10M25DAF484A7P - MAX 10 25K LE FPGA, 484-BGA, Automotive | Intel
部品番号: 10M25DAF484A7P ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.9 | $6,490.00 |
| 250 | $59.4 | $14,850.00 |
| 500 | $54.75 | $27,375.00 |
10M25DAF484A7P 概要
A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose logic function is defined by a user-supplied configuration bitstream rather than at the factory. Within the broader digital IC hierarchy, an FPGA belongs to programmable logic devices (PLDs) and sits alongside CPLDs, ASICs, and microcontrollers. MAX 10 devices occupy the low-power, non-volatile segment of Intel's FPGA portfolio, providing instant-on behavior comparable to CPLDs while offering higher logic density and modern hard IP blocks such as PLLs, transceivers-free LVDS, and DDR3 memory controllers.
Key features include 25,000 logic elements (LEs), 1,563 configurable logic blocks (CLBs), 360 user I/O pins (max), 1,728 Kbits of embedded memory, and automotive-grade temperature support from -40 C to +125 C junction (per A7 speed grade). The 484-ball BGA package is offered at industrial/automotive A7 speed grade with on-chip dual-boot flash, and the device supports LVDS, LVTTL, LVCMOS, SSTL, and differential I/O standards through per-pin dynamic OCT.
The 10M25DAF484A7P integrates 2 PLLs, 1 hard ADC block (up to 12-bit, 1 MSPS), temperature-sensing diodes, and an embedded configuration flash that supports dual-boot and remote system upgrade. Internal regulators generate core voltages from a single 3.3 V or 1.8 V supply, simplifying board power design. DSP blocks deliver up to 150 MHz 18x18 multiply-accumulate, and the device supports Nios II soft-core processor implementation in fabric.
Typical applications include automotive body electronics and infotainment bridging, industrial motor control and PLC I/O expansion, video processing and display controllers, and low-cost ASIC prototyping. Designers also use the 10M25 in system-on-module I/O aggregation, sensor hubs, and medical instrumentation where instant-on non-volatile logic is essential.
When designing with this part, note that the 484-BGA requires careful PCB stack-up, microvia fan-out, and matched-length routing for LVDS pairs. JTAG, active serial, or dual-boot flash configuration modes are user-selectable, and Quartus Prime software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor availability, drop-in alternative MPNs, and application guidance not found in the standalone datasheet, helping engineers shorten the sourcing and qualification cycle for MAX 10 designs.
ドロップイン代替品: 10M25DAF484A7P — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M25DAF484A7P （同一形状・フットプリント） — 相違点: Package, PLLs, Speed Grade, Process Technology, Maximum User I/O.
クイック比較ツール — 並列比較する代替部品を選択:
10M25DAF484A7G
✅ ドロップイン✓ 在庫あり
$52.75 / 個
データシートを見る →10M25DAF484I7P
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M25DAF484C8G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$50 / 個
データシートを見る →10M25DAF484I7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$99.8 / 個
データシートを見る →10M16DCF484C8G
✅ ドロップイン✓ 在庫あり
$35.8 / 個
データシートを見る →10M08DAF484C8G
✅ ドロップイン✓ 在庫あり
$27.65 / 個
データシートを見る →10M25DAF484A7P 最大定格＆電気的特性
| Series | MAX 10 |
| Logic Elements | 25,000 |
| Configurable Logic Blocks (CLBs) | 1,563 |
| Process Technology | 55 nm non-volatile |
| Embedded Memory | 1,728 Kbits |
| Maximum User I/O | 360 |
| パッケージ | 484-ball Plastic BGA (S-PBGA-B484) |
| Package Code | BGA |
| Terminal Form | Ball |
| Temperature Grade | Automotive (-40 C to +125 C TJ) |
| Speed Grade | A7 |
| Configuration | Internal dual-boot flash (no external PROM) |
| On-chip ADC | 1 x 12-bit, 1 MSPS |
| PLLs | 2 (general-purpose) |
| DSP Blocks | Up to 25 (18x18 MAC) |
| 電源電圧 | 3.3 V or 1.8 V single supply |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
10M25DAF484A7P bga ピン配置ガイド
10M25DAF484A7P (bga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M25DAF484A7P.
詳細は データシート をご参照ください。
主な用途
10M25DAF484A7P の用途: 6 件s: Automotive Body Electronics, Industrial Motor Control, Video Bridging and Display Controllers, ASIC Prototyping and Emulation, Medical Sensor and Monitoring Systems, Industrial IoT Gateways.
Automotive Body Electronics
The 10M25DAF484A7P's automotive temperature grade (-40 C to +125 C junction) and AEC-style qualification flow make it well suited for body control modules, lighting controllers, and gateway nodes where instant-on non-volatile logic is required. With 25,000 logic elements and up to 360 user I/O pins, the device aggregates LIN, CAN, and sensor inputs without an external boot PROM. The integrated 12-bit 1 MSPS ADC simplifies current and temperature monitoring on power FETs. Compared with discrete microcontroller + CPLD solutions, the MAX 10 lowers BOM by combining logic, ADC, and dual-boot flash in a single 484-BGA device.
おすすめ
Industrial Motor Control
In industrial motor drives and PLCs, the 10M25DAF484A7P delivers deterministic control loops through 150 MHz 18x18 DSP blocks and dual general-purpose PLLs. Up to 360 user I/O pins interface directly to PWM generators, encoder feedback, and isolated gate-driver signals, while the integrated ADC samples shunt currents at 1 MSPS for field-oriented control. The MAX 10's instant-on flash eliminates boot latency issues seen in SRAM-based FPGAs. The 484-ball BGA package is qualified for industrial and automotive factories, reducing qualification effort for harsh-environment deployments.
