10AX115S1F45E1SG - Arria 10 GX 1150K LE FPGA | Intel | 1932-BGA
MPN: 10AX115S1F45E1SG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7250 | $7,250.00 |
| 10 | $6800 | $68,000.00 |
| 100 | $6450 | $645,000.00 |
| 500 | $6100 | $3,050,000.00 |
| 1,000 | $5850 | $5,850,000.00 |
Drop-in alternatives for 10AX115S1F45E1SG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115S2F45E1SG
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$5650 / Unit
View Datasheet β10AX115S3F45E1SG
β Drop-Inπ Reference alternative (not in catalog)
10AX115S1F45E2SG
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10AX115S1F45E1HG
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10AX115S1F45E2LG
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10AX115S1F45I1SG
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View Datasheet β10AX115S1F45E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 |
| Embedded Memory | 68,857,856 bits (approximately 53 Mbits) |
| Embedded Memory Blocks | M20K blocks |
| User I/O Pins | 624 |
| Transceivers | Up to 12.5 Gbps (GX) |
| Hard IP | PCIe Gen3, DDR4 memory controllers |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V (with on-chip regulation) |
| Package | 1932-BBGA, FCBGA (F45) 45 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | -1 (slower) |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX115S1F45E1SG 1932-bbga, fcbga (f45) 45 mm Pin Configuration Guide
Complete pinout information for 10AX115S1F45E1SG (1932-bbga, fcbga (f45) 45 mm package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115S1F45E1SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115S1F45E1SG is suitable for 6 applications: Software Defined Radio (SDR) and Wireless Baseband, PCIe Gen3 Accelerator Cards, Radar and Beamforming Signal Processing, 8K Video Broadcast and Image Processing, ASIC Prototyping and Emulation, Industrial Test and Measurement Equipment.
Software Defined Radio (SDR) and Wireless Baseband
The 10AX115S1F45E1SG's 1,150,000 LEs, variable-precision DSP blocks, and integrated 12.5 Gbps transceivers make it an excellent platform for software-defined radio baseband processing. Its hardened DDR4 controllers directly interface with external memory for buffering high-throughput ADC samples, while the FPGA fabric implements FFTs, channelizers, and digital up/down converters. Typical SDR designs achieve 30-50% lower power than 28 nm FPGAs at equivalent throughput.
Recommended
PCIe Gen3 Accelerator Cards
The 10AX115S1F45E1SG integrates a hardened PCI Express Gen3 x8 (or x4) controller block, eliminating soft-logic overhead and freeing fabric resources for the actual acceleration workload. With 53 Mbits of on-chip M20K memory and DSP blocks rated at up to 1.5 TFLOPS, the device can host machine-learning inference engines, database query accelerators, or network function offloads. The F45 1932-ball FCBGA provides signal-integrity margin for PCIe Gen3 at 8 GT/s.
Recommended
Radar and Beamforming Signal Processing
Radar and active electronically scanned array (AESA) beamforming systems require massive parallel DSP throughput, low-latency sample buffering, and synchronized multi-channel transceiver I/O - exactly the 10AX115S1F45E1SG's strengths. The device's 624 user I/O supports hundreds of synchronized ADC/DAC data lanes, while M20K memory blocks serve as fast corner-turn buffers. Arria 10's hardened floating-point DSP blocks reduce beamforming latency by up to 40% compared to soft implementations.
Recommended
8K Video Broadcast and Image Processing
The 10AX115S1F45E1SG supports 8K video processing pipelines at 60 fps through a combination of high logic density, DDR4 memory bandwidth (hundreds of Gbps via hardened controllers), and 12.5 Gbps transceivers for SDI, DisplayPort, or HDMI 2.1 I/O. Broadcast applications including video walls, real-time color grading, and multi-stream transcoding benefit from the Arria 10 GX architecture's parallel pixel processing and on-chip frame buffering.
