10AS048E4F29E3SG - Arria 10 SX SoC FPGA, 480K LE | Altera
部品番号: 10AS048E4F29E3SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3950 | $39,500.00 |
| 100 | $3650 | $365,000.00 |
| 500 | $3380 | $1,690,000.00 |
| 1,000 | $3120 | $3,120,000.00 |
10AS048E4F29E3SG 概要
What is an SoC FPGA? A System-on-Chip FPGA is a hybrid device that merges a general-purpose processor subsystem with a programmable logic fabric on a single die. In taxonomy terms, an SoC FPGA sits below the broader class of programmable logic devices (PLDs) and alongside pure FPGAs and CPLDs, while the embedded HPS places it within the family of application processors. The Arria 10 SX is positioned in the mid-to-high performance tier of Intel's (formerly Altera's) SoC portfolio, between the lower-density Cyclone V SoC and the high-end Stratix 10 SoC.
Key features for the 10AS048E4F29E3SG include 480K logic elements, embedded DSP blocks, embedded memory (M20K), variable-precision DSP, and hard memory controllers supporting DDR4/3 and LPDDR4/3. The HPS integrates dual ARM Cortex-A9 cores up to 1.5 GHz with CoreSight, NEON media engine, and a rich set of peripherals including Ethernet MAC, USB, SATA, and SD/eMMC controllers. Hardened PCIe Gen2/Gen3 IP blocks support up to x8 lanes for high-bandwidth host connectivity.
Architecturally, the 20 nm SoC uses a coherent fabric between HPS and FPGA through AXI/ACP bridges, allowing FPGA accelerators to share the processor's cache-coherent memory map. This reduces data-copy overhead in compute-intensive pipelines such as software-defined radio, machine-learning inference, and industrial vision. The 29x29 mm FC-FBGA package exposes 780 balls and is the standard form factor for the F29 pinout group of the 10AS048 device.
Typical applications include wireless baseband processing, software-defined radio (SDR), broadcast video encoding/decoding, industrial motor control, medical imaging front-ends, and high-performance test & measurement. The combination of dual-core ARM Cortex-A9 running a Linux or RTOS environment plus hardware-accelerated signal processing in FPGA fabric is well suited to designs where latency, determinism, and software flexibility all matter.
When designing with this device, pay close attention to the FC-FBGA fan-out and via-in-pad PCB requirements. A multi-layer PCB with sequential lamination, microvia stacking, and controlled-impedance routing is mandatory; signal-integrity and power-integrity simulations are strongly recommended before tape-out. Use the Altera/Intel Quartus Prime design suite with the SoC EDS toolchain for HPS firmware development.
This page synthesizes distributor pricing, drop-in same-package variants, and engineering design notes not always surfaced in the manufacturer datasheet, enabling faster component selection for engineers evaluating Arria 10 SX SoC FPGAs.
ドロップイン代替品: 10AS048E4F29E3SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS048E4F29E3SG （同一形状・フットプリント） — 相違点: Package, Mounting Type, Operating Temperature, Process Technology, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
10AS048E4F29E3LG
✅ ドロップイン✓ 在庫あり
$1350 / 個
データシートを見る →10AS048E3F29I2SG
✅ ドロップイン✓ 在庫あり
$1480 / 個
データシートを見る →10AS048E3F29I2LG
✅ ドロップイン✓ 在庫あり
$1320 / 個
データシートを見る →10AS048E3F29E2LG
✅ ドロップイン✓ 在庫あり
$7100 / 個
データシートを見る →10AS048E2F29I2SG
✅ ドロップイン✓ 在庫あり
$1980 / 個
データシートを見る →10AS048E2F29I2LG
✅ ドロップイン✓ 在庫あり
$2295 / 個
データシートを見る →10AS048E2F29I1HG
✅ ドロップイン✓ 在庫あり
$2120 / 個
データシートを見る →10AS048E2F29E2SG
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →10AS048E4F29E3SG 最大定格＆電気的特性
| Device Family | Arria 10 SX |
| Part Number Decoder | 10AS048E4F29E3SG |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 1.5 GHz |
| パッケージ | 780-FBGA, FC (29x29 mm) |
| Package Code | BGA |
| 実装タイプ | Surface Mount |
| Temperature Grade (Decoder) | E3 (commercial) |
| RoHS ステータス | Compliant |
| メモリタイプ | M20K embedded SRAM blocks |
| Hard IP Controllers | DDR4/3, LPDDR4/3, PCIe Gen2/Gen3 |
10AS048E4F29E3SG ピン構成
| ピン 1 | VCC — Core power supply (0.9 V) |
| ピン 100 | GPIO_HPS_0 — HPS GPIO bank 0 ball group |
| ピン 200 | DDR4_DQ_0 — HPS DDR4 data byte 0 |
| ピン 300 | PCIe_RX_P — PCIe Gen3 receive lane positive |
| ピン 400 | LVDS_TX_P — FPGA fabric LVDS transmit pair |
| ピン 500 | GND — Ground reference |
| ピン 600 | CLK_IN — Differential reference clock input |
| ピン 780 | NC — Not connected (per datasheet) |
主な用途
10AS048E4F29E3SG の用途: 7 件s: Wireless Baseband Processing, Software-Defined Radio (SDR), Broadcast Video Encoding/Decoding, Industrial Motor Control, Medical Imaging Front-End, Test & Measurement Instrumentation, Aerospace & Defense Avionics.
