10AX115S1F45E1SG - Arria 10 GX 1150K LE FPGA | Intel | 1932-BGA
部品番号: 10AX115S1F45E1SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7250 | $7,250.00 |
| 10 | $6800 | $68,000.00 |
| 100 | $6450 | $645,000.00 |
| 500 | $6100 | $3,050,000.00 |
| 1,000 | $5850 | $5,850,000.00 |
10AX115S1F45E1SG 概要
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, configurable interconnect, and dedicated hard IP blocks. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital logic ICs -> semiconductors, sitting between ASICs (Application-Specific Integrated Circuits, which offer higher density/perf at higher NRE) and microcontrollers (which execute sequential code rather than implement parallel hardware). The Arria 10 family is Intel's mid-range 20 nm FPGA line optimized for high-throughput transceiver, DSP, and partial-reconfiguration applications.
The 10AX115S1F45E1SG variant delivers 1,150,000 logic elements (LEs), approximately 53 Mbits of M20K embedded SRAM, 624 general-purpose I/O pins, and integrated 12.5 Gbps transceivers along with hard PCI Express Gen3 and DDR4 memory controller IP blocks. The device operates from a 0.9 V core supply with on-chip voltage regulation, supports up to 2 GB of DDR4 SDRAM through hardened memory controllers, and integrates hardened floating-point DSP blocks capable of up to 1.5 TFLOPS. The F45 package designation indicates a 45 mm FCBGA with 1932 balls in a 1.0 mm pitch.
The Arria 10 GX architecture combines a 20 nm TSMC process, an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, variable-precision DSP blocks, and a hardened partial reconfiguration controller. This combination enables hardware-accelerated signal processing at lower power per operation than previous-generation 28 nm FPGAs, with typical designs achieving 30-50% lower dynamic power at equivalent throughput.
Typical applications include high-performance digital signal processing (radar, software-defined radio, beamforming), 100G/400G Ethernet packet processing, video broadcast and 8K display processing, ASIC prototyping, and PCIe Gen3 accelerator cards. The integrated 12.5 Gbps transceivers and hardened PCI Express Gen3 hard IP make the 10AX115S1F45E1SG particularly well-suited for applications requiring high-bandwidth serial I/O without consuming soft logic resources.
When designing with this FPGA, ensure the PCB has a 1.0 mm pitch BGA land pattern with adequate breakout routing for the 1932 balls, and provision multiple low-noise power rails (0.9 V core, 1.8 V/2.5 V/3.3 V auxiliary). Use Intel Quartus Prime for synthesis and place-and-route; the device is supported by Quartus 16.0 and later. Designers should also budget for thermal management: at typical workloads, the F45 package can dissipate 25-40 W requiring forced-air cooling.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives, application notes, and PCB design considerations that go beyond the manufacturer datasheet summary.
ドロップイン代替品: 10AX115S1F45E1SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX115S1F45E1SG （同一形状・フットプリント） — 相違点: Package, Speed Grade, Embedded Memory, Transceivers, Family.
クイック比較ツール — 並列比較する代替部品を選択:
10AX115S2F45E1SG
✅ ドロップイン✓ 在庫あり
$5650 / 個
データシートを見る →10AX115S3F45E1SG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AX115S1F45E2SG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AX115S1F45E1HG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AX115S1F45E2LG
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10AX115S1F45I1SG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →10AX115S1F45E1SG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 |
| Embedded Memory | 68,857,856 bits (approximately 53 Mbits) |
| Embedded Memory Blocks | M20K blocks |
| User I/O Pins | 624 |
| Transceivers | Up to 12.5 Gbps (GX) |
| Hard IP | PCIe Gen3, DDR4 memory controllers |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V (with on-chip regulation) |
| パッケージ | 1932-BBGA, FCBGA (F45) 45 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | -1 (slower) |
| 動作温度 | -40C to +100C (industrial) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
10AX115S1F45E1SG 1932-bbga, fcbga (f45) 45 mm ピン配置ガイド
10AX115S1F45E1SG (1932-bbga, fcbga (f45) 45 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX115S1F45E1SG.
詳細は データシート をご参照ください。
主な用途
10AX115S1F45E1SG の用途: 6 件s: Software Defined Radio (SDR) and Wireless Baseband, PCIe Gen3 Accelerator Cards, Radar and Beamforming Signal Processing, 8K Video Broadcast and Image Processing, ASIC Prototyping and Emulation, Industrial Test and Measurement Equipment.
Software Defined Radio (SDR) and Wireless Baseband
The 10AX115S1F45E1SG's 1,150,000 LEs, variable-precision DSP blocks, and integrated 12.5 Gbps transceivers make it an excellent platform for software-defined radio baseband processing. Its hardened DDR4 controllers directly interface with external memory for buffering high-throughput ADC samples, while the FPGA fabric implements FFTs, channelizers, and digital up/down converters. Typical SDR designs achieve 30-50% lower power than 28 nm FPGAs at equivalent throughput.
おすすめ
PCIe Gen3 Accelerator Cards
The 10AX115S1F45E1SG integrates a hardened PCI Express Gen3 x8 (or x4) controller block, eliminating soft-logic overhead and freeing fabric resources for the actual acceleration workload. With 53 Mbits of on-chip M20K memory and DSP blocks rated at up to 1.5 TFLOPS, the device can host machine-learning inference engines, database query accelerators, or network function offloads. The F45 1932-ball FCBGA provides signal-integrity margin for PCIe Gen3 at 8 GT/s.
