10CL025ZU256I8G - Cyclone 10 LP FPGA, 25K LE, 256-UBGA | Intel
부품 번호: 10CL025ZU256I8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.57 | $28.57 |
| 10 | $25.69 | $256.90 |
| 100 | $21.8 | $2,180.00 |
| 500 | $17.9 | $8,950.00 |
| 1,000 | $14.95 | $14,950.00 |
10CL025ZU256I8G 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected through programmable interconnect. FPGAs occupy a unique position in the digital IC hierarchy: more flexible than ASICs (no NRE cost, instant prototyping) but higher performance and lower power per logic operation than microcontrollers for parallel DSP, glue-logic, and high-throughput I/O aggregation tasks. The Cyclone 10 LP family specifically targets cost- and power-sensitive applications that still require the parallelism and reconfigurability of an FPGA, positioning it between CPLDs and high-end FPGAs such as Cyclone V, Arria, or Stratix in the Intel FPGA portfolio.
Key features of the 10CL025ZU256I8G include a low static power architecture optimized for energy-efficient designs, integrated hard IP blocks for PLLs and configuration logic, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and an embedded multiplier block (18x18) for DSP operations. The 256-pin UBGA package offers a compact 17 mm x 17 mm footprint while exposing up to 150 user I/Os, balancing pin density with manageable PCB routing complexity.
Typical applications span industrial motor control and human-machine interface (HMI) panels, video bridging and image processing front-ends, I/O expansion and protocol bridging for industrial PCs, low-cost ASIC prototyping, and portable instrumentation. The Cyclone 10 LP's combination of low static power, deterministic timing, and 150 I/Os makes it well-suited to systems that must aggregate multiple sensor or communication buses.
When designing with this part, note that configuration via an external flash (EPCS or compatible) is required for standalone operation and that JTAG chain planning must include the 256-pin BGA's TCK/TMS/TDO/TDI pins. Pin-compatible migration paths within the Cyclone 10 LP family allow up- or down-sizing logic capacity without PCB rework.
This page synthesizes distributor stock and pricing, same-brand drop-in alternatives, and design considerations that go beyond the manufacturer datasheet summary.
드롭인 대체품: 10CL025ZU256I8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL025ZU256I8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Logic Elements (LE), Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL016ZU256I8G
✅ 드롭인✓ 재고 있음
$14.76 / 개
데이터시트 보기 →10CL010ZU256I8G
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →10CL025YU256I7G
✅ 드롭인✓ 재고 있음
$44.5 / 개
데이터시트 보기 →10CL025YU256C8G
✅ 드롭인✓ 재고 있음
$32.54 / 개
데이터시트 보기 →10CL016ZU484I8G
✅ 드롭인✓ 재고 있음
$14.1 / 개
데이터시트 보기 →10CL025ZU256I8G 최대 정격 & 전기적 특성
| Family | Cyclone 10 LP |
| Series | 10CL025 |
| Logic Elements (LE) | 24,624 |
| Embedded Memory Bits | 608,256 bits |
| Maximum User I/O | 150 |
| Embedded Multipliers (18x18) | 66 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.0 V (typical) / 1.2 V (transceiver supply not present on LP) |
| Process Technology | TSMC 60 nm low-power |
| 패키지 | 256-pin UBGA (Ultra FineLine BGA) |
| Package Dimensions | 17 mm x 17 mm |
| 동작 온도 | -40C to +100C (industrial, I8G) |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | 8 (I8G - industrial, speed grade 8) |
| Configuration Scheme | Active serial (EPCS) / JTAG |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
10CL025ZU256I8G 17 mm x 17 mm 핀 구성 가이드
10CL025ZU256I8G(17 mm x 17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CL025ZU256I8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CL025ZU256I8G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Human-Machine Interface (HMI) Panels, Video Bridging and Image Sensor Aggregation, I/O Expansion and Protocol Bridging, ASIC Prototyping and Pre-Silicon Validation, Portable Test and Measurement Instrumentation.
