5AGXMA3D4F27I5G - Arria V GX FPGA, 156K LE, 672-FCBGA | Intel
部品番号: 5AGXMA3D4F27I5G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $762.79 | $762.79 |
| 10 | $715.5 | $7,155.00 |
| 100 | $655.4 | $65,540.00 |
| 500 | $612.1 | $306,050.00 |
| 1,000 | $580.25 | $580,250.00 |
5AGXMA3D4F27I5G 概要
An FPGA (field-programmable gate array) is a semiconductor device whose digital logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacturing, allowing engineers to implement custom hardware pipelines, parallel processing engines, and interface bridges without an ASIC NRE. FPGAs sit at the top of the programmable-logic taxonomy (programmable logic device -> FPGA -> SRAM-based FPGA -> Arria V family) and compete against microcontrollers, DSPs, and GPUs in latency-sensitive and high-throughput workloads.
Key feature highlights of 5AGXMA3D4F27I5G include 156,000 logic elements organized in adaptive logic modules (ALMs), 8 integrated transceivers suitable for multi-gigabit serial links, hard memory controllers, and PCIe Gen2 hard IP blocks. The integrated transceivers support protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, CPRI, and Serial RapidIO, reducing external PHY cost. The flip-chip BGA package provides low-inductance power delivery and superior thermal performance for industrial-temperature operation from -40C to +100C.
Architecturally, the Arria V GX uses a logic-economy fabric with 8-input fracturable look-up tables, embedded DSP blocks (each capable of 18x18 or 27x27 multiply-accumulate), and 10.6 Mbit of embedded memory per tile. Configuration is loaded through JTAG, serial flash, or passive parallel interfaces, with bitstream encryption and design-security features available.
Typical applications include industrial machine vision and video processing cards, telecom baseband pre-processing, military/aerospace signal processing, and PCIe-based coprocessor cards. The Arria V GX balances transceiver count, logic density, and power for mid-range embedded designs.
When designing with this part, plan power-sequencing for the 1.1 V core, 2.5 V/3.3 V auxiliary, and transceiver supplies, and follow Intel's pin-out guidelines for the F27 672-ball package to avoid signal-integrity issues on high-speed serial links.
This page synthesizes distributor pricing, the most current 5AGXMA3D4F27I5G inventory data, same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 5AGXMA3D4F27I5G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5AGXMA3D4F27I5G （同一形状・フットプリント） — 相違点: Family, Mounting Type, Package, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
5AGXMA3D4F27I3G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5AGXMA5D4F27I5G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5AGXMA7D4F27I5G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5AGXMA3D4F27I5G-ND
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5CGXFC5C6F27C7N
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →5AGXMA3D4F27I5G 最大定格＆電気的特性
| Family | Arria V GX |
| Logic Elements (LE) | 156,000 |
| Embedded Memory Bits | 11,746,304 |
| General-Purpose I/Os | 336 |
| パッケージ | 672-ball FCBGA (F27) |
| Package Body Size | 27 x 27 mm |
| Seated Height | 2.7 mm |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 28 nm |
| Transceivers | Integrated multi-gigabit transceivers |
| Hard IP Blocks | PCIe Gen2, memory controllers |
| Temperature Grade | Industrial (-40C to +100C) |
| Configuration | JTAG, serial flash, passive parallel |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (BGA) |
5AGXMA3D4F27I5G 27 x 27 mm ピン配置ガイド
5AGXMA3D4F27I5G (27 x 27 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5AGXMA3D4F27I5G.
詳細は データシート をご参照ください。
主な用途
5AGXMA3D4F27I5G の用途: 6 件s: Industrial Machine Vision, Telecom Baseband Pre-Processing, Aerospace and Defense Signal Processing, PCIe Coprocessor Cards, Video Broadcast and Studio Equipment, Medical Imaging Systems.
Industrial Machine Vision
The 5AGXMA3D4F27I5G's 156,000 logic elements and 8 multi-gigabit transceivers make it well suited for industrial machine-vision cameras and frame grabbers that aggregate image data from multiple CoaXPress or GigE Vision sensors. The Arria V GX fabric can implement real-time pre-processing pipelines (debayering, color correction, edge detection) in hardware while feeding compressed streams over PCIe Gen2 into a host CPU. With an industrial -40C to +100C junction range, the part tolerates factory-floor enclosures without active thermal management beyond a simple heatsink, and 11.7 Mbit of embedded memory buffers full-HD frames on-chip to reduce external DDR traffic.
おすすめ
Telecom Baseband Pre-Processing
In LTE and 5G small-cell baseband cards, the 5AGXMA3D4F27I5G handles CPRI and OBSAI fronthaul links through its integrated transceivers, offloading DSP-intensive pre-processing from the host ASIC. Its hard PCIe Gen2 IP enables direct coupling to baseband SoCs across a backplane, while 156K logic elements accommodate custom channelization and crest-factor-reduction (CFR) blocks. Industrial temperature grade supports outdoor small-cell cabinets, and the F27 672-ball package provides the controlled-impedance escape required for 6+ Gbps serial links without external retimers.
おすすめ
Aerospace and Defense Signal Processing
Defense signal-processing subsystems in radar and electronic-warfare platforms benefit from the 5AGXMA3D4F27I5G's combination of mid-range logic density, multi-gigabit serial I/O, and -40C to +100C industrial temperature range. The Arria V GX fabric can implement digital down-conversion (DDC), pulse compression, and beamforming filters in parallel hardware, processing multiple RF channels simultaneously. Design-security features (bitstream encryption with AES) protect sensitive IP from extraction, while the 28 nm low-power process keeps system-level power budgets compatible with size, weight, and power (SWaP)-constrained platforms.
