10AS048E4F29E3LG - Arria 10 SX 480K LE SoC FPGA, 1.5GHz, 780-FBGA | Intel
部品番号: 10AS048E4F29E3LG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1350 | $1,350,000.00 |
10AS048E4F29E3LG 概要
An SoC FPGA is a hybrid device that combines a general-purpose processor subsystem (in this case dual ARM Cortex-A9 cores) with programmable FPGA logic on a single die. Unlike a discrete MCU plus FPGA solution, the SoC FPGA offers tighter latency between HPS peripherals and FPGA fabric, lower BOM cost, and a unified power and clock tree. The Arria 10 SX architecture uses TSMC's 20 nm process and Intel's adaptive logic modules (ALMs), embedded memory blocks (M20K), and variable-precision DSP blocks.
Key features include 480K logic elements, approximately 28Mb of on-chip memory, variable-precision DSP blocks supporting fixed- and floating-point operations, multiple high-speed transceiver channels, and hard memory controllers for DDR3/DDR4. The device supports industrial temperature ranges and exposes PCI Express Gen3 hard IP blocks. The integrated dual-core ARM Cortex-A9 MPCore subsystem includes NEON media engines, L1/L2 caches, and a rich peripheral set (USB, Gigabit Ethernet, NAND/NOR flash controllers, I2C, SPI, UART).
Typical applications include wireless baseband processing, military radar and electronic warfare, industrial machine vision, broadcast video processing, and high-performance embedded computing. The combination of high DSP throughput and a Linux-capable host processor suits applications that mix high-rate signal processing with control-plane software.
Designers should plan thermal management around the 29x29 mm FC-FBGA package, follow Intel's recommended power rail sequencing, and use Quartus Prime for HDL development and HPS software toolchain integration. The part supports JTAG, AS, and PS configuration modes for FPGA fabric and dedicated HPS boot paths.
The 10AS048E4F29E3LG is best understood as a mid-density Arria 10 SX variant, sitting between smaller 10AS027/10AS032 and larger 10AS066/10AS115 options in the same family. The 780-FBGA F29 package footprint is shared with several other Arria 10 SX SKUs, enabling PCB reuse across density grades within the same family.
This page synthesizes distributor pricing, package-specific drop-in alternatives within the Arria 10 SX family, and practical design notes that go beyond the raw mark in the manufacturer datasheet.
ドロップイン代替品: 10AS048E4F29E3LG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS048E4F29E3LG （同一形状・フットプリント） — 相違点: Mounting Type, Package, RoHS Status, Logic Elements, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
10AS032E4F29E3LG
✅ ドロップイン✓ 在庫あり
$2295 / 個
データシートを見る →10AS066E4F29E3LG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AS048E4F29E3LG 最大定格＆電気的特性
| MPN | 10AS048E4F29E3LG |
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | 1.5 GHz |
| パッケージ | 780-pin FC-FBGA (F29, 29x29 mm) |
| Device Grade | Enhanced (E4) |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) |
| Process Node | TSMC 20 nm |
| RoHS ステータス | Compliant (per Altera product page) |
| 実装タイプ | Surface Mount (FC-FBGA) |
| Lead-Free | Yes |
10AS048E4F29E3LG 780-pin fc-fbga (f29, 29x29 mm) ピン配置ガイド
10AS048E4F29E3LG (780-pin fc-fbga (f29, 29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS048E4F29E3LG.
詳細は データシート をご参照ください。
主な用途
10AS048E4F29E3LG の用途: 6 件s: Wireless Baseband Processing, Military Radar and Electronic Warfare, Industrial Machine Vision, Broadcast Video Processing, High-Performance Embedded Computing, Medical Imaging Systems.
Wireless Baseband Processing
The 10AS048E4F29E3LG's combination of 480K logic elements, variable-precision DSP blocks, and multi-gigabit transceivers targets LTE and 5G baseband workloads where hundreds of physical-layer channels must be processed in parallel. Its dual ARM Cortex-A9 cores handle MAC scheduling and upper-layer stack offload while the FPGA fabric runs the high-rate PHY pipelines. The 28Mb of embedded M20K memory absorbs multi-symbol buffering without external SRAM. Designers typically synthesize 4x4 MIMO PHY blocks at this density. Compared with a discrete MCU+FPGA partition, the SoC FPGA reduces fabric-to-host latency by an order of magnitude and simplifies clock-domain crossing, which is critical for tight HARQ timing budgets.
おすすめ
Military Radar and Electronic Warfare
The 10AS048E4F29E3LG suits radar and EW front-end processing where pulse-compression, Doppler filtering, and beamforming math saturate a DSP-rich fabric. Its variable-precision DSP blocks support floating-point FFTs at high SNR, while the integrated Cortex-A9 cores handle tracker state machines and target classification software in C/C++. The F29 FC-FBGA package provides the thermal headroom needed for sustained 10-15W envelope in sealed enclosures. Designers typically pair this part with external ADCs and high-speed DACs via the device's LVDS and transceivers for digital receiver/exciter boards. The SoC architecture eliminates the FPGA-to-host backplane latency that would otherwise limit tracking update rates.
おすすめ
Industrial Machine Vision
The 10AS048E4F29E3LG delivers the parallel pixel pipelines needed for multi-camera machine vision inspection lines running at 60-120 fps per channel. The FPGA fabric handles Bayer demosaic, color correction, and edge detection in real time, while the dual ARM Cortex-A9 cores run the inspection classifier (CNN, OpenCV) and EtherCAT/Profinet host protocol. Its hard memory controller interfaces directly to DDR3/DDR4 frame buffers, and PCI Express Gen3 hard IP links to host PCs at full bandwidth. The industrial temperature rating of E4-grade parts supports factory-floor deployment. The SoC FPGA approach reduces bill-of-materials count and simplifies EMC compliance versus a separate industrial PC plus frame grabber.