Industrial Motor Control
The 10CL025ZU256I8G fits industrial motor control designs where deterministic multi-axis PWM generation, encoder feedback capture, and fieldbus protocol bridging (EtherCAT, CANopen, Modbus) must coexist on a single low-power chip. Its 24,624 logic elements plus 66 embedded 18x18 multipliers handle simultaneous current-loop calculations on multiple axes at 32 kHz PWM rates, while the 4 PLLs provide independent clock domains for the fieldbus PHY, encoder interface, and ADC sampling clock. The -40C to +100C industrial temperature grade matches IEC 60068-2-1/2 cabinet environments without derating. Power consumption is a meaningful design consideration: the Cyclone 10 LP low-power architecture typically draws 0.5-1.5 W static at full I/O utilization, making the part suitable for closed-loop drives where heatsinking space is constrained.
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Human-Machine Interface (HMI) Panels
The 10CL025ZU256I8G is well-matched to HMI panels that aggregate a TFT LCD controller, capacitive touch I2C bridge, RS-485/Modbus master, GPIO key matrix, and backlight PWM into one programmable platform. Its 150 user I/Os in the 256-UBGA package comfortably absorb a 24-bit RGB parallel LCD interface plus touch controller interrupt, buzzer, status LEDs, and an Ethernet RMII PHY data bus. The 608 Kbits of M9K memory buffer double-buffered video frames at common 800x480 WVGA resolutions. The Cyclone 10 LP low static power profile keeps panel idle (backlight off) current below typical ENERGY STAR limits, while the industrial temperature grade tolerates sealed-enclosure heat rise near the backlight driver.
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Video Bridging and Image Sensor Aggregation
The 10CL025ZU256I8G handles parallel image sensor aggregation where two MIPI-style CSI-2 sensors or one parallel CMOS sensor must be merged into a USB3 Vision or GigE Vision uplink. The 66 embedded 18x18 multipliers perform real-time lens distortion correction (LDC) and demosaicing at VGA to 720p resolutions, while the 4 PLLs synthesize pixel clocks, MIPI byte clocks, and USB reference clocks independently. The 150 I/Os in the 256-UBGA support 10-bit parallel sensor data buses plus I2C, SPI, and GPIO control channels. Industrial -40C to +100C operation enables outdoor machine-vision camera installations. Power budget: typical active power is 1-2 W, so thermal management at sealed enclosures is essential.
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I/O Expansion and Protocol Bridging
The 10CL025ZU256I8G is a strong choice for industrial PCs and SBCs that need additional GPIO, UART, SPI, I2C, and PWM channels beyond what the host processor exposes natively. The 24,624 LEs easily implement soft IP cores for UART, SPI, I2C, and PWM bridges, while the 150 I/Os aggregate 4-8 serial channels and dozens of GPIO. The 4 PLLs generate independent baud-rate clocks for multiple UART domains. Industrial temperature operation matches factory-floor SBC chassis. Power draw is low enough to power the part from the host's standby rail, enabling wake-on-UART and similar low-power features.
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ASIC Prototyping and Pre-Silicon Validation
Engineers prototyping ASIC RTL before tape-out often target the 10CL025ZU256I8G because 24,624 LEs plus 66 multipliers and 4 PLLs in a 256-UBGA package match mid-complexity ASIC blocks (custom DMA engines, signal-processing pipelines, encryption accelerators). The Intel Quartus Prime toolchain supports SystemVerilog and VHDL synthesis, and the Cyclone 10 LP's deterministic timing closure accelerates iteration cycles. The 256-UBGA exposes enough I/Os for FPGA-to-ASIC co-simulation breakout headers. Industrial temperature rating lets prototype boards serve in real-environment validation. Caveat: check that target ASIC block fits within the part's M9K memory bandwidth and PLL count before committing.