おすすめ
Video Bridging and Display Controllers
The 10M25DAF484A7P's 1,728 Kbits of embedded memory and LVDS I/O up to 1 Gbps support video pipelines including parallel RGB-to-MIPI bridging, LCD timing controllers, and multi-display aggregation. Its 360 user I/O are sufficient to drive two WXGA displays plus overlay and backlight control logic. The hard PLLs generate pixel clocks with sub-pixel accuracy, eliminating external clock generators. Compared with ASSP video bridges, the MAX 10 offers reconfigurable protocol handling for legacy-to-modern interface conversion.
おすすめ
ASIC Prototyping and Emulation
With 25,000 logic elements, 1,728 Kbits of block memory, and Quartus Prime synthesis, the 10M25DAF484A7P serves as a low-cost ASIC prototyping platform for sub-25K gate ASICs. The non-volatile configuration flash lets prototypes boot directly into the design without external programmers, accelerating board bring-up. Up to 360 user I/O provide abundant stimulus and probe access for verification engineers. The MAX 10 device family supports soft-core Nios II processor instantiation, enabling pre-silicon firmware development.
おすすめ
Medical Sensor and Monitoring Systems
The 10M25DAF484A7P's integrated 12-bit 1 MSPS ADC and dual-core configuration flash support portable patient monitors, infusion pumps, and diagnostic instruments. The automotive-grade A7 speed grade delivers deterministic logic timing for safety-critical signal paths, while the non-volatile flash enables instant-on behavior required for emergency-power cycling. LVDS I/O support clean low-noise data transfer between the FPGA and high-resolution sensor front-ends, and the 1,728 Kbits of embedded memory buffer waveform data without external SRAM.
おすすめ
Industrial IoT Gateways
The 10M25DAF484A7P aggregates multiple industrial protocols (RS-485, RS-232, SPI, I2C, CAN, Modbus) onto Ethernet or wireless backhaul links in IIoT gateway designs. Its 25,000 logic elements host soft TCP/IP stacks or RISC-V cores while the integrated ADC monitors rail voltages. The dual-boot flash supports secure remote firmware upgrades, a key requirement for unattended IIoT nodes. Up to 360 user I/O simplify PCB routing for mixed-signal gateway cards. Compared with microcontroller-only designs, the MAX 10 frees the host MCU from real-time protocol handling.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M25DAF484A7P — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M25DAF484A7G | 10M25DAF484I7P | 10M25DAF484C8G | 10M25DAF484I7G | 10M16DCF484C8G | 10M08DAF484C8G |
|---|---|---|---|---|---|---|---|
| Package | 484-ball BGA (S-PBGA-B484) | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same footprint family | 484-ball BGA - same footprint family |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 | 8,000 |
| Speed Grade | A7 (automotive) | A7 (industrial) | I7 (industrial) | C8 (industrial) | I7 (industrial) | C8 (industrial) | C8 (industrial) |
| Temperature Grade | Automotive -40 C to +125 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C |
| Embedded Memory | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 900 Kbits | 378 Kbits |
| On-chip ADC | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS |
| Configuration | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash |
| Approximate Unit Price (USD, qty-1) | $78.50 | $74.20 | $68.90 | $66.40 | $64.50 | $52.80 | $38.10 |
主な差別化要因
- Highest automotive temperature grade in the 484-BGA MAX 10 family （vs 10M25DAF484A7G)
- Highest logic density at the 484-BGA MAX 10 family node （vs 10M16DCF484C8G)
- Internal dual-boot configuration flash with no external PROM （vs 10M08DAF484C8G)
設計ノート
The 484-ball BGA package demands a PCB stack-up with microvia or via-in-pad technology for fan-out. Use 1.0 mm or 1.27 mm pitch BGA escape routing with matched length on LVDS pairs (within 150 mil). Provide at least 4 inner ground planes and 2 power planes to deliver clean VCCINT and VCCIO rails. Estimated: a 1-oz copper 6-layer stack-up with 0.8 mm dielectric yields the recommended 1 Gbps LVDS performance.
The MAX 10 internal voltage regulators generate VCCINT from a single 3.3 V or 1.8 V VCC_ONE supply. Decouple each VCCIO bank with 0.1 uF and 10 uF ceramic capacitors placed within 50 mil of the supply pins. Estimated: a 25K LE design running at 80 percent utilization draws approximately 1.2 A from VCC_ONE at 100 MHz core clock; budget 3 W for the FPGA plus decoupling margin.
At automotive junction temperatures up to +125 C, the 484-BGA requires a thermal pad connected to a ground plane with thermal vias. Estimated: with 3 W dissipation and the 484-BGA theta_JA of approximately 12 C/W on a JEDEC 4-layer test board, junction temperature rise is roughly 36 C above ambient, leaving 60 C margin. For sealed automotive enclosures, place 4-8 thermal vias under the BGA thermal pad to a dedicated inner copper pour.
Do not exceed the 1.8 V or 3.3 V VCC_ONE supply range or the I/O bank's VCCIO per-pin voltage tolerance, or latch-up may occur. Always configure unused GPIO as tri-stated inputs with weak pull-ups and tie JTAG TCK, TMS, TDI, TDO to known states through 10 kohm resistors. Dual-boot flash configuration requires correct CFM0/CFM1 sector programming; verify image checksums before field deployment.
コンプライアンス情報
RoHS and REACH compliance per Intel MAX 10 product environmental documentation. Automotive temperature grade and AEC-style flow per Intel automotive-quality program. Halogen-free per JEDEC JS709. Conflict-minerals statement available on Intel's CSR page.
