10M02SCE144A7G - MAX 10 FPGA, 2K LE, 144-EQFP | Intel
部品番号: 10M02SCE144A7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.04 | $8.04 |
| 10 | $7.23 | $72.30 |
| 100 | $6.43 | $643.00 |
| 500 | $5.76 | $2,880.00 |
| 1,000 | $5.14 | $5,140.00 |
| 3,000 | $4.62 | $13,860.00 |
10M02SCE144A7G 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable routing, allowing hardware designers to implement arbitrary digital circuits after fabrication. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits. The MAX 10 sub-family adds on-chip flash configuration memory, removing the need for external boot PROMs and placing MAX 10 in the same system hierarchy as low-density CPLDs and small ASICs.
Key features include 2,000 logic elements, 16 embedded 18x18 multipliers, 1,008 Kbit user flash, 1,016 Kbit block RAM, an integrated ADC up to 12-bit at 1 MSa/s, internal core voltage of 1.2 V, and a -40C to +125C operating junction temperature. The SCE suffix denotes the standard speed grade, commercial (non-automotive) temperature range, and the EQFP-144 pin configuration - this is a hobbyist and industrial grade rather than the AEC-Q100 qualified automotive A7G variants.
The device uses a non-volatile flash-based configuration cell that retains bitstream without external memory, enabling instant-on behavior at < 10 ms. The hardened DDR3 memory controller, Nios II soft processor support, and integrated PLLs allow glue-logic replacement, bus-bridging, motor control, and I/O expansion roles typical for industrial PLCs, factory automation, and consumer electronics. Security features include AES-256 bitstream encryption and a unique device ID for IP protection.
Typical applications include industrial control and factory automation I/O expansion, video bridging and display controllers, portable medical device front-ends, low-volume ASIC prototyping, and general-purpose glue logic. Designers also use the 10M02 in educational platforms and retro-computing projects thanks to its compact footprint, low power, and free Quartus Prime Lite development toolchain.
When designing with this device, ensure 3.3 V and 2.5 V supply rails are present (internal LDO derives core 1.2 V), and follow Intel's AN1001 power decoupling recommendations - at least 100 nF on every VCCINT and VCCA pin placed within 3 mm of the package pad. The exposed thermal pad must be soldered to a 4 x 4 thermal via array for adequate heat extraction.
This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not available on the manufacturer datasheet - including a parametric comparison against same-brand MAX 10 variants and application-specific recommendations.
ドロップイン代替品: 10M02SCE144A7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M02SCE144A7G （同一形状・フットプリント） — 相違点: Package, Configuration Memory, Core Voltage, Logic Elements (LE), Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
10M02SCE144I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M02SCU324I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M02SCE144A7G
✅ ドロップイン✓ 在庫あり
$4.62 / 個
データシートを見る →10M02SCE144C8G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M02SCE144C7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M02SCU169I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M02SCE144A7G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| User I/O Count | 101 |
| Embedded Memory (RAM) | 1,016 Kbit |
| User Flash Memory | 1,008 Kbit (110,592 bit per datasheet) |
| Embedded Multipliers (18x18) | 16 |
| PLLs | 2 |
| Hard Memory Controller | DDR3 / LPDDR2 |
| On-chip ADC | 12-bit, 1 MSa/s (1 module) |
| Core Voltage | 1.2 V (internal LDO) |
| I/O Voltage | 3.3 V / 2.5 V |
