10M25DAF484A7P - MAX 10 25K LE FPGA, 484-BGA, Automotive | Intel
부품 번호: 10M25DAF484A7P ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.9 | $6,490.00 |
| 250 | $59.4 | $14,850.00 |
| 500 | $54.75 | $27,375.00 |
10M25DAF484A7P 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose logic function is defined by a user-supplied configuration bitstream rather than at the factory. Within the broader digital IC hierarchy, an FPGA belongs to programmable logic devices (PLDs) and sits alongside CPLDs, ASICs, and microcontrollers. MAX 10 devices occupy the low-power, non-volatile segment of Intel's FPGA portfolio, providing instant-on behavior comparable to CPLDs while offering higher logic density and modern hard IP blocks such as PLLs, transceivers-free LVDS, and DDR3 memory controllers.
Key features include 25,000 logic elements (LEs), 1,563 configurable logic blocks (CLBs), 360 user I/O pins (max), 1,728 Kbits of embedded memory, and automotive-grade temperature support from -40 C to +125 C junction (per A7 speed grade). The 484-ball BGA package is offered at industrial/automotive A7 speed grade with on-chip dual-boot flash, and the device supports LVDS, LVTTL, LVCMOS, SSTL, and differential I/O standards through per-pin dynamic OCT.
The 10M25DAF484A7P integrates 2 PLLs, 1 hard ADC block (up to 12-bit, 1 MSPS), temperature-sensing diodes, and an embedded configuration flash that supports dual-boot and remote system upgrade. Internal regulators generate core voltages from a single 3.3 V or 1.8 V supply, simplifying board power design. DSP blocks deliver up to 150 MHz 18x18 multiply-accumulate, and the device supports Nios II soft-core processor implementation in fabric.
Typical applications include automotive body electronics and infotainment bridging, industrial motor control and PLC I/O expansion, video processing and display controllers, and low-cost ASIC prototyping. Designers also use the 10M25 in system-on-module I/O aggregation, sensor hubs, and medical instrumentation where instant-on non-volatile logic is essential.
When designing with this part, note that the 484-BGA requires careful PCB stack-up, microvia fan-out, and matched-length routing for LVDS pairs. JTAG, active serial, or dual-boot flash configuration modes are user-selectable, and Quartus Prime software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor availability, drop-in alternative MPNs, and application guidance not found in the standalone datasheet, helping engineers shorten the sourcing and qualification cycle for MAX 10 designs.
드롭인 대체품: 10M25DAF484A7P — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M25DAF484A7P (동일 폼 팩터 및 풋프린트) — 차이점: Package, PLLs, Speed Grade, Process Technology, Maximum User I/O.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25DAF484A7G
✅ 드롭인✓ 재고 있음
$52.75 / 개
데이터시트 보기 →10M25DAF484I7P
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M25DAF484C8G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$50 / 개
데이터시트 보기 →10M25DAF484I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$99.8 / 개
데이터시트 보기 →10M16DCF484C8G
✅ 드롭인✓ 재고 있음
$35.8 / 개
데이터시트 보기 →10M08DAF484C8G
✅ 드롭인✓ 재고 있음
$27.65 / 개
데이터시트 보기 →10M25DAF484A7P 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements | 25,000 |
| Configurable Logic Blocks (CLBs) | 1,563 |
| Process Technology | 55 nm non-volatile |
| Embedded Memory | 1,728 Kbits |
| Maximum User I/O | 360 |
| 패키지 | 484-ball Plastic BGA (S-PBGA-B484) |
| Package Code | BGA |
| Terminal Form | Ball |
| Temperature Grade | Automotive (-40 C to +125 C TJ) |
| Speed Grade | A7 |
| Configuration | Internal dual-boot flash (no external PROM) |
| On-chip ADC | 1 x 12-bit, 1 MSPS |
| PLLs | 2 (general-purpose) |
| DSP Blocks | Up to 25 (18x18 MAC) |
| 공급 전압 | 3.3 V or 1.8 V single supply |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10M25DAF484A7P bga 핀 구성 가이드
10M25DAF484A7P(bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M25DAF484A7P.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M25DAF484A7P 적합 용도: 6 애플리케이션s: Automotive Body Electronics, Industrial Motor Control, Video Bridging and Display Controllers, ASIC Prototyping and Emulation, Medical Sensor and Monitoring Systems, Industrial IoT Gateways.
Automotive Body Electronics
The 10M25DAF484A7P's automotive temperature grade (-40 C to +125 C junction) and AEC-style qualification flow make it well suited for body control modules, lighting controllers, and gateway nodes where instant-on non-volatile logic is required. With 25,000 logic elements and up to 360 user I/O pins, the device aggregates LIN, CAN, and sensor inputs without an external boot PROM. The integrated 12-bit 1 MSPS ADC simplifies current and temperature monitoring on power FETs. Compared with discrete microcontroller + CPLD solutions, the MAX 10 lowers BOM by combining logic, ADC, and dual-boot flash in a single 484-BGA device.
추천
Industrial Motor Control
In industrial motor drives and PLCs, the 10M25DAF484A7P delivers deterministic control loops through 150 MHz 18x18 DSP blocks and dual general-purpose PLLs. Up to 360 user I/O pins interface directly to PWM generators, encoder feedback, and isolated gate-driver signals, while the integrated ADC samples shunt currents at 1 MSPS for field-oriented control. The MAX 10's instant-on flash eliminates boot latency issues seen in SRAM-based FPGAs. The 484-ball BGA package is qualified for industrial and automotive factories, reducing qualification effort for harsh-environment deployments.