おすすめ
PCIe Coprocessor Cards
The hard PCIe Gen2 IP block in the 5AGXMA3D4F27I5G enables direct integration as a PCIe x4 or x8 endpoint coprocessor for accelerator cards, offloading compute-intensive tasks such as encryption, compression, or packet processing from the host CPU. With 156K logic elements and 11.7 Mbit embedded memory, the FPGA can host complete custom compute pipelines while transferring results over DMA. The 672-ball F27 package offers a compact 27 x 27 mm footprint ideal for half-height, half-length PCIe card form factors used in telecom and industrial servers.
おすすめ
Video Broadcast and Studio Equipment
Broadcast infrastructure including video routers, format converters, and on-air graphics engines uses the 5AGXMA3D4F27I5G to handle multiple SDI streams (3G-SDI, 6G-SDI, and 12G-SDI over coax) using soft multi-rate SERDES cores alongside the FPGA fabric. The transceiver-rich Arria V GX architecture simplifies multi-link aggregation, while 156K logic elements provide ample headroom for color-space conversion and frame-rate adaptation. Industrial temperature support and the FCBGA package's robust thermal path suit 24/7 operation in broadcast equipment rooms.
おすすめ
Medical Imaging Systems
Medical imaging modalities such as ultrasound, endoscopy, and intra-operative imaging rely on the 5AGXMA3D4F27I5G for real-time beamforming, image reconstruction, and signal conditioning. The FPGA's parallel DSP blocks and embedded memory handle multi-channel RF data streams, while its multi-gigabit transceivers connect to high-speed analog front-ends. Industrial temperature support allows integration into portable cart-based systems, and the F27 672-ball FCBGA package balances density with PCB manufacturability for medical OEM production volumes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5AGXMA3D4F27I5G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5AGXMA3D4F27I3G | 5AGXMA5D4F27I5G | 5AGXMA7D4F27I5G | 5CGXFC5C6F27C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FCBGA (F27) | 672-ball FCBGA (F27) - same | 672-ball FCBGA (F27) - same | 672-ball FCBGA (F27) - same | 672-ball FCBGA (F27) - same |
| Logic Elements | 156,000 | 156,000 | approximately 190,000 | approximately 242,000 | approximately 77,000 |
| Embedded Memory | 11,746,304 bits | 11,746,304 bits | approximately 13,900,000 bits | approximately 17,800,000 bits | approximately 4,460,000 bits |
| Family | Arria V GX | Arria V GX | Arria V GX | Arria V GX | Cyclone V GX |
| Speed Grade | -5 | -3 (slower) | -5 | -5 | -7 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial / Industrial (varies) |
| Process Technology | TSMC 28 nm | TSMC 28 nm | TSMC 28 nm | TSMC 28 nm | TSMC 28 nm |
主な差別化要因
- Mid-range Arria V GX density at 156K LE （vs 5AGXMA5D4F27I5G)
- Industrial temperature rating （vs 5AGXMA3D4F27C5G)
- Higher transceiver count than Cyclone V GX （vs 5CGXFC5C6F27C7N)
設計ノート
The 5AGXMA3D4F27I5G requires multiple supply rails: 1.1 V core (VCC), 2.5 V/3.3 V auxiliary (VCCAUX), and dedicated transceiver supplies (VCCR, VCCT) per Intel's Arria V GX device datasheet. Decoupling must follow the recommended capacitor network: 100 nF and 10 nF X7R ceramics placed within 100 mils of each VCC pin, plus bulk capacitors at the regulator output. Use a sequencer to enforce core-before-auxiliary power-up to prevent latch-up; the datasheet specifies a maximum 200 ms delta between rails. Estimated: at 100 percent logic utilization and full transceiver activity, expect total power around 8-12 W requiring a small heatsink or 400 LFM airflow.
Route all high-speed transceiver channels with controlled 100 ohm differential impedance and 4-6 layer stack-up with continuous reference ground planes. Place AC-coupling capacitors within 200 mils of the transmitter output, and avoid vias on differential pairs when possible. Use Intel's pin-out file (F27 672-ball package) to assign transceiver channels to shortest-match routes to minimize skew. Maintain 3W rule spacing between adjacent high-speed serial links to suppress crosstalk below -40 dB at 6 Gbps.
The industrial -40C to +100C junction range defines the operational thermal envelope; at sustained 100 percent utilization the FCBGA package dissipates significant heat. Mount a 25 x 25 mm copper heatsink with thermal interface material (1.5 W/m-K or higher) directly above the package lid, and connect to chassis airflow. For sealed enclosures, design for at least 6 W continuous dissipation through the PCB by adding thermal vias (0.3 mm pitch array, 0.5 oz plating) under the exposed pad of the BGA.
Common pitfalls when designing with the 5AGXMA3D4F27I5G include: (1) failing to install the correct configuration flash with the proper ASx4 or JTAG mode pin straps, causing configuration failure on power-up; (2) exceeding the 1.1 V core voltage tolerance (plus or minus 30 mV) during transients, which can trigger brown-out detection; (3) not enabling the on-chip pull-ups on unused user I/Os to prevent floating inputs; and (4) omitting the JTAG TCK pull-down, leaving the TAP controller in an indeterminate state at boot.
コンプライアンス情報
RoHS and REACH compliance per Intel product page. AEC-Q100 qualification is not applicable for FPGAs targeting industrial/military rather than automotive-qualified designs. Industrial temperature grade (-40C to +100C) verified.
