10M50DAF484I7G - MAX 10 FPGA 50K LE 484-FBGA Industrial | Intel
部品番号: 10M50DAF484I7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $82.5 | $82.50 |
| 10 | $78.4 | $784.00 |
| 100 | $70.15 | $7,015.00 |
| 500 | $64.8 | $32,400.00 |
| 1,000 | $58.2 | $58,200.00 |
10M50DAF484I7G 概要
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and dedicated hardened IP blocks such as PLLs, transceivers, multipliers, and (in MAX 10) an on-die dual-configuration flash and ADC. Within the broader taxonomy, the MAX 10 belongs to Intel's low-density, non-volatile FPGA family, sitting below Cyclone V/10 and above MAX II/MAX V. It bridges the gap between CPLDs and traditional SRAM-based FPGAs by eliminating external boot memory, simplifying board design and reducing BOM cost.
Key features include 50K logic elements, 312 Kbits (1,677,312 bits) of embedded user flash, dual on-die configuration flash for instant-on operation, an integrated 12-bit 1 MSPS ADC with up to 18 analog inputs, and a wide variety of I/O standards (LVDS, LVCMOS, SSTL, HSTL) on 360 user I/O pins. The device supports Nios II soft-core embedded processors and is programmable via the Quartus Prime design software.
The MAX 10 architecture pairs an SRAM-based logic fabric with non-volatile on-die flash, allowing single-chip configuration in under 10 ms and dual-boot for fail-safe field upgrades. Hardened IP includes PLLs, embedded multipliers (DSP blocks), memory controllers, and the unique analog-to-digital converter subsystem that eliminates external mixed-signal ICs.
Typical applications include industrial motor control, factory automation I/O hubs, portable test and measurement equipment, video bridging for surveillance and broadcast, automotive driver assistance subsystems (with the AEC-Q100 qualified -A7G grade), and low-cost display controllers. The on-die flash and ADC make MAX 10 especially attractive for system-level designs requiring minimum component count.
When designing with the 484-pin FBGA variant, pay close attention to PCB stackup and microvia capability, since the 1.0 mm pitch and 23x23 mm body require controlled-impedance escape routing. Power sequencing on the VCCIO banks must follow the Intel pin connection guidelines to avoid in-rush latch-up. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not aggregated on any single manufacturer page.
ドロップイン代替品: 10M50DAF484I7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M50DAF484I7G （同一形状・フットプリント） — 相違点: Package, PLLs, Operating Temperature, Mounting Type, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
10M50DAF484C7G
✅ ドロップイン✓ 在庫あり
$65.8 / 個
データシートを見る →10M50DAF484I7P
✅ ドロップイン✓ 在庫あり
$112 / 個
データシートを見る →10M50DCF484I7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$99.6 / 個
データシートを見る →10M40DAF484I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M50DAF256I7G
✅ ドロップイン✓ 在庫あり
$155.2 / 個
データシートを見る →10M50DAF484I7G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) |
| User I/O Count | 360 |
| パッケージ | 484-ball FBGA (F484) |
| Package Pitch | 1.0 mm |
| Package Body Size | 23 x 23 mm |
| Process Technology | TSMC 55 nm |
| Supply Voltage - Core | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| On-die Configuration Flash | Yes (dual-boot) |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | 144 (18x18 multipliers) |
| PLLs | 4 |
| Configuration Mode | Single-chip (no external boot device required) |
| 実装タイプ | Surface Mount (FBGA) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Lead-free / Halogen-free | Yes / Yes |
10M50DAF484I7G 23 x 23 mm ピン配置ガイド
10M50DAF484I7G (23 x 23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M50DAF484I7G.
詳細は データシート をご参照ください。
主な用途
10M50DAF484I7G の用途: 6 件s: Industrial Motor Control, Factory Automation I/O Hub, Portable Test and Measurement, Video Bridging and Display Controllers, Automotive Driver Assistance Subsystems, IoT Edge Gateways.
Industrial Motor Control
The 10M50DAF484I7G fits industrial motor control by integrating a 12-bit 1 MSPS ADC, 144 DSP blocks, and 360 LVDS-capable I/Os in a single non-volatile FPGA. In a typical 3-phase FOC drive the MAX 10 samples phase currents through the on-die ADC, executes Clarke/Park transforms and SVPWM in dedicated DSP blocks, and drives IGBT gate signals via level-shifted GPIO - all without an external boot PROM. Industrial temperature grade (-40C to +100C) and instant-on flash make it ideal for factory-floor drives that must boot within milliseconds after a brown-out reset.
おすすめ
Factory Automation I/O Hub
Factory automation hubs require aggregation of dozens of digital and analog sensors into industrial Ethernet (Profinet, EtherCAT) backbones. The 10M50DAF484I7G's 360 user I/Os allow direct connection to multi-bank opto-isolated inputs without external bus expanders, while 1,677,312 bits of embedded user flash store configuration and diagnostic logs locally. The on-die ADC subsystem reads 4-20 mA analog sensors through current-sense resistors, eliminating separate mixed-signal ICs. Single-chip instant-on operation is critical when PLC racks are hot-swapped mid-cycle.