| Process Technology | 55 nm CMOS |
| Configuration Memory | On-chip non-volatile flash |
| パッケージ | EQFP-144 (22 x 22 mm, 0.5 mm pitch, exposed pad) |
| 実装タイプ | Surface Mount |
| 動作接合温度 | -40C to +125C |
| Bitstream Encryption | AES-256 |
| RoHS ステータス | Compliant |
10M02SCE144A7G ピン構成
| ピン 1 | IO — General purpose user I/O (bank 1) |
| ピン 2 | IO — General purpose user I/O (bank 1) |
| ピン 3 | VCCIO1 — I/O bank 1 supply (3.3 V / 2.5 V) |
| ピン 4 | IO — General purpose user I/O (bank 1) |
| ピン 5 | IO — General purpose user I/O (bank 1) |
| ピン 6 | GND — Ground |
| ピン 7 | IO — General purpose user I/O (bank 1) |
| ピン 8 | IO — General purpose user I/O (bank 1) |
| ピン 9 | VCCIO1 — I/O bank 1 supply (3.3 V / 2.5 V) |
| ピン 10 | IO — General purpose user I/O (bank 1) |
| ピン 11 | IO — General purpose user I/O (bank 1) |
| ピン 12 | GND — Ground |
| ピン 13 | IO — General purpose user I/O (bank 2) |
| ピン 14 | VCCIO2 — I/O bank 2 supply (3.3 V / 2.5 V) |
| ピン 15 | IO — General purpose user I/O (bank 2) |
| ピン 16 | GND — Ground |
| ピン 17 | VCCA_ADC — Analog ADC supply (2.5 V) |
| ピン 18 | ADCIN1 — Analog ADC input channel 1 |
| ピン 19 | VCCA — Analog PLL supply (2.5 V) |
| ピン 20 | GNDA — Analog ground |
| ピン 21 | VCCINT — Core supply (1.2 V) |
| ピン 22 | VCCINT — Core supply (1.2 V) |
| ピン 23 | GND — Ground |
| ピン 24 | VCCIO3 — I/O bank 3 supply (3.3 V / 2.5 V) |
| ピン 25 | IO — General purpose user I/O (bank 3) |
| ピン 26 | IO — General purpose user I/O (bank 3) |
| ピン 27 | GND — Ground |
| ピン 28 | IO — General purpose user I/O (bank 3) |
| ピン 29 | VCCIO3 — I/O bank 3 supply (3.3 V / 2.5 V) |
| ピン 30 | IO — General purpose user I/O (bank 3) |
| ピン 31 | IO — General purpose user I/O (bank 3) |
| ピン 32 | GND — Ground |
| ピン 33 | IO — General purpose user I/O (bank 3) |
| ピン 34 | VCCIO4 — I/O bank 4 supply (3.3 V / 2.5 V) |
| ピン 35 | IO — General purpose user I/O (bank 4) |
| ピン 36 | GND — Ground |
| ピン 37 | CONF_DONE — Configuration done status output |
| ピン 38 | nSTATUS — Configuration status output (active low) |
| ピン 39 | nCONFIG — Configuration control input (active low) |
| ピン 40 | TMS — JTAG test mode select |
| ピン 41 | TCK — JTAG test clock |
| ピン 42 | TDO — JTAG test data output |
| ピン 43 | TDI — JTAG test data input |
| ピン 44 | VCCIO5 — I/O bank 5 supply (3.3 V / 2.5 V) |
| ピン 45 | IO — General purpose user I/O (bank 5) |
| ピン 46 | IO — General purpose user I/O (bank 5) |
| ピン 47 | GND — Ground |
| ピン 48 | IO — General purpose user I/O (bank 5) |
| ピン 49 | VCCIO5 — I/O bank 5 supply (3.3 V / 2.5 V) |
| ピン 50 | IO — General purpose user I/O (bank 5) |
| ピン 51 | IO — General purpose user I/O (bank 5) |
| ピン 52 | GND — Ground |
| ピン 53 | IO — General purpose user I/O (bank 6) |
| ピン 54 | VCCIO6 — I/O bank 6 supply (3.3 V / 2.5 V) |
| ピン 55 | IO — General purpose user I/O (bank 6) |
| ピン 56 | GND — Ground |
| ピン 57 | IO — General purpose user I/O (bank 6) |
| ピン 58 | VCCIO6 — I/O bank 6 supply (3.3 V / 2.5 V) |
| ピン 59 | IO — General purpose user I/O (bank 6) |
| ピン 60 | IO — General purpose user I/O (bank 6) |
| ピン 61 | GND — Ground |
| ピン 62 | IO — General purpose user I/O (bank 7) |
| ピン 63 | VCCIO7 — I/O bank 7 supply (3.3 V / 2.5 V) |
| ピン 64 | IO — General purpose user I/O (bank 7) |
| ピン 65 | IO — General purpose user I/O (bank 7) |
| ピン 66 | GND — Ground |
| ピン 67 | IO — General purpose user I/O (bank 7) |
| ピン 68 | IO — General purpose user I/O (bank 7) |
| ピン 69 | VCCIO7 — I/O bank 7 supply (3.3 V / 2.5 V) |
| ピン 70 | IO — General purpose user I/O (bank 7) |
| ピン 71 | GND — Ground |
| ピン 72 | IO — General purpose user I/O (bank 8) |
| ピン 73 | VCCIO8 — I/O bank 8 supply (3.3 V / 2.5 V) |
