P1022NSE2LHB vs P1022NXN2LFB 비교
다음의 상세 나란히 비교: P1022NSE2LHB 제조: NXP Semiconductors 및 P1022NXN2LFB 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
P1022NSE2LHB - QorIQ P1 2-Core 1.067GHz Power Arch SoC | NXP
P1022NSE2LHB ⚠ 최종 구매NXP Semiconductors
P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
P1022NXN2LFB ⚠ 최종 구매사양 비교
| 파라미터 | P1022NSE2LHB | P1022NXN2LFB |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 최종 구매 | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $56.75 | $78.40 |
| Family | QorIQ P1 | — |
| CPU Core | Power Architecture e500v2 (32-bit) | — |
| Number of Cores | 2 | — |
| Maximum Core Frequency | 1.067 GHz | — |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache | 256 KB (shared) | — |
| Memory Controller | 32-bit DDR2/DDR3 with ECC | DDR2/DDR3 with ECC support, up to 32-bit |
| Gigabit Ethernet | 3x 10/100/1000 MAC (eTSEC) | — |
| PCI Express | 3x PCIe 2.0 controllers | — |
| USB | 2x USB 2.0 (host + device) | USB 2.0 host/device |
| Security Engine | SEC (AES, DES, SHA, MD5, Kasumi) | Integrated (symmetric/asymmetric crypto acceleration) |
| Display | Integrated LCD controller | — |
| 패키지 | 689-TEPBGA II (31x31 mm) | — |
| 동작 온도 | 0C to 105C | -40 °C to +125 °C (industrial) |
| Silicon Revision | Rev 2 (suffix "2") | — |
| Process Technology | 45 nm CMOS | — |
| Architecture | — | Power Architecture e500 dual-core (RISC, 32-bit) |
| Clock Speed (Core) | — | 1.067 GHz |
| Platform Version | — | 1067/533/667 ET NE r1.1 |
| Core Count | — | 2 |
| Package Type | — | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) |
| Package Dimensions | — | 31 x 31 mm, 2.23 mm height |
| 핀 수 | — | 689 |
| 공급 전압 | — | 3.13 V to 3.47 V |
| Ethernet MACs | — | 3 x 10/100/1000 Mbps Gigabit |
| PCIe Interfaces | — | 3 x PCIe Gen1 |
| Display Controller | — | 32-bit LCD controller |
| RoHS Compliance | — | Yes (halogen-free) |
| 실장 유형 | — | Surface Mount (BGA, requires thermal via array under die) |