10M50DAF484C7G - MAX 10 FPGA 50K LE, 484-BGA | Intel / Altera
部品番号: 10M50DAF484C7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $78.4 | $7,840.00 |
| 500 | $72.1 | $36,050.00 |
| 1,000 | $65.8 | $65,800.00 |
10M50DAF484C7G 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as PLLs, memory blocks, and serializer/deserializer blocks. Within the broader semiconductor taxonomy, an FPGA sits at the apex of programmable logic devices, above complex programmable logic devices (CPLDs) and below ASICs in performance per watt. The MAX 10 family uniquely integrates a dual-configuration flash, analog-to-digital converters (ADCs), and DDR3 memory controllers, blurring the line between traditional FPGAs and system-on-chip (SoC) devices.
Key features of the 10M50DAF484C7G include 50K logic elements (LEs), 1,677,312 bits (approximately 1.6 Mbit) of user flash memory, an integrated 12-bit successive-approximation ADC with up to 17 external channels, and two integrated PLLs per device. The non-volatile flash-based configuration eliminates the need for an external boot PROM, reducing BOM cost and board area. The 484-FBGA package provides a compact 23 mm x 23 mm footprint with 1.0 mm ball pitch, suitable for space-constrained industrial and embedded designs.
Architecturally, the device is built on a 55 nm embedded flash CMOS process, balancing cost, density, and low static power consumption. The LAB (Logic Array Block) structure organizes 50 LEs per block, feeding a rich interconnect fabric. Embedded memory blocks (M9K) deliver true dual-port RAM at speeds up to 315 MHz, while DSP blocks enable up to 18 x 18 integer or 27 x 27 fixed-point multiply-accumulate operations per block.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, sensor aggregation hubs, portable test and measurement instruments, and as a glue-logic replacement for legacy CPLD/ASIC designs. Designers also adopt the MAX 10 for its instant-on capability in system bring-up and for board management controllers in larger computing platforms.
When designing with this device, ensure the PCB footprint accommodates the 1.0 mm pitch BGA and that thermal vias are placed under the exposed die pad. Quartus Prime software (Intel FPGA Edition) is the supported design entry, synthesis, and place-and-route toolchain. Designers migrating to higher density should verify I/O count and package compatibility using Intel's MAX 10 vertical migration guide.
This page synthesizes distributor pricing, drop-in MAX 10 alternative MPNs, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 10M50DAF484C7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M50DAF484C7G （同一形状・フットプリント） — 相違点: Package, Configuration Memory, PLLs, Mounting Type, Logic Elements (LE).
クイック比較ツール — 並列比較する代替部品を選択:
10M40DAF484C7G
✅ ドロップイン✓ 在庫あり
$92.4 / 個
データシートを見る →10M50DAF484C8G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M50DAF484I7G
✅ ドロップイン✓ 在庫あり
$58.2 / 個
データシートを見る →10M50DAF484A7G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M50DAF484A7P
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M25DAF484C7G
✅ ドロップイン✓ 在庫あり
$38.5 / 個
データシートを見る →10M50DAF484C7G 最大定格＆電気的特性
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | MAX 10 |
| Logic Elements | 50,000 |
| Embedded Memory | 1,677,312 bits (approximately 1.6 Mbit) |
| Embedded 18x18 Multipliers | 312 |
| Number of User I/O | 360 |
| 電源電圧 | 1.2 V core (VCCINT) |
| パッケージ | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| 実装タイプ | Surface Mount |
| Configuration Memory | Non-volatile embedded flash (dual-configuration) |
| PLLs | 2 |
| ADC | Integrated 12-bit SAR, up to 17 channels |
| 動作温度 | 0 C to +85 C (commercial grade, C7 speed) |
| Process Technology | 55 nm embedded flash CMOS |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
10M50DAF484C7G 484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch ピン配置ガイド
10M50DAF484C7G (484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M50DAF484C7G.
詳細は データシート をご参照ください。
主な用途
10M50DAF484C7G の用途: 6 件s: Industrial Motor Control, Factory Automation I/O Expansion, Portable Test & Measurement, Video Bridging & Display Aggregation, Board Management Controller, Sensor Aggregation Hub for IoT Edge Gateways.
Industrial Motor Control
The 10M50DAF484C7G fits industrial motor-control designs because its 312 embedded 18x18 multipliers can compute field-oriented control (FOC) and space-vector PWM loops in microseconds. With 360 user I/Os, the FPGA can read quadrature encoders, drive three-phase gate drivers, and run safety logic in parallel. The integrated 12-bit SAR ADC supports up to 17 channels for shunt-current and bus-voltage sensing, eliminating an external ADC chip. Non-volatile flash means the controller powers up running field firmware within milliseconds - critical for conveyors and robotic cells where PLC scan-time matters. Designers typically deploy the 50K LE variant in mid-power servo drives from 1 kW to 15 kW where 10M25 lacks headroom but 10M40 is borderline on DSP.
おすすめ
Factory Automation I/O Expansion
Used as a programmable I/O concentrator on the factory floor, the 10M50DAF484C7G aggregates discrete sensors, RS-485 nodes, and 24 V industrial buses into a single high-speed uplink. The 360 GPIO budget lets a single device handle a 256-point digital input module plus 128 outputs with comfortable margin. Hardware-accelerated Modbus, EtherCAT slave, or PROFINET IRT preprocessing can run alongside deterministic safety logic in the LAB fabric. The dual-configuration flash supports remote firmware update with rollback - a key requirement for Industry 4.0 retrofit installations where unplanned downtime is expensive.