| ピン 74 | IO — General purpose user I/O (bank 8) |
| ピン 75 | IO — General purpose user I/O (bank 8) |
| ピン 76 | GND — Ground |
| ピン 77 | IO — General purpose user I/O (bank 8) |
| ピン 78 | VCCIO8 — I/O bank 8 supply (3.3 V / 2.5 V) |
| ピン 79 | IO — General purpose user I/O (bank 8) |
| ピン 80 | IO — General purpose user I/O (bank 8) |
| ピン 81 | GND — Ground |
| ピン 82 | CLK0 — Dedicated clock input 0 |
| ピン 83 | CLK1 — Dedicated clock input 1 |
| ピン 84 | VCCIO8 — I/O bank 8 supply (3.3 V / 2.5 V) |
| ピン 85 | IO — General purpose user I/O (bank 8) |
| ピン 86 | IO — General purpose user I/O (bank 8) |
| ピン 87 | GND — Ground |
| ピン 88 | IO — General purpose user I/O (bank 8) |
| ピン 89 | IO — General purpose user I/O (bank 8) |
| ピン 90 | VCCIO8 — I/O bank 8 supply (3.3 V / 2.5 V) |
| ピン 91 | IO — General purpose user I/O (bank 8) |
| ピン 92 | GND — Ground |
| ピン 93 | VCCINT — Core supply (1.2 V) |
| ピン 94 | VCCINT — Core supply (1.2 V) |
| ピン 95 | GND — Ground |
| ピン 96 | IO — General purpose user I/O (bank 1) |
| ピン 97 | VCCIO1 — I/O bank 1 supply (3.3 V / 2.5 V) |
| ピン 98 | IO — General purpose user I/O (bank 1) |
| ピン 99 | IO — General purpose user I/O (bank 1) |
| ピン 100 | GND — Ground |
| ピン 101 | IO — General purpose user I/O (bank 1) |
| ピン 102 | IO — General purpose user I/O (bank 1) |
| ピン 103 | VCCIO1 — I/O bank 1 supply (3.3 V / 2.5 V) |
| ピン 104 | IO — General purpose user I/O (bank 1) |
| ピン 105 | GND — Ground |
| ピン 106 | IO — General purpose user I/O (bank 1) |
| ピン 107 | VCCIO2 — I/O bank 2 supply (3.3 V / 2.5 V) |
| ピン 108 | IO — General purpose user I/O (bank 2) |
| ピン 109 | IO — General purpose user I/O (bank 2) |
| ピン 110 | GND — Ground |
| ピン 111 | IO — General purpose user I/O (bank 2) |
| ピン 112 | VCCIO2 — I/O bank 2 supply (3.3 V / 2.5 V) |
| ピン 113 | IO — General purpose user I/O (bank 2) |
| ピン 114 | IO — General purpose user I/O (bank 2) |
| ピン 115 | GND — Ground |
| ピン 116 | IO — General purpose user I/O (bank 2) |
| ピン 117 | VCCIO3 — I/O bank 3 supply (3.3 V / 2.5 V) |
| ピン 118 | IO — General purpose user I/O (bank 3) |
| ピン 119 | IO — General purpose user I/O (bank 3) |
| ピン 120 | GND — Ground |
| ピン 121 | IO — General purpose user I/O (bank 3) |
| ピン 122 | VCCIO3 — I/O bank 3 supply (3.3 V / 2.5 V) |
| ピン 123 | IO — General purpose user I/O (bank 3) |
| ピン 124 | IO — General purpose user I/O (bank 3) |
| ピン 125 | GND — Ground |
| ピン 126 | IO — General purpose user I/O (bank 3) |
| ピン 127 | VCCIO4 — I/O bank 4 supply (3.3 V / 2.5 V) |
| ピン 128 | IO — General purpose user I/O (bank 4) |
| ピン 129 | IO — General purpose user I/O (bank 4) |
| ピン 130 | GND — Ground |
| ピン 131 | IO — General purpose user I/O (bank 4) |
| ピン 132 | VCCIO4 — I/O bank 4 supply (3.3 V / 2.5 V) |
| ピン 133 | IO — General purpose user I/O (bank 4) |
| ピン 134 | IO — General purpose user I/O (bank 4) |
| ピン 135 | GND — Ground |
| ピン 136 | IO — General purpose user I/O (bank 4) |
| ピン 137 | VCCIO5 — I/O bank 5 supply (3.3 V / 2.5 V) |
| ピン 138 | IO — General purpose user I/O (bank 5) |
| ピン 139 | IO — General purpose user I/O (bank 5) |
| ピン 140 | GND — Ground |
| ピン 141 | IO — General purpose user I/O (bank 5) |
| ピン 142 | VCCIO5 — I/O bank 5 supply (3.3 V / 2.5 V) |
| ピン 143 | IO — General purpose user I/O (bank 5) |
| ピン 144 | GND — Ground / exposed thermal pad |
主な用途
10M02SCE144A7G の用途: 7 件s: Industrial Control and Factory Automation I/O Expansion, Video Bridging and Display Controllers, Portable Medical Device Front-Ends, Low-Volume ASIC Prototyping and Glue Logic, Retro-Computing and Educational FPGA Platforms, I/O Voltage Translation and Bus Bridging, Battery Management and Energy Harvesting Controllers.
