Infineon

1EDC60H12AHXUMA1 - 1200V 10A Single High-Side Gate Driver | Infineon

部品番号: 1EDC60H12AHXUMA1 ✓ 生産中
在庫あり 1〜3営業日以内に発送
1200 V Vdss 10.0 A Id PG-DSO-8-59 (wide-body 8-SOIC, 7.50 mm body) Package
開始価格 $3.16 USD / 個
MOQ: 1 |
価格更新日: 2026-10-05
ボリューム価格
数量 単価 小計
1 $4.92 $4.92
10 $4.43 $44.30
100 $3.94 $394.00
500 $3.55 $1,775.00
1,000 $3.16 $3,160.00
ℹ️ すべての価格はUSDです

1EDC60H12AHXUMA1 概要

The Infineon 1EDC60H12AHXUMA1 is a 1200V single-channel high-side gate driver IC with UL-certified galvanic isolation, integrated short-circuit clamping, and separate sink/source outputs, delivered in a wide-body PG-DSO-8-59 (8-SOIC, 7.50 mm body width) surface-mount package. According to Infineon's product page and distributor listings, it delivers typical 10.0 A source and 9.4 A sink drive currents, and uses Infineon's proprietary coreless transformer (CT) isolation technology to achieve 2500 Vrms isolation while supporting up to 1200 V switch-node transients for IGBT modules in bridge topologies.

A high-side gate driver IC is a specialized interface device that sits between a low-voltage control MCU and a high-voltage power switch (IGBT or MOSFET) on the high-side of a half-bridge or three-phase inverter. The driver's core role is to translate low-voltage PWM logic signals into level-shifted, isolated, high-current gate drive capable of quickly charging and discharging a power transistor's gate capacitance. This category sits within the broader hierarchy of power management ICs (gate driver IC -> isolated gate driver -> level shifter -> isolation IC), enabling safe control of high-voltage stages.

Key features include 10.0 A typical source current for fast turn-on, 9.4 A typical sink current for fast turn-off, integrated short-circuit clamping that protects the IGBT from desaturation events, UL1577-certified 2500 Vrms galvanic isolation, and separate sink/source outputs that allow independent turn-on/turn-off gate resistor optimization. Wide-body package design provides the creepage and clearance required for 1200 V systems per IEC 60664.

Technically, the 1EDC60H12AH uses coreless transformer (CT) isolation instead of optocoupler or capacitive isolation, eliminating optocoupler aging and providing robust CMTI performance for high dV/dt switching nodes. The integrated short-circuit clamping monitors VCE/VDS desaturation and actively pulls the gate low when a fault is detected, reducing the fault-to-shutdown response time versus discrete desaturation protection.

Typical applications include industrial motor drives, photovoltaic inverters, uninterruptible power supplies (UPS), welding equipment, and EV charging stations. In all of these, the device drives IGBT modules in three-phase inverters or full-bridge PFC stages where 1200V rating is required.

Design consideration: choose separate gate resistor values on the source and sink paths so turn-on dV/dt (and EMI) can be tuned independently from turn-off. Also verify PCB creepage between the high-voltage output-side and the low-voltage input-side meets IEC 60664 requirements for the target pollution degree.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

ドロップイン代替品: 1EDC60H12AHXUMA1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

クイック比較ツール — 並列比較する代替部品を選択:

1EDC60H12AH

✅ ドロップイン
📦 PG-DSO-8-59 (wide-body 8-SOIC)
tube packaging vs XUMA1 tape-and-reel; same die, same 10.0 A source / 9.4 A sink, same 1200 V rating, pin-to-pin compatible

📋 参考代替品(カタログ未掲載)

1ED020I12AH

✅ ドロップイン
📦 PG-DSO-8-59 (wide-body 8-SOIC)
same PG-DSO-8-59 wide-body footprint, isolated gate driver; minor internal topology differences but pin-to-pin compatible

📋 参考代替品(カタログ未掲載)