おすすめ
Portable Test & Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M50DAF484C7G for low-latency signal conditioning and on-the-fly protocol decoding. The 50K LEs are enough to run multiple soft IP cores (SPI, I2C, UART, CAN-FD, SENT) in parallel while the integrated ADC samples analog channels. The 484-FBGA package keeps board area under 25 mm squared, supporting compact handheld form factors. Non-volatile configuration lets the instrument boot to a known image without external memory, improving cold-start reliability in field-deployed units.
おすすめ
Video Bridging & Display Aggregation
The 10M50DAF484C7G is widely used as a low-cost video bridge between MIPI CSI-2, LVDS, and parallel RGB interfaces in industrial HMIs and digital signage controllers. With 360 I/Os, designers can implement dual-display pipelines plus a touch controller and backlight PWM on a single device. The 50K LE budget absorbs color-space conversion, chroma resampling, and simple OSD overlays without an external processor. The MAX 10's instant-on flash also shortens boot time for kiosk and medical-cart displays.
おすすめ
Board Management Controller
In larger computing platforms the 10M50DAF484C7G serves as a board management controller (BMC) handling power sequencing, thermal monitoring, fan control, and FRU/EEPROM emulation. Its non-volatile flash and 50K LEs are overkill for plain I2C/SPI glue but ideal when the BMC must also run a soft RISC-V core for vendor diagnostics. The integrated ADC reads VRM temperatures and currents, while 360 I/Os cover reset distribution and post-code error capture. Compared to a dedicated BMC ASIC, the MAX 10 allows late-binding firmware updates without respinning the host board.
おすすめ
Sensor Aggregation Hub for IoT Edge Gateways
Industrial IoT edge gateways use the 10M50DAF484C7G to aggregate dozens of sensor streams - Modbus, CAN, 4-20 mA loops, and digital pulses - into a single preprocessed MQTT or OPC-UA uplink. The 50K LE fabric runs deterministic data-acquisition state machines while a soft ARM Cortex-M1 or RISC-V core handles protocol marshalling. The 360 I/Os cover multiple isolated RS-485 ports plus Ethernet-side GPIOs. The integrated ADC and non-volatile configuration reduce external component count, which is critical for sealed, fanless edge nodes deployed in factory cabinets.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M50DAF484C7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M40DAF484C7G | 10M50DAF484C8G | 10M50DAF484I7G | 10M50DAF484A7G | 10M25DAF484C7G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484) 23x23 mm | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 50,000 | 40,000 | 50,000 | 50,000 | 50,000 | 25,000 |
| Speed Grade | C7 (commercial) | C7 | C8 (faster) | I7 (industrial) | A7 (automotive) | C7 |
| Temperature Range | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C | -40 C to +125 C | 0 C to +85 C |
| Embedded 18x18 Multipliers | 312 | 240 | 312 | 312 | 312 | 156 |
| Embedded Memory (bits) | 1,677,312 | 1,294,336 | 1,677,312 | 1,677,312 | 1,677,312 | 823,296 |
| User I/O | 360 | 360 | 360 | 360 | 360 | 360 |
| Configuration Memory | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
| Automotive Qualified | No | No | No | No | Yes (AEC-Q100) | No |
主な差別化要因
- Highest logic density with 360 I/Os in MAX 10 family at 484-FBGA （vs 10M40DAF484C7G)
- Industrial temperature option available in same footprint （vs 10M50DAF484C8G)
- Automotive AEC-Q100 qualified variant available （vs 10M25DAF484C7G)
設計ノート
The 484-FBGA package uses a 1.0 mm ball pitch and a 23 mm x 23 mm body. PCB layout must use laser-drilled microvias or 0.4 mm mechanical drills for fanout, with full ground planes on inner layers and at least four thermal vias under the central die-pad region. Use ENIG or OSP surface finish to ensure reliable BGA solder joint formation; HASL is not recommended for 1.0 mm pitch BGA.
The MAX 10 requires a 1.2 V VCCINT core supply plus 2.5 V/3.3 V VCCIO banks; inrush current during flash configuration can spike to several hundred milliamps. Place 100 nF decoupling caps adjacent to every power pin and bulk 47 uF tantalums near the regulator. Estimated: a fully populated 10M50 at 50 percent toggle rate draws roughly 300-500 mA from VCCINT - confirm with Quartus PowerPlay for your design.
Do not mix C7 and I7 bitstreams on the same hardware without regenerating the SOF file in Quartus Prime - the temperature and timing assumptions differ. Engineers migrating vertically between MAX 10 densities must verify I/O bank compatibility; the F484 footprint pinout is consistent across 10M25/10M40/10M50, but the M144 and U324 footprints are NOT drop-in compatible. Always use the latest MAX 10 pinout file from Intel before committing PCB layout.
Although the MAX 10 is non-volatile, sustained high toggle rates push junction temperature up. With theta_JA around 15 C/W for the 484-FBGA on a 4-layer JEDEC test board, 1 W dissipation yields about 15 C rise. For fanless sealed enclosures, derate clock frequency or reduce LAB utilization to keep Tj below 85 C for the C7 commercial grade.
コンプライアンス情報
RoHS and lead-free per Intel MAX 10 product page. AEC-Q100 not qualified for this C7 commercial part - choose A7 variant for automotive. Halogen-free status not explicitly listed in the verified data - set to unknown.