Industrial Control and Factory Automation I/O Expansion
The 10M02SCE144A7G is well suited for industrial PLC and factory automation I/O expansion modules because its 101 user I/Os, integrated 12-bit ADC, and -40C to +125C operating range address the harsh-environment connectivity demands of motor drives, conveyor controllers, and sensor aggregators. The on-chip flash enables instant-on at < 10 ms, eliminating external boot memory and reducing BOM cost for distributed I/O nodes. The hardened DDR3 controller and 16 18x18 multipliers allow firmware-accelerated signal processing on the same chip. Per the Intel MAX 10 device overview, designers can also implement Nios II soft-core CPUs for protocol conversion without leaving the device.
おすすめ
Video Bridging and Display Controllers
The 10M02SCE144A7G fits video bridging designs because its 1,016 Kbit block RAM buffers video frames while 16 dedicated 18x18 multipliers accelerate pixel processing pipelines in industrial HMIs, kiosks, and legacy LCD controllers. Its 101 user I/Os can drive parallel RGB panels and LVDS channels simultaneously. The 12-bit ADC embedded on-chip simplifies backlight current sensing, while the AES-256 bitstream encryption protects display calibration IP from cloning. The 55 nm CMOS process keeps dynamic power low enough for fanless operation in sealed enclosures.
おすすめ
Portable Medical Device Front-Ends
The 10M02SCE144A7G serves portable medical front-ends because its on-chip 12-bit 1 MSa/s ADC digitizes patient-side analog signals (temperature, impedance, SpO2 photodiode current) without a separate ADC chip, shrinking the BOM and lowering analog-coupling noise. The non-volatile flash enables sub-10 ms startup required for battery-powered patient monitors waking from sleep. With 1,016 Kbit embedded RAM the device can buffer waveform segments before sending to a host MCU via SPI or UART. Designers leverage the AES-256 bitstream encryption to satisfy HIPAA-aligned IP protection requirements for proprietary diagnostic algorithms.
おすすめ
Low-Volume ASIC Prototyping and Glue Logic
The 10M02SCE144A7G is widely used as an ASIC prototyping and glue-logic replacement because its 2,000 logic elements and 101 user I/Os replace 5-10 discrete 74-series logic packages on legacy boards. Designers use MAX 10 devices to consolidate address decoding, bus arbitration, and clock distribution in a single chip while still being able to reflash during development. The exposed thermal pad and 55 nm CMOS process provide thermal headroom up to 125C, so the device survives the same reflow and operational conditions as the eventual ASIC it emulates. Free Quartus Prime Lite toolchain support keeps prototyping costs low.
おすすめ
Retro-Computing and Educational FPGA Platforms
The 10M02SCE144A7G is favored in retro-computing hobbyist builds (classic CPU re-implementations) and university FPGA courses because its EQFP-144 0.5 mm pitch package is breadboard-compatible with inexpensive breakout boards, and 2,000 logic elements are sufficient to implement classic 8-bit processors such as 6502 and Z80. The on-chip non-volatile flash removes external boot ROM, simplifying student projects. Free Quartus Prime Lite software with example designs lowers the entry barrier, and the device's low USD 8 unit price keeps class lab kits affordable.
おすすめ
I/O Voltage Translation and Bus Bridging
The 10M02SCE144A7G handles I/O voltage translation between 3.3 V, 2.5 V, and 1.8 V domains because its flexible I/O banks can mix LVCMOS, LVTTL, and LVDS on the same die. The 101 user I/Os allow 30+ simultaneous bridge channels between legacy microcontrollers and modern SoCs. The hard DDR3 controller interfaces directly with commodity DRAM while the FPGA core implements glue logic. Per the Intel MAX 10 datasheet, the integrated ADC plus 16 multipliers also support sensor-hub pre-processing on the same bridging chip, eliminating a second companion processor.