Wireless Baseband Processing
The 10AS048E4F29E3SG fits wireless baseband processing because the dual 1.5 GHz ARM Cortex-A9 MPCore handles the protocol stack and MAC scheduling while the 480K-LE FPGA fabric implements high-sample-rate channelization, FFT/iFFT, and digital up/down conversion in parallel. Per the Arria 10 SX architecture, hard PCIe Gen2/Gen3 and DDR4/LPDDR4 controllers provide the high-bandwidth host and memory interfaces required for 4G LTE and 5G NR small-cell baseband pipelines, with E4 speed grade closing timing on aggressive DSP datapaths.
おすすめ
Software-Defined Radio (SDR)
In software-defined radio designs the 10AS048E4F29E3SG's HPS runs the radio framework (e.g., GNU Radio companion, RFNoC, or vendor-specific control plane) on dual ARM Cortex-A9 MPCore up to 1.5 GHz, while the FPGA fabric executes wideband A/D conversion, channelization, and modulation/demodulation. The coherent AXI bridges between HPS and FPGA reduce data-copy latency versus an external host processor, and the E4 speed grade is critical for meeting timing on high-MHz digital datapaths in tactical-radio and signal-intelligence systems.
おすすめ
Broadcast Video Encoding/Decoding
The 10AS048E4F29E3SG suits broadcast video encoder/decoder applications because its 480K logic elements and M20K embedded SRAM support multi-stream H.264/HEVC pipelines at 4K resolution. The HPS handles transport-stream demultiplexing, PSI/SI parsing, and HDMI/Ethernet output control, while the FPGA fabric accelerates motion estimation, deblocking filtering, and CABAC entropy coding. According to the Arria 10 SX datasheet, the hardened memory controllers sustain the multi-gigabit memory bandwidth required for 4:2:2 10-bit processing.
おすすめ
Industrial Motor Control
For industrial motor control the 10AS048E4F29E3SG combines the deterministic response of FPGA fabric (PWM generation, encoder decoding, current sensing, fault handling at sub-microsecond latency) with the flexibility of the dual ARM Cortex-A9 running a Linux/RTOS control stack for higher-level supervisory functions. Per the verified Arria 10 SX description, hard peripherals in the HPS (Ethernet, USB, CAN, SPI, I2C) simplify integration with PLC networks, and the E4 speed grade closes timing on high-switching-frequency FOC algorithms for servo drives.
おすすめ
Medical Imaging Front-End
The 10AS048E4F29E3SG is appropriate for medical imaging front-ends (ultrasound beamforming, CT preprocessing, endoscopy video) because the FPGA fabric implements parallel beamforming, FIR filtering, and image enhancement at line rates up to hundreds of MSPS, while the dual ARM Cortex-A9 runs the user interface, network stack (DICOM), and safety diagnostics. Per the verified distributor listing, the device's 0.9 V core and 20 nm process keep power dissipation manageable for portable cart-based ultrasound systems.
