P1022NSE2LHB vs P1022NXN2LFB 比較
詳細な並列比較: P1022NSE2LHB メーカー: NXP Semiconductors および P1022NXN2LFB メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
NXP Semiconductors
P1022NSE2LHB - QorIQ P1 2-Core 1.067GHz Power Arch SoC | NXP
P1022NSE2LHB ⚠ ラストタイムバイNXP Semiconductors
P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
P1022NXN2LFB ⚠ ラストタイムバイ仕様比較
| パラメータ | P1022NSE2LHB | P1022NXN2LFB |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | ラストバイ | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $56.75 | $78.40 |
| Family | QorIQ P1 | — |
| CPU Core | Power Architecture e500v2 (32-bit) | — |
| Number of Cores | 2 | — |
| Maximum Core Frequency | 1.067 GHz | — |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache | 256 KB (shared) | — |
| Memory Controller | 32-bit DDR2/DDR3 with ECC | DDR2/DDR3 with ECC support, up to 32-bit |
| Gigabit Ethernet | 3x 10/100/1000 MAC (eTSEC) | — |
| PCI Express | 3x PCIe 2.0 controllers | — |
| USB | 2x USB 2.0 (host + device) | USB 2.0 host/device |
| Security Engine | SEC (AES, DES, SHA, MD5, Kasumi) | Integrated (symmetric/asymmetric crypto acceleration) |
| Display | Integrated LCD controller | — |
| パッケージ | 689-TEPBGA II (31x31 mm) | — |
| 動作温度 | 0C to 105C | -40 °C to +125 °C (industrial) |
| Silicon Revision | Rev 2 (suffix "2") | — |
| Process Technology | 45 nm CMOS | — |
| Architecture | — | Power Architecture e500 dual-core (RISC, 32-bit) |
| Clock Speed (Core) | — | 1.067 GHz |
| Platform Version | — | 1067/533/667 ET NE r1.1 |
| Core Count | — | 2 |
| Package Type | — | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) |
| Package Dimensions | — | 31 x 31 mm, 2.23 mm height |
| ピン数 | — | 689 |
| 電源電圧 | — | 3.13 V to 3.47 V |
| Ethernet MACs | — | 3 x 10/100/1000 Mbps Gigabit |
| PCIe Interfaces | — | 3 x PCIe Gen1 |
| Display Controller | — | 32-bit LCD controller |
| RoHS Compliance | — | Yes (halogen-free) |
| 実装タイプ | — | Surface Mount (BGA, requires thermal via array under die) |