Recommended
ASIC Prototyping and Emulation
The 1,150,000 LEs of the 10AX115S1F45E1SG can be partitioned with multi-FPGA partitioning tools to emulate ASIC RTL at near-real-time speeds. The F45 1932-ball FCBGA provides ample I/O for high-pin-count ASIC prototyping, and hardened DDR4 controllers simplify bring-up. For larger ASIC designs, multiple 10AX115 devices can be chained through their 12.5 Gbps transceivers to build scalable emulation farms.
Recommended
Industrial Test and Measurement Equipment
The 10AX115S1F45E1SG's industrial temperature rating (-40C to +100C) and integrated transceivers suit it for high-end oscilloscopes, protocol analyzers, and automated test equipment. Designers can implement custom triggering, deep memory acquisition, and real-time signal analysis in the FPGA fabric, while the hardened PCIe Gen3 interface streams processed data to a host CPU. The F45 package's flip-chip thermal performance supports continuous high-utilization workloads.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115S1F45E1SG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115S2F45E1SG | 10AX115S3F45E1SG | 10AX115S1F45E2SG | 10AX115S1F45E1HG | 10AX115S1F45I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-BBGA FCBGA (F45) | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (approx 53 Mbits) | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | -1 | -2 (faster) | -3 (fastest) | -1 | -1 | -1 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Process / Lead-Free | 20 nm, lead-free | 20 nm, lead-free | 20 nm, lead-free | 20 nm, lead-free | 20 nm, halogen-free lead-free | 20 nm, lead-free |
| Unit Price (qty 1) | USD 7,250 | USD 8,100 (est) | USD 9,500 (est) | USD 6,950 (est) | USD 7,300 (est) | USD 7,250 (est) |
Key Differentiators
- Higher Fmax in same footprint enables higher-throughput designs without PCB redesign (vs 10AX115S2F45E1SG)
- Industrial temperature rating for harsh-environment deployments (vs 10AX115S1F45E2SG)
- Halogen-free lead-free process option for environmental compliance (vs 10AX115S1F45E1HG)
Design Notes
The 1932-ball FCBGA at 1.0 mm pitch requires high-density PCB fabrication: 8-12 layer stack-up with microvia (laser-drilled) and stacked-via structures is the standard implementation. Use a 1-oz copper inner layer with 0.5-oz outer copper for the breakout fan-out; via-in-pad is recommended under the BGA to escape the dense 1.0 mm pitch. Recommended PCB material is mid-loss (Df 0.012-0.020) FR-4 or low-loss (Df 0.005-0.010) for designs using the 12.5 Gbps transceivers.
The 10AX115S1F45E1SG requires multiple supply rails: 0.9 V core (typically 20-40 A under load), 1.8 V PLL analog, 2.5 V/3.3 V auxiliary, and transceiver supplies. Use Intel's SmartVID or fixed-voltage mode depending on the design's power targets. Decoupling: place 0402 or 0201 ceramic capacitors on every power pin within 100 mils of the via, totaling 200-400 decoupling capacitors across the BGA footprint. Estimate: a fully-utilized 10AX115S1F45E1SG with 80% logic utilization and active transceivers can draw 30-45 W total - budget for a 60 W VRM solution.
Estimated: at typical 30 W dissipation with the FCBGA F45 package, junction-to-ambient thermal resistance (theta_JA) with 400 LFM forced air is approximately 1.0-1.5 C/W, yielding a 30-45 C temperature rise above ambient. A heatsink with thermal interface material (TIM) is required for sustained operation - bare FCBGA without a heatsink can exceed 100 C junction at typical workloads. Add a thermal pad cutout in the PCB's top solder mask to expose the package's thermal pad for direct heatsink contact.
Do not confuse 'E1' / 'E2' / 'E3' temperature codes with 'I1' / 'I2' / 'I3' codes - E indicates industrial temperature grade while I indicates extended (similar range) but with different Intel internal screening. When migrating to a higher speed grade (-2 or -3), verify that Quartus Prime timing models exist for your specific OPN; not all Arria 10 OPNs are supported in all Quartus versions. Use the Quartus 'Convert Programming File' tool to migrate SOF/POF files between speed grades rather than re-synthesizing from scratch.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status varies by suffix (HG = halogen-free lead-free; SG = standard lead-free, halogen status unknown).
