultaneously without dropping packets.
おすすめ
Legacy Telecom Control Board (V5.x / E1)
V5.1/V5.2 access-network interface controllers and E1/T1 grooming cards use the MPC855TZQ80D4 for its HDLC concentration and PCMCIA expansion slot. The part sits on a VME/PCI/CompactPCI carrier card, terminates multiple E1 links, and bridges timeslots to an upstream switch fabric. Its long lifecycle in the embedded telecom market means mature VxWorks and pSOS board-support packages remain available, easing maintenance of installed base hardware. Compared to newer SoCs, the PowerQUICC MPC855T retains dedicated timeslot-assignment hardware (TSA) and serial interface with TDM, which newer devices often lack, making it a preferred migration target only when those legacy paths are needed.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC855TZQ80D4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC860DPZQ80D4 | MPC860DTZQ80D4 | MPC860SRVR80D4 | MPC860PCZQ66D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (ZQ) 25x25 mm | 357-BGA (ZQ) — same family | 357-BGA (ZQ) — same family | 357-BGA family (VR variant) | 357-BGA (ZQ) — same family |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 66 MHz (-17.5%) |
| Series | PowerQUICC MPC8xx (MPC855T) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC860) |
| Core Architecture | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx |
| CPM Channels / Ethernet MACs | 1× 10/100 MAC + multi-channel CPM | Higher-channel count | Highest channel count in family | Sibling variant | Lower clock, same architecture |
| Operating Temperature | 0 °C to +95 °C (Z grade) | 0 °C to +95 °C (Z grade) | 0 °C to +95 °C (Z grade) | 0 °C to +95 °C (R grade VR package) | 0 °C to +95 °C (Z grade) |
| RoHS / Lead-Free | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) |
| Lifecycle | Discontinued (EOL) | Discontinued (EOL) | Discontinued (EOL) | Discontinued (EOL) | Discontinued (EOL) |
主な差別化要因
- Lowest-cost PowerQUICC with integrated Fast Ethernet MAC （vs MPC860DPZQ80D4)
- Mature, long-availability software ecosystem （vs MPC860DTZQ80D4)
- Integrated CPM offloads wire-rate protocol handling （vs MPC860PCZQ66D4)
設計ノート
Estimated: at 80 MHz with typical 3.3 V core and 3.3 V I/O rails under normal load, the MPC855TZQ80D4 dissipates roughly 1.5 to 2.5 W. The 357-PBGA has no exposed thermal pad; rely on a minimum 4-layer PCB with an unbroken inner ground/power plane and thermal vias under the die-shadow region to keep junction temperature below 110 °C in the 0–95 °C ambient range. No manufacturer SOA is published for this device because the part is an MPU rather than a power semiconductor.
Follow NXP's PowerQUICC Hardware Specifications PCB-layout section: 50 Ω controlled impedance for the SDRAM bus, matched-length groups for clock and data, decoupling capacitors placed within 100 mil of every power pin, and a minimum of 6 PCB layers (4 signal + 2 plane) for full bus routing. The 357-BGA at 1.27 mm pitch requires laser-drilled micro-vias or 0.4 mm-pitch dogbone fan-outs; standard 0.3 mm-drilled PTHs will not fit between balls.
Because the BGA uses SnPb (lead-bearing) balls, the MPC855TZQ80D4 is not RoHS compliant and cannot be processed on a lead-free SMT line without a manufacturer-supplied exemption flow. Also note that the 'D4' revision suffix matters: revision 4.x silicon fixed known errata in earlier revisions; do not qualify production builds on pre-D4 silicon. Finally, design for boot from Flash with proper bus-grant configuration — many first-boot failures stem from incorrect BR/OR register setup in the U-Boot or ppcboot image.
コンプライアンス情報
Pre-RoHS, SnPb solder balls per NXP product page and DigiKey RoHS flag. AEC-Q100 not applicable for telecom/commercial MPU. REACH and conflict-mineral statements are not published on the NXP product page for this EOL part; treat as 'unknown' rather than assumed-compliant.