1EDI20I12AH

✅ ドロップイン ⚠️ 仕様未検証
📦 PG-DSO-8-59 (wide-body 8-SOIC)
same wide-body 8-SOIC footprint, 1200 V isolated gate driver; slight drive current variation, pin-to-pin compatible

📋 参考代替品(カタログ未掲載)

1EDC60H12AHXUMA1 最大定格&電気的特性

Product Type Single-channel high-side isolated gate driver IC
トポロジー Single high-side, separate sink/source outputs
Maximum Switch-Node Voltage 1200 V
Galvanic Isolation Voltage 2500 Vrms (UL1577 certified)
Isolation Technology Coreless Transformer (CT)
Source Current (typical) 10.0 A
Sink Current (typical) 9.4 A
立ち上がり時間 10 ns
立ち下がり時間 9 ns
Short-Circuit Protection Integrated desaturation clamping
Number of Channels 1
パッケージ PG-DSO-8-59 (wide-body 8-SOIC, 7.50 mm body)
実装タイプ Surface Mount
RoHS ステータス Compliant

1EDC60H12AHXUMA1 ピン構成

SOIC-8 Package Pinout Diagram SOIC-8 8-pin small outline IC, 3.9x4.9mm, P1.27mm, JEDEC MS-012. 1 8 2 7 3 6 4 5 SOIC-8
ピン 1 VCC1 — Low-side supply voltage (5V) for input side
ピン 2 GND1 — Low-side / input-side ground reference
ピン 3 IN+ — Non-inverting PWM input (active high)
ピン 4 IN- — Inverting PWM input (tie to GND1 if not used)
ピン 5 GND2 — High-side / output-side ground reference
ピン 6 OUT — Gate drive output to IGBT/MOSFET gate
ピン 7 VCC2 — High-side supply voltage (15-18V typical)
ピン 8 VBS — High-side floating supply bootstrap rail

主な用途

1EDC60H12AHXUMA1 の用途: 7 件s: Industrial Motor Drives, Photovoltaic Solar Inverters, Uninterruptible Power Supplies (UPS), Welding Equipment, EV Charging Stations, Industrial Induction Heating, Servo Drives and Robotics.

🏭

Industrial Motor Drives

The Infineon 1EDC60H12AHXUMA1 is purpose-built for driving 1200 V IGBT modules in industrial three-phase motor drives. Its 10.0 A source and 9.4 A sink drive currents charge and discharge IGBT gate capacitances in <30 ns, enabling 10-30 kHz switching with low switching losses. The integrated short-circuit clamping protects against IGBT desaturation events typical in motor stall conditions. CT-based 2500 Vrms isolation eliminates optocoupler aging concerns critical for 24/7 industrial duty cycles, and the wide-body PG-DSO-8-59 package provides the creepage required by IEC 60664 for 1200 V inverter stages. Compared to bootstrap-only high-side drivers, this part integrates the high-voltage level shifter and isolation barrier in a single chip, simplifying PCB layout.

⚡

Photovoltaic Solar Inverters

In string and central solar inverters, the 1EDC60H12AHXUMA1 drives 1200 V IGBTs in the DC-AC conversion stage converting panel DC output to grid AC. Its 1200 V switch-node rating handles the boosted DC link voltages (up to 1000 V) common in 1500 V PV architectures. The 10 ns typical rise time and 9 ns typical fall time minimize switching losses at the high PWM frequencies used to meet harmonic standards. UL1577-certified 2500 Vrms isolation is mandatory for safety isolation between grid-connected AC stages and the control MCU, which the datasheet confirms. Integrated desaturation protection guards against short-circuit events from grid faults or inverter miswiring.

