10CL025ZU256I8G - Cyclone 10 LP FPGA, 25K LE, 256-UBGA | Intel
部品番号: 10CL025ZU256I8G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.57 | $28.57 |
| 10 | $25.69 | $256.90 |
| 100 | $21.8 | $2,180.00 |
| 500 | $17.9 | $8,950.00 |
| 1,000 | $14.95 | $14,950.00 |
10CL025ZU256I8G 概要
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected through programmable interconnect. FPGAs occupy a unique position in the digital IC hierarchy: more flexible than ASICs (no NRE cost, instant prototyping) but higher performance and lower power per logic operation than microcontrollers for parallel DSP, glue-logic, and high-throughput I/O aggregation tasks. The Cyclone 10 LP family specifically targets cost- and power-sensitive applications that still require the parallelism and reconfigurability of an FPGA, positioning it between CPLDs and high-end FPGAs such as Cyclone V, Arria, or Stratix in the Intel FPGA portfolio.
Key features of the 10CL025ZU256I8G include a low static power architecture optimized for energy-efficient designs, integrated hard IP blocks for PLLs and configuration logic, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and an embedded multiplier block (18x18) for DSP operations. The 256-pin UBGA package offers a compact 17 mm x 17 mm footprint while exposing up to 150 user I/Os, balancing pin density with manageable PCB routing complexity.
Typical applications span industrial motor control and human-machine interface (HMI) panels, video bridging and image processing front-ends, I/O expansion and protocol bridging for industrial PCs, low-cost ASIC prototyping, and portable instrumentation. The Cyclone 10 LP's combination of low static power, deterministic timing, and 150 I/Os makes it well-suited to systems that must aggregate multiple sensor or communication buses.
When designing with this part, note that configuration via an external flash (EPCS or compatible) is required for standalone operation and that JTAG chain planning must include the 256-pin BGA's TCK/TMS/TDO/TDI pins. Pin-compatible migration paths within the Cyclone 10 LP family allow up- or down-sizing logic capacity without PCB rework.
This page synthesizes distributor stock and pricing, same-brand drop-in alternatives, and design considerations that go beyond the manufacturer datasheet summary.
ドロップイン代替品: 10CL025ZU256I8G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10CL025ZU256I8G （同一形状・フットプリント） — 相違点: Package, Process Technology, Speed Grade, Logic Elements (LE), Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
10CL016ZU256I8G
✅ ドロップイン✓ 在庫あり
$14.76 / 個
データシートを見る →10CL010ZU256I8G
✅ ドロップイン✓ 在庫あり
$22.1 / 個
データシートを見る →10CL025YU256I7G
✅ ドロップイン✓ 在庫あり
$44.5 / 個
データシートを見る →10CL025YU256C8G
✅ ドロップイン✓ 在庫あり
$32.54 / 個
データシートを見る →10CL016ZU484I8G
✅ ドロップイン✓ 在庫あり
$14.1 / 個
データシートを見る →10CL025ZU256I8G 最大定格＆電気的特性
| Family | Cyclone 10 LP |
| Series | 10CL025 |
| Logic Elements (LE) | 24,624 |
| Embedded Memory Bits | 608,256 bits |
| Maximum User I/O | 150 |
| Embedded Multipliers (18x18) | 66 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.0 V (typical) / 1.2 V (transceiver supply not present on LP) |
| Process Technology | TSMC 60 nm low-power |
| パッケージ | 256-pin UBGA (Ultra FineLine BGA) |
| Package Dimensions | 17 mm x 17 mm |
| 動作温度 | -40C to +100C (industrial, I8G) |
| 実装タイプ | Surface Mount (BGA) |
| Speed Grade | 8 (I8G - industrial, speed grade 8) |
| Configuration Scheme | Active serial (EPCS) / JTAG |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
10CL025ZU256I8G 17 mm x 17 mm ピン配置ガイド
10CL025ZU256I8G (17 mm x 17 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10CL025ZU256I8G.
詳細は データシート をご参照ください。
主な用途
10CL025ZU256I8G の用途: 6 件s: Industrial Motor Control, Human-Machine Interface (HMI) Panels, Video Bridging and Image Sensor Aggregation, I/O Expansion and Protocol Bridging, ASIC Prototyping and Pre-Silicon Validation, Portable Test and Measurement Instrumentation.