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Portable Test and Measurement Instrumentation
The 10CL025ZU256I8G serves portable oscilloscopes, logic analyzers, and protocol analyzers where 24K LEs implement trigger engines, decoders (I2C, SPI, UART, CAN, LIN, USB), and small TFT-driven UIs on a single low-power device. Its 66 embedded 18x18 multipliers enable on-FPGA FFT, FIR filtering, and statistical calculations, while the 4 PLLs synthesize sample clocks from a single reference oscillator. Battery-powered operation benefits from the Cyclone 10 LP low static power architecture. The 256-UBGA package offers 150 I/Os to expose buffered probe inputs (typically 4-16 analog channels plus 32+ digital channels). Industrial temperature grade supports lab-to-field portability.
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추천 제품 요약
엔지니어링 참조 데이터: 10CL025ZU256I8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL016ZU256I8G | 10CL010ZU256I8G | 10CL025YU256I7G | 10CL025YU256C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-UBGA (U256) | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same |
| Logic Elements (LE) | 24,624 | 15,408 (-37%) | 10,320 (-58%) | 24,624 (same) | 24,624 (same) |
| Embedded Memory (bits) | 608,256 | 504,288 (-17%) | 414,720 (-32%) | 608,256 (same) | 608,256 (same) |
| Temperature Grade | Industrial -40C to +100C (I8G) | Industrial -40C to +100C (I8G) | Industrial -40C to +100C (I8G) | Industrial -40C to +85C (I7G) | Commercial 0C to +85C (C8G) |
| Maximum User I/O | 150 | 150 (same) | 150 (same) | 150 (same) | 150 (same) |
| Embedded Multipliers (18x18) | 66 | 56 (-15%) | 24 (-64%) | 66 (same) | 66 (same) |
| PLLs | 4 | 4 (same) | 2 (-50%) | 4 (same) | 4 (same) |
주요 차별점
- Highest LE density in 256-UBGA package within Cyclone 10 LP family (vs 10CL016ZU256I8G)
- Industrial temperature range up to +100C vs +85C for I7G (vs 10CL025YU256I7G)
- Lower LE count in same package enables BOM cost optimization (vs 10CL010ZU256I8G)
설계 노트
Estimated: at typical 1.0-1.2 W active power dissipation and a 256-UBGA thermal resistance theta_JA of approximately 15-20 C/W (with minimal PCB copper), junction temperature rise is roughly 15-24 C above ambient. For sealed enclosures without airflow, derate ambient by 15-20 C or add thermal vias under the BGA center array to spread heat to inner copper planes. The Cyclone 10 LP's low static power is an advantage here versus older Cyclone IV parts at the same LE count.
BGA escape routing for the 1.0 mm pitch 256-UBGA requires at least 4 PCB routing layers with microvia stacks (any-layer HDI process recommended). Use the Intel Cyclone 10 LP pin connection guidelines to identify JTAG, configuration, and reference-pin locations. Place decoupling capacitors on the bottom side directly under their respective BGA balls with via-in-pad or short traces. Add a ground pour under the entire BGA stitched with 4-8 thermal vias to the inner ground plane for return-path integrity at high-speed I/O.
Do not confuse 'I8G' (industrial, -40C to +100C, speed grade 8) with 'C8G' (commercial, 0C to +85C, speed grade 8) - they share the same family but differ in temperature range, and ordering the wrong one for an outdoor installation is a frequent sourcing error. Verify the configuration mode (AS, AP, PS, FPP) matches the EPCS flash type; mismatch causes a non-booting design that mimics a dead FPGA. Always include JTAG access on test points or headers even on production boards - field programming and factory test require it.
DDR3/LPDDR2 controller I/Os on the Cyclone 10 LP require matched-length traces within +/- 25 mils for the byte lanes and explicit write-leveling calibration during board bring-up. Use the Quartus Prime Fitter report to extract per-pin delay and adjust PCB trace lengths accordingly. For LVDS inputs above 500 Mbps, place 100-ohm differential termination resistors as close as possible to the FPGA receive pins and avoid vias in the differential pair path. SSO (simultaneously switching output) noise on large parallel buses may require adding more GND balls in the switching region.
규정 준수 정보
RoHS and lead-free status confirmed by Intel Cyclone 10 LP product page. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified component unless explicitly marketed as such). Industrial temperature grade per the 'I' suffix in the part number.
