MPC870ZT133 vs MPC875ZT133 Comparison
Detailed side-by-side comparison of MPC870ZT133 by NXP Semiconductors and MPC875ZT133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors
MPC875ZT133 ✗ End of LifeSpecification Comparison
| Parameter | MPC870ZT133 | MPC875ZT133 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $28.75 | $19.85 |
| Manufacturer | NXP USA Inc. (formerly Freescale) | — |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (PowerPC) 32-bit |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Supply Voltage | 3.3 V I/O, 1.8 V core | — |
| Operating Temperature | 0C to +95C (commercial) | 0C to +95C |
| Package / Case | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | BALL |
| Number of Terminals | 256 | 256 |
| Package Code | HBGA | HBGA, Grid Array with Heat Sink/Slug |
| Mounting Type | Surface Mount | Surface Mount |
| Lead Free Status | Contains Lead | — |
| RoHS Status | Non-Compliant (legacy part) | [DATA_NEEDED: rohs status] |
| Packaging | Tray | — |
| Core Count | — | 1 |
| Family | — | MPC8xx / PowerQUICC |
| Package | — | 256-ball PBGA (23x23 mm) |
| Maximum Supply Voltage | — | 1.9 V |
| Communications Processor Module (CPM) | — | Yes (on-chip) |
| Ethernet MAC | — | 10/100 Mbps (Fast Ethernet, integrated) |
| Memory Controller | — | External SDRAM/Flash bus (integrated) |
| Lifecycle Status | — | End of Life (per NXP discontinuance notice) |
| Instruction Set | — | Power Architecture 32-bit |