Industrial Motor Control
The 10CL025ZU256I8G fits industrial motor control designs where deterministic multi-axis PWM generation, encoder feedback capture, and fieldbus protocol bridging (EtherCAT, CANopen, Modbus) must coexist on a single low-power chip. Its 24,624 logic elements plus 66 embedded 18x18 multipliers handle simultaneous current-loop calculations on multiple axes at 32 kHz PWM rates, while the 4 PLLs provide independent clock domains for the fieldbus PHY, encoder interface, and ADC sampling clock. The -40C to +100C industrial temperature grade matches IEC 60068-2-1/2 cabinet environments without derating. Power consumption is a meaningful design consideration: the Cyclone 10 LP low-power architecture typically draws 0.5-1.5 W static at full I/O utilization, making the part suitable for closed-loop drives where heatsinking space is constrained.
おすすめ
Human-Machine Interface (HMI) Panels
The 10CL025ZU256I8G is well-matched to HMI panels that aggregate a TFT LCD controller, capacitive touch I2C bridge, RS-485/Modbus master, GPIO key matrix, and backlight PWM into one programmable platform. Its 150 user I/Os in the 256-UBGA package comfortably absorb a 24-bit RGB parallel LCD interface plus touch controller interrupt, buzzer, status LEDs, and an Ethernet RMII PHY data bus. The 608 Kbits of M9K memory buffer double-buffered video frames at common 800x480 WVGA resolutions. The Cyclone 10 LP low static power profile keeps panel idle (backlight off) current below typical ENERGY STAR limits, while the industrial temperature grade tolerates sealed-enclosure heat rise near the backlight driver.
おすすめ
Video Bridging and Image Sensor Aggregation
The 10CL025ZU256I8G handles parallel image sensor aggregation where two MIPI-style CSI-2 sensors or one parallel CMOS sensor must be merged into a USB3 Vision or GigE Vision uplink. The 66 embedded 18x18 multipliers perform real-time lens distortion correction (LDC) and demosaicing at VGA to 720p resolutions, while the 4 PLLs synthesize pixel clocks, MIPI byte clocks, and USB reference clocks independently. The 150 I/Os in the 256-UBGA support 10-bit parallel sensor data buses plus I2C, SPI, and GPIO control channels. Industrial -40C to +100C operation enables outdoor machine-vision camera installations. Power budget: typical active power is 1-2 W, so thermal management at sealed enclosures is essential.
おすすめ
I/O Expansion and Protocol Bridging
The 10CL025ZU256I8G is a strong choice for industrial PCs and SBCs that need additional GPIO, UART, SPI, I2C, and PWM channels beyond what the host processor exposes natively. The 24,624 LEs easily implement soft IP cores for UART, SPI, I2C, and PWM bridges, while the 150 I/Os aggregate 4-8 serial channels and dozens of GPIO. The 4 PLLs generate independent baud-rate clocks for multiple UART domains. Industrial temperature operation matches factory-floor SBC chassis. Power draw is low enough to power the part from the host's standby rail, enabling wake-on-UART and similar low-power features.
おすすめ
ASIC Prototyping and Pre-Silicon Validation
Engineers prototyping ASIC RTL before tape-out often target the 10CL025ZU256I8G because 24,624 LEs plus 66 multipliers and 4 PLLs in a 256-UBGA package match mid-complexity ASIC blocks (custom DMA engines, signal-processing pipelines, encryption accelerators). The Intel Quartus Prime toolchain supports SystemVerilog and VHDL synthesis, and the Cyclone 10 LP's deterministic timing closure accelerates iteration cycles. The 256-UBGA exposes enough I/Os for FPGA-to-ASIC co-simulation breakout headers. Industrial temperature rating lets prototype boards serve in real-environment validation. Caveat: check that target ASIC block fits within the part's M9K memory bandwidth and PLL count before committing.