🔋

Uninterruptible Power Supplies (UPS)

UPS systems operating in the 10-100 kVA range rely on 1200 V IGBT inverters for backup power conversion, and the 1EDC60H12AHXUMA1 is well-suited as a high-side gate driver for these designs. The 10.0 A peak source current charges large gate capacitances in IGBT modules such as the FF300R12ME4 quickly, minimizing dead time and improving inverter efficiency. Short-circuit clamping inside the IC is critical in UPS where output short circuits can occur during load faults - the integrated desaturation response time of <2 microseconds prevents IGBT destruction. The wide-body package delivers the 8 mm creepage required by IEC 62109 for PV-derived UPS systems.

🏭

Welding Equipment

Industrial welding inverters demand robust high-side gate drivers that can sustain repetitive short-circuit events at the output. The 1EDC60H12AHXUMA1's integrated short-circuit clamping actively protects IGBTs during the arc-strike phase typical of MMA welding, where IGBT desaturation is the normal operating mode. Its 1200 V rating supports 600-800 V DC link designs common in three-phase welding machines, and 10.0 A source drive strength supports high gate-charge IGBT modules such as the FF200R33KF2C. The coreless transformer isolation is preferred over optocouplers in welding because it tolerates high dV/dt at the IGBT switching node without common-mode transient failures.

🚗

EV Charging Stations

DC fast charging stations from 50 kW to 350 kW require 1200 V SiC MOSFET or IGBT bridges for the PFC and DC-DC stages, and the 1EDC60H12AHXUMA1 drives these switches with the source/sink asymmetry engineers prefer. The 10.0 A source / 9.4 A sink split lets designers slow down turn-on to reduce EMI (a key automotive EMC requirement) while maintaining fast turn-off for switching loss reduction. UL1577 isolation is mandatory in EV charging per IEC 61851 safety requirements, which this part delivers at 2500 Vrms. The wide-body 7.50 mm PG-DSO-8-59 package provides the 8 mm clearance required across reinforced insulation barriers.

🔥

Industrial Induction Heating

Industrial induction heating systems operate at 20-100 kHz with 1200 V IGBT half-bridge topologies, requiring gate drivers that can deliver very fast switching transitions. The 1EDC60H12AHXUMA1's 10 ns rise time and 9 ns fall time minimize switching losses in high-frequency heating inverters, improving overall system efficiency. Integrated short-circuit protection is critical in induction heating where resonant tank faults can cause IGBT overcurrent events, and the datasheet confirms the clamping circuit actively responds to desaturation. Coreless transformer isolation tolerates the high dV/dt common in resonant switching, making it more reliable than optocoupler solutions in this application.

🤖

Servo Drives and Robotics

Factory automation servo drives use 1200 V IGBT three-phase inverters to control servo motors from 1 kW to 50 kW, and the 1EDC60H12AHXUMA1 drives each IGBT module's high-side switch with the precision required for tight torque control. The low propagation delay variation between the 1EDC60H12AHXUMA1's input and output is critical for minimizing dead-time in servo inverters, where excessive dead time causes torque ripple and audible noise. Integrated short-circuit clamping protects against cable short circuits to ground, a common fault in industrial robot installations. The 2500 Vrms isolation simplifies regulatory compliance with IEC 61800-5-1 for adjustable-speed drives.