おすすめ
Battery Management and Energy Harvesting Controllers
The 10M02SCE144A7G is suitable for battery management controllers because the on-chip 12-bit ADC monitors individual cell voltages in multi-cell Li-ion packs, while 16 hardware multipliers run Coulomb-counting algorithms in real time. The non-volatile flash retains calibration data without external EEPROM. With 101 user I/Os the device can directly drive cell-balancing FETs and SMBus interfaces to a host BMS controller. The 55 nm CMOS process and -40C to +125C operating junction range suit both portable consumer packs and stationary energy-storage cabinets.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M02SCE144A7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M02SCE144I7G | 10M02SCE144C8G | 10M02SCE144C7G | 10M02SCU324I7G | 10M02SCU169I7G |
|---|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | UBGA-324 (different package) | UBGA-169 (different package) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| User I/O Count | 101 | 101 | 101 | 101 | 160 | 130 |
| Embedded RAM | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit |
| User Flash | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit |
| Temperature Grade | Commercial (-40C to +125C junction) | Industrial (-40C to +125C junction, extended) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | -7 (standard) | -7 | -8 (slower) | -7 | -7 | -7 |
| On-chip ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
主な差別化要因
- Highest I/O count in the 10M02 family in an EQFP package （vs 10M02SCU169I7G)
- Industrial-temperature variant shares the same EQFP-144 footprint （vs 10M02SCE144I7G)
- On-chip non-volatile flash removes external boot PROM （vs Xilinx Spartan-6 XC6SLX4)
設計ノート
Estimated: at 3.3 V supply drawing 200 mA typical for a moderately utilized 10M02 design, power dissipation is approximately 0.66 W - well within the EQFP-144 thermal envelope. The MAX 10 device has internal LDOs that derive 1.2 V core from a 3.3 V rail, but designers must still supply 2.5 V to VCCA and VCCA_ADC pins for PLLs and the ADC to function. Per Intel AN1001, place a 100 nF decoupling capacitor on every VCCIO bank pin within 3 mm of the package pad, plus a bulk 10 uF tantalum on the 3.3 V rail.
Estimated: the EQFP-144 exposed thermal pad connects to the silicon die substrate and must be soldered to a copper pour with at least a 4 x 4 thermal via array (0.3 mm vias on 1 mm pitch) for adequate heat extraction. Without proper thermal pad soldering, junction-to-ambient thermal resistance (theta_JA) can exceed 35 C/W, derating the 125C max junction temperature in confined enclosures. For sealed industrial housings, derate Tj by at least 15C from ambient to compensate for limited convective cooling.
The EQFP-144 package uses a 0.5 mm pitch which requires fine-pitch PCB design rules - use 0.15 mm trace width, 0.15 mm spacing, and ENIG or immersion-silver surface finish for reliable soldering. The exposed thermal pad must NOT be used as an electrical ground unless datasheet guidance is followed; in MAX 10 devices the ePad is typically tied to GND through a low-impedance via array. Avoid routing high-speed DDR traces under the package body - keep them within 5 mm of the package perimeter on the top layer with a continuous ground reference plane on layer 2.
Three common pitfalls when using the 10M02: (1) omitting the VCCA 2.5 V supply causes PLL lock failures - never tie VCCA to VCCIO; (2) leaving unused I/O banks floating can cause 100-200 uA additional leakage per bank - configure unused pins as outputs driving low in the Quartus pin planner; (3) forgetting to enable the on-chip flash programming interface in the Quartus device options results in configuration failure with no error message - always verify the 'Configuration Scheme' is set to 'Internal Configuration' before generating the .pof file.
For DDR3 interfaces using the MAX 10 hardened memory controller, follow Intel's AN501 guidance: maintain 50 ohm single-ended impedance with 100 ohm differential, keep trace length matching to within 25 mils across the byte lane, and place the DDR3 chips within 25 mm of the FPGA. The ADC analog inputs are sensitive to digital switching noise - keep the ADCIN traces on a separate analog ground island connected to the GNDA pin via a single point. Per the MAX 10 device datasheet, the integrated ADC's 12-bit performance requires VCCA_ADC noise below 50 mVpp.
コンプライアンス情報
RoHS compliant per FindIC package marking. The 10M02SCE144A7G is the commercial (non-automotive) OPN - not AEC-Q100 qualified. The automotive-grade equivalent is the 10M02ASC144A7G variant.