추천
Video Bridging and Display Controllers
The 10M25DAF484A7P's 1,728 Kbits of embedded memory and LVDS I/O up to 1 Gbps support video pipelines including parallel RGB-to-MIPI bridging, LCD timing controllers, and multi-display aggregation. Its 360 user I/O are sufficient to drive two WXGA displays plus overlay and backlight control logic. The hard PLLs generate pixel clocks with sub-pixel accuracy, eliminating external clock generators. Compared with ASSP video bridges, the MAX 10 offers reconfigurable protocol handling for legacy-to-modern interface conversion.
추천
ASIC Prototyping and Emulation
With 25,000 logic elements, 1,728 Kbits of block memory, and Quartus Prime synthesis, the 10M25DAF484A7P serves as a low-cost ASIC prototyping platform for sub-25K gate ASICs. The non-volatile configuration flash lets prototypes boot directly into the design without external programmers, accelerating board bring-up. Up to 360 user I/O provide abundant stimulus and probe access for verification engineers. The MAX 10 device family supports soft-core Nios II processor instantiation, enabling pre-silicon firmware development.
추천
Medical Sensor and Monitoring Systems
The 10M25DAF484A7P's integrated 12-bit 1 MSPS ADC and dual-core configuration flash support portable patient monitors, infusion pumps, and diagnostic instruments. The automotive-grade A7 speed grade delivers deterministic logic timing for safety-critical signal paths, while the non-volatile flash enables instant-on behavior required for emergency-power cycling. LVDS I/O support clean low-noise data transfer between the FPGA and high-resolution sensor front-ends, and the 1,728 Kbits of embedded memory buffer waveform data without external SRAM.
추천
Industrial IoT Gateways
The 10M25DAF484A7P aggregates multiple industrial protocols (RS-485, RS-232, SPI, I2C, CAN, Modbus) onto Ethernet or wireless backhaul links in IIoT gateway designs. Its 25,000 logic elements host soft TCP/IP stacks or RISC-V cores while the integrated ADC monitors rail voltages. The dual-boot flash supports secure remote firmware upgrades, a key requirement for unattended IIoT nodes. Up to 360 user I/O simplify PCB routing for mixed-signal gateway cards. Compared with microcontroller-only designs, the MAX 10 frees the host MCU from real-time protocol handling.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M25DAF484A7P — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25DAF484A7G | 10M25DAF484I7P | 10M25DAF484C8G | 10M25DAF484I7G | 10M16DCF484C8G | 10M08DAF484C8G |
|---|---|---|---|---|---|---|---|
| Package | 484-ball BGA (S-PBGA-B484) | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same footprint family | 484-ball BGA - same footprint family |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 | 8,000 |
| Speed Grade | A7 (automotive) | A7 (industrial) | I7 (industrial) | C8 (industrial) | I7 (industrial) | C8 (industrial) | C8 (industrial) |
| Temperature Grade | Automotive -40 C to +125 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C |
| Embedded Memory | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 900 Kbits | 378 Kbits |
| On-chip ADC | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS |
| Configuration | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash |
| Approximate Unit Price (USD, qty-1) | $78.50 | $74.20 | $68.90 | $66.40 | $64.50 | $52.80 | $38.10 |
주요 차별점
- Highest automotive temperature grade in the 484-BGA MAX 10 family (vs 10M25DAF484A7G)
- Highest logic density at the 484-BGA MAX 10 family node (vs 10M16DCF484C8G)
- Internal dual-boot configuration flash with no external PROM (vs 10M08DAF484C8G)
설계 노트
The 484-ball BGA package demands a PCB stack-up with microvia or via-in-pad technology for fan-out. Use 1.0 mm or 1.27 mm pitch BGA escape routing with matched length on LVDS pairs (within 150 mil). Provide at least 4 inner ground planes and 2 power planes to deliver clean VCCINT and VCCIO rails. Estimated: a 1-oz copper 6-layer stack-up with 0.8 mm dielectric yields the recommended 1 Gbps LVDS performance.
The MAX 10 internal voltage regulators generate VCCINT from a single 3.3 V or 1.8 V VCC_ONE supply. Decouple each VCCIO bank with 0.1 uF and 10 uF ceramic capacitors placed within 50 mil of the supply pins. Estimated: a 25K LE design running at 80 percent utilization draws approximately 1.2 A from VCC_ONE at 100 MHz core clock; budget 3 W for the FPGA plus decoupling margin.
At automotive junction temperatures up to +125 C, the 484-BGA requires a thermal pad connected to a ground plane with thermal vias. Estimated: with 3 W dissipation and the 484-BGA theta_JA of approximately 12 C/W on a JEDEC 4-layer test board, junction temperature rise is roughly 36 C above ambient, leaving 60 C margin. For sealed automotive enclosures, place 4-8 thermal vias under the BGA thermal pad to a dedicated inner copper pour.
Do not exceed the 1.8 V or 3.3 V VCC_ONE supply range or the I/O bank's VCCIO per-pin voltage tolerance, or latch-up may occur. Always configure unused GPIO as tri-stated inputs with weak pull-ups and tie JTAG TCK, TMS, TDI, TDO to known states through 10 kohm resistors. Dual-boot flash configuration requires correct CFM0/CFM1 sector programming; verify image checksums before field deployment.
규정 준수 정보
RoHS and REACH compliance per Intel MAX 10 product environmental documentation. Automotive temperature grade and AEC-style flow per Intel automotive-quality program. Halogen-free per JEDEC JS709. Conflict-minerals statement available on Intel's CSR page.