おすすめ
Radar and Beamforming Signal Processing
Radar and active electronically scanned array (AESA) beamforming systems require massive parallel DSP throughput, low-latency sample buffering, and synchronized multi-channel transceiver I/O - exactly the 10AX115S1F45E1SG's strengths. The device's 624 user I/O supports hundreds of synchronized ADC/DAC data lanes, while M20K memory blocks serve as fast corner-turn buffers. Arria 10's hardened floating-point DSP blocks reduce beamforming latency by up to 40% compared to soft implementations.
おすすめ
8K Video Broadcast and Image Processing
The 10AX115S1F45E1SG supports 8K video processing pipelines at 60 fps through a combination of high logic density, DDR4 memory bandwidth (hundreds of Gbps via hardened controllers), and 12.5 Gbps transceivers for SDI, DisplayPort, or HDMI 2.1 I/O. Broadcast applications including video walls, real-time color grading, and multi-stream transcoding benefit from the Arria 10 GX architecture's parallel pixel processing and on-chip frame buffering.
おすすめ
ASIC Prototyping and Emulation
The 1,150,000 LEs of the 10AX115S1F45E1SG can be partitioned with multi-FPGA partitioning tools to emulate ASIC RTL at near-real-time speeds. The F45 1932-ball FCBGA provides ample I/O for high-pin-count ASIC prototyping, and hardened DDR4 controllers simplify bring-up. For larger ASIC designs, multiple 10AX115 devices can be chained through their 12.5 Gbps transceivers to build scalable emulation farms.
おすすめ
Industrial Test and Measurement Equipment
The 10AX115S1F45E1SG's industrial temperature rating (-40C to +100C) and integrated transceivers suit it for high-end oscilloscopes, protocol analyzers, and automated test equipment. Designers can implement custom triggering, deep memory acquisition, and real-time signal analysis in the FPGA fabric, while the hardened PCIe Gen3 interface streams processed data to a host CPU. The F45 package's flip-chip thermal performance supports continuous high-utilization workloads.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX115S1F45E1SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX115S2F45E1SG | 10AX115S3F45E1SG | 10AX115S1F45E2SG | 10AX115S1F45E1HG | 10AX115S1F45I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-BBGA FCBGA (F45) | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (approx 53 Mbits) | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | -1 | -2 (faster) | -3 (fastest) | -1 | -1 | -1 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Process / Lead-Free | 20 nm, lead-free | 20 nm, lead-free | 20 nm, lead-free | 20 nm, lead-free | 20 nm, halogen-free lead-free | 20 nm, lead-free |
| Unit Price (qty 1) | USD 7,250 | USD 8,100 (est) | USD 9,500 (est) | USD 6,950 (est) | USD 7,300 (est) | USD 7,250 (est) |
主な差別化要因
- Higher Fmax in same footprint enables higher-throughput designs without PCB redesign （vs 10AX115S2F45E1SG)
- Industrial temperature rating for harsh-environment deployments （vs 10AX115S1F45E2SG)
- Halogen-free lead-free process option for environmental compliance （vs 10AX115S1F45E1HG)
設計ノート
The 1932-ball FCBGA at 1.0 mm pitch requires high-density PCB fabrication: 8-12 layer stack-up with microvia (laser-drilled) and stacked-via structures is the standard implementation. Use a 1-oz copper inner layer with 0.5-oz outer copper for the breakout fan-out; via-in-pad is recommended under the BGA to escape the dense 1.0 mm pitch. Recommended PCB material is mid-loss (Df 0.012-0.020) FR-4 or low-loss (Df 0.005-0.010) for designs using the 12.5 Gbps transceivers.
The 10AX115S1F45E1SG requires multiple supply rails: 0.9 V core (typically 20-40 A under load), 1.8 V PLL analog, 2.5 V/3.3 V auxiliary, and transceiver supplies. Use Intel's SmartVID or fixed-voltage mode depending on the design's power targets. Decoupling: place 0402 or 0201 ceramic capacitors on every power pin within 100 mils of the via, totaling 200-400 decoupling capacitors across the BGA footprint. Estimate: a fully-utilized 10AX115S1F45E1SG with 80% logic utilization and active transceivers can draw 30-45 W total - budget for a 60 W VRM solution.
Estimated: at typical 30 W dissipation with the FCBGA F45 package, junction-to-ambient thermal resistance (theta_JA) with 400 LFM forced air is approximately 1.0-1.5 C/W, yielding a 30-45 C temperature rise above ambient. A heatsink with thermal interface material (TIM) is required for sustained operation - bare FCBGA without a heatsink can exceed 100 C junction at typical workloads. Add a thermal pad cutout in the PCB's top solder mask to expose the package's thermal pad for direct heatsink contact.
Do not confuse 'E1' / 'E2' / 'E3' temperature codes with 'I1' / 'I2' / 'I3' codes - E indicates industrial temperature grade while I indicates extended (similar range) but with different Intel internal screening. When migrating to a higher speed grade (-2 or -3), verify that Quartus Prime timing models exist for your specific OPN; not all Arria 10 OPNs are supported in all Quartus versions. Use the Quartus 'Convert Programming File' tool to migrate SOF/POF files between speed grades rather than re-synthesizing from scratch.
コンプライアンス情報
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status varies by suffix (HG = halogen-free lead-free; SG = standard lead-free, halogen status unknown).