おすすめ
Portable Test and Measurement
Portable T&M instruments (handheld oscilloscopes, bench DMMs, protocol analyzers) demand low power, high logic density, and instant-on boot. The 10M50DAF484I7G consumes only 150-300 mW of static core power at 1.2 V, supports on-die DSP for FFT/filtering, and boots its bitstream from flash in under 10 ms - fast enough that an instrument is functional by the time the user releases the power button. The integrated 12-bit ADC also doubles as a low-speed auxiliary input for the instrument's own self-calibration routines.
おすすめ
Video Bridging and Display Controllers
The 10M50DAF484I7G's 360 LVDS-capable I/Os are well matched to multi-lane MIPI-to-LVDS bridges, HDMI pre-processing pipelines, and industrial panel timing controllers. Embedded memory (1.6 Mbits) holds two full HD frame buffers at reduced bit depth, and 144 DSP blocks enable on-the-fly scaling and color-space conversion. Designers benefit from the MAX 10's instant-on because video walls and HMI panels must display a splash screen within 200 ms of power-on.
おすすめ
Automotive Driver Assistance Subsystems
Although the 10M50DAF484I7G is industrial-grade, its sibling 10M50DAF484A7G is AEC-Q100 qualified and uses the same F484 footprint and 50K LE silicon. Sensor-fusion pre-processing for ADAS - camera LVDS deserialization, radar FFT, ultrasonic echo timestamping - fits comfortably in 50K logic elements with margin. The integrated 12-bit ADC handles rear-view camera analog test patterns, and dual-configuration flash enables fail-safe OTA firmware rollback, a hard requirement for functional-safety automotive subsystems.
おすすめ
IoT Edge Gateways
IoT edge gateways aggregate wireless sensor data (BLE, LoRa, Wi-Fi) and forward filtered streams to cloud brokers over Ethernet. The 10M50DAF484I7G fits this role by hosting a Nios II soft-core processor that runs an embedded TCP/IP stack and TLS termination, while programmable logic offloads crypto accelerators and sensor-bus controllers (SPI, I2C, UART). The on-die ADC also reads battery voltage and temperature for power-management telemetry, and dual-boot flash allows safe OTA rollback if a firmware update fails.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M50DAF484I7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M50DAF484C7G | 10M50DAF484I7P | 10M50DCF484I7G | 10M40DAF484I7G | 10M50DAF256I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 256-ball FBGA (F256) - smaller |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 (-20%) | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,260,000 | 1,677,312 |
| User I/O Count | 360 | 360 | 360 | 360 | 360 | 178 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| On-die Configuration Flash | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) |
| Integrated ADC | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主な差別化要因
- Largest 50K-LE MAX 10 in 484-FBGA with 360 I/Os （vs 10M40DAF484I7G)
- Industrial temperature grade (-40C to +100C) vs commercial （vs 10M50DAF484C7G)
- Highest I/O count in MAX 10 family （vs 10M50DAF256I7G)
設計ノート
Estimated: the 484-ball FBGA at 1.0 mm pitch and 23x23 mm body requires a 4-layer PCB minimum, with microvias in-pad (0.4 mm pitch BGA escape). Trace impedance of 50 ohm single-ended must be verified for LVDS pairs. Per Intel pin connection guidelines, all VCC and GND balls must be connected to power planes with at least 8 thermal vias per quadrant for heat dissipation. Decoupling: 100 nF X7R within 2 mm of every VCCIO/VCCINT ball plus 4.7 uF bulk caps on each bank supply.
Estimated: core current at 50K LE full toggle activity is approximately 300 mA at 1.2 V (about 360 mW); add 50 mA per active I/O bank. Recommend a 1.2 V LDO with 1 A headroom (e.g., TPS7A4701) for noise-sensitive analog subsystems. Sequence VCCINT first, then VCCIO banks, to prevent in-rush latch-up. Refer to the MAX 10 power management user guide for ramp-rate recommendations.
Estimated: at 100C ambient and worst-case toggling, junction temperature can approach 110-115C. Derate by 50% toggling activity if no airflow is present. The exposed die (no integrated heat spreader) couples directly to the PCB; provide a continuous GND pour under the BGA and stitch with 0.3 mm thermal vias to bottom layer copper for spreading. For sealed enclosures, derate to 70% toggle activity or add a small aluminum heatsink.
Do not assume the 10M50DAF484I7G and 10M50DAF484A7G are interchangeable - only the A7G is AEC-Q100 qualified for automotive. JTAG pins are shared with user I/O on some banks; double-check pin-out spreadsheet before assigning GPIO to bank 8 or bank 2 JTAG pins. Dual-configuration flash is partitioned; do not exceed per-region bitstream size limit or factory-image boot will fail.
コンプライアンス情報
RoHS and REACH compliant per Intel MAX 10 material declaration datasheet. AEC-Q100 NOT qualified - select the A7G (AEC-Q100 Grade 3) variant for automotive. Lead-free and halogen-free per JEDEC J-STD-020 MSL3 classification.