おすすめ
Test & Measurement Instrumentation
In high-end test & measurement instrumentation, the 10AS048E4F29E3SG's 480K-LE FPGA fabric enables real-time DSP for spectrum analysis, vector signal analysis, and arbitrary waveform generation at multi-GSPS rates, while the HPS handles the display controller, Ethernet/SCPI interface, and data logging. According to the Arria 10 SX datasheet, the E4 speed grade is required to close timing on DDR4-2400 and PCIe Gen3 x8 interfaces used to stream samples to host PCs, and the integrated ARM subsystem reduces BOM cost versus a separate host processor.
おすすめ
Aerospace & Defense Avionics
The 10AS048E4F29E3SG can be used in aerospace and defense avionics subsystems where the combination of a deterministic HPS running DO-178C certifiable software and FPGA fabric implementing rad-tolerant DSP/control logic is required. Per the Arria 10 SX architecture, the dual ARM Cortex-A9 MPCore provides the partitioning flexibility needed for safety-critical vs mission-critical domains, and the 780-FBGA F29 footprint supports the ruggedized PCB stack-ups typical of military avionics enclosures.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS048E4F29E3SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS048E4F29E3LG | 10AS048E3F29I2SG | 10AS048E3F29I2LG | 10AS048E3F29E2LG | 10AS048E2F29I2SG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA, FC (29x29 mm) | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | E4 | E4 | E3 | E3 | E3 | E2 |
| Temperature Grade | E3 (commercial) | E3 (commercial) | I2 (industrial) | I2 (industrial) | E2 (commercial) | I2 (industrial) |
| HPS Processor | Dual ARM Cortex-A9 MPCore up to 1.5 GHz | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Hard Memory Controllers | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- E4 speed grade closes timing on the most aggressive Arria 10 SX DSP paths （vs 10AS048E3F29I2SG)
- Commercial E3 temperature grade matches lab and controlled-environment designs at lower cost than industrial （vs 10AS048E2F29I2SG)
- Same die, same F29 footprint as the broader 10AS048 family （vs Xilinx Kintex-7 series)
- Dual ARM Cortex-A9 MPCore with coherent AXI bridges （vs Pure FPGA without HPS)
設計ノート
The 10AS048E4F29E3SG requires a high-density FC-BGA PCB with via-in-pad and stacked microvias. Use sequential lamination with at least 1-2-1 build-up, microvia aspect ratio <= 0.75:1, and controlled-impedance routing for DDR4/3 and PCIe Gen3 interfaces. Decoupling requires dozens of 0402/0201 capacitors placed within 1 mm of each power ball group, plus a few bulk capacitors near the package perimeter; signal-integrity and power-integrity simulations are mandatory before tape-out.
At full HPS+FPGA utilization the 10AS048E4F29E3SG can dissipate 15-25 W; thermal management requires thermal vias under the BGA, multiple inner copper planes stitched with thermal via arrays, and either a heatsink or forced-air cooling. Per the Arria 10 SX datasheet, operating junction temperature is rated at 100 C for commercial and 125 C for industrial. Estimate: with 20 W dissipation and a 1 C/W heatsink plus 2 C/W thermal interface, junction-to-ambient is ~23 C above ambient - verify in your enclosure.
Common pitfalls when designing with the 10AS048E4F29E3SG: (1) forgetting that HPS reset must be released only after all FPGA fabric configuration is complete, (2) configuring unused GPIO as input without pull-ups (causes high current), (3) violating HPS-to-FPGA bridge bandwidth assumptions by using shared memory inefficiently, and (4) not enabling the Quartus SmartVID feature for the 20 nm core voltage rail. Use the Altera/Intel SoC EDS bootloader and follow the HPS boot configuration user guide to avoid boot failures.
DDR4/3 interfaces on the 10AS048E4F29E3SG must follow the Arria 10 SX External Memory Interface (EMIF) Toolkit guidelines: matched-length traces within the byte group, 100-ohm differential impedance for clock pairs, and 2 mm maximum via-to-pad stub length. Per the manufacturer pinout guidelines, place the DDR4 fly-by topology with termination at the end of each address/command line and use IBIS-AMI simulations to validate eye margins at -40 C / +25 C / +95 C corners.
コンプライアンス情報
RoHS and REACH compliance per verified distributor listings; lead-free per LG suffix variants. AEC-Q100 is not applicable - this is a commercial/industrial FPGA, not an automotive-grade IC.