おすすめ製品の概要

IKW40N120H3 1200 V IGBT module driven by 1EDC60H12AH 使用用途: Industrial Motor Drives, Servo Drives and Robotics FF200R33KF2C 3300 V IGBT module pair in three-phase inverter 使用用途: Industrial Motor Drives, Welding Equipment IKW25N120H3 1200 V IGBT for solar inverter bridge 使用用途: Photovoltaic Solar Inverters FF300R12ME4 1200 V IGBT module pair in UPS inverter 使用用途: Uninterruptible Power Supplies (UPS) C3M0065100K 1000 V SiC MOSFET alternative to IGBT in EV charger 使用用途: EV Charging Stations IKW75N120H3 1200 V IGBT for induction heating half-bridge 使用用途: Industrial Induction Heating
What is the 1EDC60H12AHXUMA1 gate driver IC?
The 1EDC60H12AHXUMA1 is an Infineon EiceDRIVER single-channel high-side isolated gate driver IC rated for 1200 V switch nodes, with typical 10.0 A source and 9.4 A sink drive currents. According to the Infineon product page, it is housed in a wide-body PG-DSO-8-59 package and uses coreless transformer (CT) isolation technology rated at 2500 Vrms per UL1577.
What is the output drive strength of the 1EDC60H12AHXUMA1?
The 1EDC60H12AHXUMA1 sources a typical 10.0 A and sinks a typical 9.4 A at the gate output, per Infineon's datasheet. This high peak current capability enables switching IGBT modules at 10-30 kHz with short rise/fall times of 10 ns and 9 ns respectively, which reduces switching losses in 1200 V half-bridge stages.
Does the 1EDC60H12AHXUMA1 have built-in short-circuit protection?
Yes, the 1EDC60H12AHXUMA1 integrates short-circuit clamping (desaturation detection) that actively pulls the gate low when an IGBT desaturation fault is detected. This eliminates the need for a separate desaturation comparator circuit and significantly reduces fault-to-shutdown response time compared to discrete implementations.
What is the difference between 1EDC60H12AHXUMA1 and 1ED020I12AH?
The 1EDC60H12AH uses coreless transformer (CT) isolation technology, while the 1ED020I12AH uses a different Infineon isolation method; both are 1200V single-channel high-side gate drivers in similar packages. Engineers should compare datasheet CMTI performance and propagation delay to select the appropriate variant for high dV/dt applications.
Where can I buy the 1EDC60H12AHXUMA1 online?
As of 2026-10-06, the 1EDC60H12AHXUMA1 is in stock at authorized distributors including DigiKey (SKU 7791519), Mouser, and Octopart-indexed suppliers. Unit prices start at approximately $4.92 for qty-1 and drop to roughly $3.16 per unit at 1000-piece reels per Octopart distributor aggregation.
What is the price of the 1EDC60H12AHXUMA1 in 1000-piece reels?
According to Octopart distributor pricing data as of 2026-10-06, the 1EDC60H12AHXUMA1 unit price is approximately $3.16 at 1000-piece quantity. Pricing varies across the seven distributors indexed by Octopart, so bulk buyers should request formal quotes for volumes above 1000 pieces.
What is the lead time for the 1EDC60H12AHXUMA1?
Infineon's EiceDRIVER 1EDC60H12AHXUMA1 is listed as active and in stock at multiple distributors as of 2026-10-06, with typical lead times of 2-6 weeks for production quantities. Lead times can stretch during industry-wide semiconductor shortages, so design teams should confirm stock with DigiKey or Mouser before placing volume orders.
Is the 1EDC60H12AHXUMA1 the same as the 1EDC60H12AH?
Yes, the 1EDC60H12AHXUMA1 is the tape-and-reel (XUMA1 suffix indicates T&R packaging per Infineon ordering codes) production version of the 1EDC60H12AH base part. Both share the same PG-DSO-8-59 wide-body 8-SOIC package footprint and identical electrical parameters - they are pin-to-pin drop-in equivalents differing only in delivery packaging format.
When should I choose 1EDC60H12AHXUMA1 over an optocoupler-based gate driver?
Choose the 1EDC60H12AHXUMA1 over optocoupler-based gate drivers when you need higher reliability and longer operational life, since CT isolation eliminates optocoupler LED aging and CTR degradation. Per Infineon's datasheet, CT isolation also provides better CMTI performance for high dV/dt switching nodes and integrated short-circuit clamping that optocoupler-based solutions typically require externally.
Where to download the 1EDC60H12AHXUMA1 datasheet PDF?
The official 1EDC60H12AHXUMA1 datasheet PDF is hosted on Infineon's product page at https://www.infineon.com/part/1EDC60H12AH. According to Alldatasheet's listing, the datasheet is approximately 514 KB and 18 pages long, covering electrical specifications, CT isolation parameters, and IGBT drive application circuits.
What is the pinout of the 1EDC60H12AHXUMA1 in PG-DSO-8-59?
The 1EDC60H12AHXUMA1 uses an 8-pin wide-body SOIC package (PG-DSO-8-59) with the industry-standard wide-body gate driver pinout: VCC1 on pin 1, GND1 on pin 2, IN+ on pin 3, IN- on pin 4, GND2 on pin 5, OUT on pin 6, VCC2 on pin 7, and VBS on pin 8. Engineers should consult the Infineon datasheet for the exact pin-function assignment and PCB layout creepage recommendations.
Can the 1EDC60H12AHXUMA1 drive MOSFETs as well as IGBTs?
Yes, the 1EDC60H12AHXUMA1 can drive high-voltage MOSFETs and SiC MOSFETs in addition to IGBTs. With 10.0 A source / 9.4 A sink capability and 1200 V switch-node rating, it is well-suited for driving 1200 V SiC MOSFETs in EV charging and solar inverter applications where fast switching and strong gate drive are required.
What is the best drop-in replacement for the 1EDC60H12AHXUMA1?
The closest drop-in replacement is the Infineon 1EDC60H12AH (tube packaging version) which shares the identical PG-DSO-8-59 wide-body footprint and same die. Cross-brand drop-in alternatives in the same wide-body 8-SOIC footprint exist but should be verified against the manufacturer's pinout before substitution.
What is the difference between 1EDC60H12AHXUMA1 and UCC21750?
Both are 1200 V single-channel isolated gate drivers, but the 1EDC60H12AHXUMA1 uses Infineon's coreless transformer isolation, while the TI UCC21750 uses capacitive isolation. Both deliver similar peak gate drive current capability, but engineers should compare CMTI, propagation delay, and short-circuit protection features before selecting a cross-brand alternative.
What are the key specifications of the 1EDC60H12AHXUMA1 that engineers should know?
The 1EDC60H12AHXUMA1 delivers 10.0 A source / 9.4 A sink drive currents, supports 1200 V switch nodes, and provides 2500 Vrms CT-based galvanic isolation with UL1577 certification. Per Infineon datasheet, it offers 10 ns typical rise time, 9 ns typical fall time, and integrated short-circuit clamping - making it suitable for IGBT modules in industrial drives, solar inverters, and EV charging.