おすすめ
Broadcast Video Processing
The 10AS048E4F29E3LG is widely deployed in broadcast video switchers, up/down/cross converters, and IP gateway products where SDI and SMPTE ST 2110 streams must be processed at line rate. Its transceivers handle 12G-SDI coax and 25G Ethernet for ST 2110, while the FPGA fabric implements color-space conversion, frame-rate conversion, and HDR mapping pipelines. The dual ARM cores manage network control and ancillary data extraction. Designers build products that previously required ASIC video chips at lower cost by leveraging Arria 10 SX DSP and memory bandwidth. Quartus Prime IP cores for SDI and SMPTE 2022/2110 accelerate development significantly versus writing RTL from scratch.
おすすめ
High-Performance Embedded Computing
The 10AS048E4F29E3LG fits defense and aerospace embedded computing slots where Linux runs on the dual ARM Cortex-A9 cores while FPGA logic accelerates DSP or crypto workloads under the OpenCL or Vitis Unified Software Platform toolchains. Its compact 29x29 mm FC-FBGA package supports conduction-cooled VPX or SOSA-aligned cards. Hard PCI Express Gen3 enables direct host offload to the fabric. The SoC architecture removes the host-to-FPGA PCIe round-trip from latency-sensitive pipelines. Programs like SOSA and VITA standardize on Arria 10 SX as a reference SoC FPGA, so designs can reuse carrier firmware and BSPs.
おすすめ
Medical Imaging Systems
The 10AS048E4F29E3LG can serve as the central compute SoC in CT, MRI, or ultrasound imaging subsystems where FPGA pipelines reconstruct images from raw transducer or detector data while the ARM Cortex-A9 cores handle the operator console stack. Its high M20K memory bandwidth absorbs the multi-gigabyte working sets of reconstruction algorithms (back-projection, FBP, iterative reconstruction). PCI Express Gen3 hard IP streams reconstructed images to host workstation GPUs for post-processing and review. The SoC architecture simplifies FDA documentation because fewer independent components must be qualified separately. Designers should still validate the industrial temperature grade against the medical device's intended deployment environment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS048E4F29E3LG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS032E4F29E3LG | 10AS066E4F29E3LG |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | 780-FBGA (F29, 29x29 mm) | 780-FBGA (F29, 29x29 mm) - same | 780-FBGA (F29, 29x29 mm) - same |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 480,000 | ~320,000 | ~660,000 |
| Device Grade | E4 (Enhanced) | E4 (Enhanced) | E4 (Enhanced) |
| Processor Core | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Node | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
| Pin-to-Pin Compatible | Yes (within Arria 10 SX F29 family) | Yes | Yes |
| RoHS | Compliant | Compliant | Compliant |
| Approximate Unit Price (USD, as of 2026-09-05) | ~1,850 | ~1,400 | ~2,800 |
主な差別化要因
- Higher density with same F29 footprint （vs 10AS032E4F29E3LG)
- Lower cost when full density is not required （vs 10AS066E4F29E3LG)
- Same Arria 10 SX SoC HPS integration as larger parts （vs 10AS066E4F29E3LG)
設計ノート
The 780-pin F29 FC-FBGA package must dissipate the device's full-load power through the PCB. At industrial ambient (typically 85C junction limit), use a minimum 4-layer PCB with a continuous unbroken ground plane under the device, plus thermal via arrays in the BGA land pattern. Estimate: a fully utilized 10AS048 design can draw 8-12W; with only a 1 oz copper ground plane this may exceed thermal limits in a sealed enclosure - add heatsink or forced-air cooling. Use the Arria 10 PowerPlay early-power estimator to size your cooling solution before layout.
The 780-ball 1.0 mm pitch FC-FBGA requires microvia PCB technology (HDI, laser-drilled microvias in the BGA breakout). Standard 4-mil/8-mil line/space rules will not escape this package - design your stackup for microvias at the BGA pads and through-vias on outer breakouts. Reference Intel's Arria 10 SX F29 package PCB layout guidelines for via pattern, antipad sizing, and decoupling capacitor placement. Decoupling: place 0.1 uF and 1 nF X7R capacitors within 100 mils of every power pin, and 10-22 uF bulk capacitors at each regulator output that supplies the device.
Arria 10 SX FPGAs require multiple sequenced power rails (typically 0.9V core, 1.1V HPS, 1.8V/2.5V/3.3V I/O, 1.2V transceiver, etc.). Use the Intel-recommended power controller (for example, the LTC or TI PMBus controllers in the reference design) to enforce the required power-up and power-down sequencing. In-rush current on the 0.9V core can exceed 5A during configuration - size the core regulator accordingly and place input bulk capacitors to handle transient response. Do not power the transceiver rails before the core rail is stable.
Common Arria 10 SX design pitfalls: (1) Configuring HPS boot source after FPGA fabric loads, which prevents fallback to JTAG if the FPGA image is corrupt - set MSEL pins correctly per the configuration user guide. (2) Insufficient HPS-to-FPGA bridge clock crossing logic - use Quartus-generated bridges, do not hand-roll. (3) Transceiver reference clock jitter exceeds the spec sheet limit; use a low-jitter clock source and keep its PCB trace short. (4) JTAG chain shared with HPS debug - route TDO/TMS/TCK through a multiplexer if you need both Quartus and ARM DS-5 simultaneous access.
コンプライアンス情報
RoHS compliance and lead-free confirmed per the Altera product page. AEC-Q100 not applicable to this part number; check Arria 10 SX automotive-grade variants if needed. REACH, halogen-free, and conflict-minerals details were not explicitly stated in the provided data and are marked as unknown.