おすすめ
Portable Test and Measurement Instrumentation
The 10CL025ZU256I8G serves portable oscilloscopes, logic analyzers, and protocol analyzers where 24K LEs implement trigger engines, decoders (I2C, SPI, UART, CAN, LIN, USB), and small TFT-driven UIs on a single low-power device. Its 66 embedded 18x18 multipliers enable on-FPGA FFT, FIR filtering, and statistical calculations, while the 4 PLLs synthesize sample clocks from a single reference oscillator. Battery-powered operation benefits from the Cyclone 10 LP low static power architecture. The 256-UBGA package offers 150 I/Os to expose buffered probe inputs (typically 4-16 analog channels plus 32+ digital channels). Industrial temperature grade supports lab-to-field portability.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10CL025ZU256I8G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10CL016ZU256I8G | 10CL010ZU256I8G | 10CL025YU256I7G | 10CL025YU256C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-UBGA (U256) | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same |
| Logic Elements (LE) | 24,624 | 15,408 (-37%) | 10,320 (-58%) | 24,624 (same) | 24,624 (same) |
| Embedded Memory (bits) | 608,256 | 504,288 (-17%) | 414,720 (-32%) | 608,256 (same) | 608,256 (same) |
| Temperature Grade | Industrial -40C to +100C (I8G) | Industrial -40C to +100C (I8G) | Industrial -40C to +100C (I8G) | Industrial -40C to +85C (I7G) | Commercial 0C to +85C (C8G) |
| Maximum User I/O | 150 | 150 (same) | 150 (same) | 150 (same) | 150 (same) |
| Embedded Multipliers (18x18) | 66 | 56 (-15%) | 24 (-64%) | 66 (same) | 66 (same) |
| PLLs | 4 | 4 (same) | 2 (-50%) | 4 (same) | 4 (same) |
主な差別化要因
- Highest LE density in 256-UBGA package within Cyclone 10 LP family （vs 10CL016ZU256I8G)
- Industrial temperature range up to +100C vs +85C for I7G （vs 10CL025YU256I7G)
- Lower LE count in same package enables BOM cost optimization （vs 10CL010ZU256I8G)
設計ノート
Estimated: at typical 1.0-1.2 W active power dissipation and a 256-UBGA thermal resistance theta_JA of approximately 15-20 C/W (with minimal PCB copper), junction temperature rise is roughly 15-24 C above ambient. For sealed enclosures without airflow, derate ambient by 15-20 C or add thermal vias under the BGA center array to spread heat to inner copper planes. The Cyclone 10 LP's low static power is an advantage here versus older Cyclone IV parts at the same LE count.
BGA escape routing for the 1.0 mm pitch 256-UBGA requires at least 4 PCB routing layers with microvia stacks (any-layer HDI process recommended). Use the Intel Cyclone 10 LP pin connection guidelines to identify JTAG, configuration, and reference-pin locations. Place decoupling capacitors on the bottom side directly under their respective BGA balls with via-in-pad or short traces. Add a ground pour under the entire BGA stitched with 4-8 thermal vias to the inner ground plane for return-path integrity at high-speed I/O.
Do not confuse 'I8G' (industrial, -40C to +100C, speed grade 8) with 'C8G' (commercial, 0C to +85C, speed grade 8) - they share the same family but differ in temperature range, and ordering the wrong one for an outdoor installation is a frequent sourcing error. Verify the configuration mode (AS, AP, PS, FPP) matches the EPCS flash type; mismatch causes a non-booting design that mimics a dead FPGA. Always include JTAG access on test points or headers even on production boards - field programming and factory test require it.
DDR3/LPDDR2 controller I/Os on the Cyclone 10 LP require matched-length traces within +/- 25 mils for the byte lanes and explicit write-leveling calibration during board bring-up. Use the Quartus Prime Fitter report to extract per-pin delay and adjust PCB trace lengths accordingly. For LVDS inputs above 500 Mbps, place 100-ohm differential termination resistors as close as possible to the FPGA receive pins and avoid vias in the differential pair path. SSO (simultaneously switching output) noise on large parallel buses may require adding more GND balls in the switching region.
コンプライアンス情報
RoHS and lead-free status confirmed by Intel Cyclone 10 LP product page. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified component unless explicitly marketed as such). Industrial temperature grade per the 'I' suffix in the part number.