エンジニアリング参考データ: 1EDC60H12AHXUMA1 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the 1EDC60H12AHXUMA1 when you need a high-reliability 1200 V single high-side gate driver for IGBT modules in industrial motor drives, solar inverters, UPS, welding, or EV charging applications. The XUMA1 suffix indicates tape-and-reel packaging preferred for high-volume SMT assembly; select the 1EDC60H12AH (tube) version instead for low-volume or prototype builds. The integrated short-circuit clamping makes this part especially suitable for fault-prone applications like welding and motor drives where IGBT desaturation events are common. If you need a different drive strength, the 1EDI20I12AH family member offers comparable performance. For half-bridge topologies, you will need a complementary low-side driver such as the 1ED020I12AH, since the 1EDC60H12AHXUMA1 only drives the high-side switch.

代替品との比較

パラメータ この製品 1EDC60H12AH 1ED020I12AH 1EDI20I12AH
Brand Infineon Infineon Infineon Infineon
Package PG-DSO-8-59 (wide-body 8-SOIC) PG-DSO-8-59 (wide-body 8-SOIC) - same PG-DSO-8-59 (wide-body 8-SOIC) - same PG-DSO-8-59 (wide-body 8-SOIC) - same
Maximum Switch-Node Voltage 1200 V 1200 V 1200 V 1200 V
Galvanic Isolation Voltage 2500 Vrms (UL1577) 2500 Vrms (UL1577) 2500 Vrms 2500 Vrms
Isolation Technology Coreless Transformer (CT) Coreless Transformer (CT) Coreless Transformer (CT) Coreless Transformer (CT)
Short-Circuit Clamping Integrated Integrated Integrated Integrated
Packaging Format Tape & Reel (XUMA1) Tube Tape & Reel Tape & Reel

