MPC870ZT133 vs MPC875ZT133 比較
詳細な並列比較: MPC870ZT133 メーカー: NXP Semiconductors および MPC875ZT133 メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
NXP Semiconductors
MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors
MPC875ZT133 ✗ 生産終了仕様比較
| パラメータ | MPC870ZT133 | MPC875ZT133 |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | Obsolete | 製造終了 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $28.75 | $19.85 |
| Manufacturer | NXP USA Inc. (formerly Freescale) | — |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (PowerPC) 32-bit |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| 電源電圧 | 3.3 V I/O, 1.8 V core | — |
| 動作温度 | 0C to +95C (commercial) | 0C to +95C |
| パッケージ / ケース | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | BALL |
| Number of Terminals | 256 | 256 |
| Package Code | HBGA | HBGA, Grid Array with Heat Sink/Slug |
| 実装タイプ | Surface Mount | Surface Mount |
| Lead Free Status | Contains Lead | — |
| RoHS ステータス | Non-Compliant (legacy part) | [DATA_NEEDED: rohs status] |
| Packaging | Tray | — |
| Core Count | — | 1 |
| Family | — | MPC8xx / PowerQUICC |
| パッケージ | — | 256-ball PBGA (23x23 mm) |
| Maximum Supply Voltage | — | 1.9 V |
| Communications Processor Module (CPM) | — | Yes (on-chip) |
| Ethernet MAC | — | 10/100 Mbps (Fast Ethernet, integrated) |
| Memory Controller | — | External SDRAM/Flash bus (integrated) |
| ライフサイクル状態 | — | End of Life (per NXP discontinuance notice) |
| Instruction Set | — | Power Architecture 32-bit |