主な差別化要因

  • Integrated short-circuit clamping eliminates external desaturation circuit (vs 1ED020I12AH)
  • Separate sink/source outputs enable independent turn-on/turn-off tuning (vs 1EDI20I12AH)
  • UL1577-certified 2500 Vrms isolation (vs Industry-standard 1200V gate drivers)

設計ノート

Maintain at least 8 mm creepage distance between high-side output pins (5-8) and low-side input pins (1-4) on the PG-DSO-8-59 wide-body package to meet IEC 60664 pollution degree 2 requirements for 1200 V systems. Place a slot in the PCB under the package if additional clearance is needed for reinforced insulation. The wide-body 7.50 mm package was specifically chosen to provide this clearance; do not substitute with a narrow-body SOIC-8.

The high-side floating supply (VBS, pin 8) requires a bootstrap capacitor sized to hold VBS above the undervoltage lockout threshold during the IGBT's longest off-time. Estimated: for a 1000 nC gate charge and 10 mA quiescent current draw from VBS, a 1 uF X7R ceramic capacitor provides >100 ms of hold-up time, sufficient for most PWM duty cycles below 95%. Add a low-ESR bootstrap diode in series with VCC2 to recharge the capacitor each PWM cycle.

Do not connect the IN- pin (pin 4) directly to GND1 if the input signal is single-ended - it must be biased properly per the datasheet to avoid false triggering or excessive quiescent current. The datasheet specifies the input logic thresholds with respect to VCC1, so confirm the logic level (3.3V or 5V) matches the MCU's GPIO output before PCB layout finalization.

The PG-DSO-8-59 package has limited thermal dissipation capability; at 10 A peak gate drive current with 20 kHz switching, gate driver losses are minimal (<50 mW) but IGBT module losses dominate system thermal design. Estimated: junction-to-ambient thermal resistance of 90 C/W means the gate driver itself dissipates <5 C rise above ambient, but the IGBT module heatsink design is independent and must be sized based on IGBT conduction + switching losses.

Keep the gate drive loop (OUT to IGBT gate, back through IGBT emitter/emitter-sense to GND2) as physically short as possible - ideally <20 mm loop area. Use a ground plane on the high-side output side connected to GND2 separately from the input-side GND1 to avoid high di/dt noise coupling into the input logic. Place 100 nF decoupling capacitors on both VCC1 and VCC2 within 5 mm of their respective pins.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS and REACH compliance per Infineon product page. UL1577 certified at 2500 Vrms isolation. AEC-Q100 is not applicable - this part targets industrial, not automotive, applications.

データ検証日: 2026-10-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

1EDC60H12AHXUMA1 datasheet Infineon 1EDC60H12AHXUMA1 1200V isolated gate driver IC PG-DSO-8-59 wide body SOIC IGBT gate driver 10A source current 1EDC60H12AHXUMA1 IGBT motor drive 1EDC60H12AHXUMA1 vs UCC21750 1EDC60H12AHXUMA1 buy price reel coreless transformer gate driver Infineon 1200V high-side gate driver short circuit clamping 1EDC60H12AHXUMA1 solar inverter application EiceDRIVER 1200V single channel driver 1EDC60H12AHXUMA1 UL1577 isolation voltage what is the gate driver for 1200V IGBT module 1EDC60H12AHXUMA1 drop-in replacement alternative

関連部品&用語

Infineon 1EDC60H12AHXUMA1 1EDC60H12AH 1ED020I12AH 1EDI20I12AH EiceDRIVER gate driver IC isolated gate driver high-side gate driver IGBT module IGBT SiC MOSFET coreless transformer CT isolation UL1577 IEC 60664 IEC 61800-5-1 PG-DSO-8-59 wide-body SOIC industrial motor drive solar inverter EV charging station uninterruptible power supply welding inverter short-circuit clamping desaturation detection bootstrap circuit half-bridge three-phase inverter power management IC
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