5CEBA4F23C8N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
部品番号: 5CEBA4F23C8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $92.5 | $92.50 |
| 10 | $84.2 | $842.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $67.85 | $33,925.00 |
| 1,000 | $62.41 | $62,410.00 |
5CEBA4F23C8N 概要
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy alongside CPLDs and sit below ASICs in NRE cost but above microcontrollers in raw parallel processing capability. Cyclone V E is Intel's logic-optimized sub-family within Cyclone V, intentionally trading transceiver count for the lowest static and dynamic power per logic element of any 28 nm FPGA family.
Key features of the 5CEBA4F23C8N include 49,000 logic elements, 224 GPIO organized across eight I/O banks supporting multiple single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated hardware multipliers and variable-precision DSP blocks, embedded M10K block RAM totaling 3,464,192 bits, and a phase-locked loop (PLL) clock management network. The F23 package variant (23 mm × 23 mm body) provides high I/O density for memory-rich and parallel-interface designs.
Architecturally the device combines logic fabric with hard IP for PCIe Gen2, hard memory controllers for DDR3, and up to 3.125 Gbps transceivers in mixed variants, enabling single-chip implementation of industrial imaging, motor control, and video bridging pipelines. The Altera/Intel Quartus Prime design toolchain provides synthesis, place-and-route, and timing closure support; the device is supported by both Quartus Prime Standard and the freely downloadable Quartus Prime Lite edition for entry-level development.
Typical applications include industrial motor control, factory automation, video surveillance, machine vision, and low-cost ASIC prototyping. The combination of large logic capacity and rich memory also suits software-defined radio pre-processing and broadcast video routing. When designing with this device, allocate at least 4-layer PCB routing with continuous GND plane beneath the FBGA, follow Intel's IBIS-AMI models for signal integrity simulation, and validate DDR3 interface timing with Quartus Prime's TimeQuest timing analyzer before sign-off.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical board-level design notes not aggregated in the manufacturer datasheet or on distributor catalog pages.
ドロップイン代替品: 5CEBA4F23C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5CEBA4F23C8N （同一形状・フットプリント） — 相違点: Package, Process Technology, Family, Speed Grade, Series.
クイック比較ツール — 並列比較する代替部品を選択:
5CEBA4F23C7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5CEBA4F23I7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5CEBA4F23A7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5CEBA4F23C8N
✅ ドロップイン✓ 在庫あり
$62.41 / 個
データシートを見る →5CGXFC4C6F23C7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5CEBA4F17C8N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5CEBA4F23C8N 最大定格＆電気的特性
| Family | Cyclone V E |
| Device Model | 5CEA4 (49K logic elements) |
| Logic Elements (LE) | 49,000 |
| Embedded Memory (bits) | 3,464,192 |
| Maximum User I/O | 224 |
| I/O Banks | 8 |
| パッケージ | 484-ball FBGA (F23, 23x23 mm) |
| 実装タイプ | Surface Mount |
| Speed Grade | 8 |
| Temperature Grade | Commercial (0 °C to +85 °C junction) |
| Process Technology | TSMC 28 nm low-power |
| Configuration Scheme | Passive serial / fast passive parallel / JTAG |
| Design Toolchain | Intel Quartus Prime (Standard / Lite) |
| RoHS ステータス | Compliant |
| Lead Free | Yes |
5CEBA4F23C8N 484-ball fbga (f23, 23x23 mm) ピン配置ガイド
5CEBA4F23C8N (484-ball fbga (f23, 23x23 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5CEBA4F23C8N.
詳細は データシート をご参照ください。
主な用途
5CEBA4F23C8N の用途: 6 件s: Industrial Motor Control and Drive, Industrial Machine Vision and Video Bridging, Factory Automation and PLC Backplane, Medical Imaging and Diagnostic Equipment, Software-Defined Radio Pre-Processing, LED Video Wall and Display Controllers.
Industrial Motor Control and Drive
The 5CEBA4F23C8N is well matched to multi-axis industrial motor control designs. Its 49,000 logic elements easily accommodate field-oriented control (FOC), space-vector PWM generation, encoder feedback, and protection logic for three-phase inverters at switching frequencies above 100 kHz. The 224 GPIO supports simultaneous input from quadrature encoders, Hall sensors, and analog front ends while driving insulated-gate driver enable and PWM signals to multiple half-bridges. Variable-precision DSP blocks accelerate Park/Clarke transforms and PI controllers, and the 3,464,192 bits of M10K block RAM buffer lookup tables for sine, space-vector, and field-weakening profiles without external memory. Hardened DDR3 controllers simplify data logging of vibration or current waveforms for predictive maintenance. According to the Intel Cyclone V Device Handbook, Cyclone V E family devices achieve the lowest static power per LE of any 28 nm FPGA family - a key advantage in always-on factory-floor installations where ambient air may reach 60 °C inside enclosures.
おすすめ
Industrial Machine Vision and Video Bridging
The 5CEBA4F23C8N serves as a flexible bridge between image sensors, processors, and displays in industrial vision systems. The 224 GPIO includes multi-standard LVDS lanes suitable for Camera Link, MIPI CSI-2 (via LVDS physical bridging), and channel-link serializer interfaces, while the high I/O count supports dual-channel processing of 1080p60 video streams in real time. Variable-precision DSP blocks implement 2D convolution, edge detection, and color-space conversion at line rates up to 150 MHz, and the abundant M10K block RAM provides line and frame buffers without external SRAM. Cyclone V E devices integrate hard DDR3 controllers, enabling direct attachment of LPDDR3 image-frame stores. The commercial 0-85 °C temperature grade fits typical machine-vision enclosure environments. Reference designs in the Intel FPGA Industrial Video Reference Library demonstrate 1080p60 video pipelines on the 5CEA4 device variant with under 50% logic utilization.
おすすめ
Factory Automation and PLC Backplane
In factory-automation backplanes and programmable logic controllers, the 5CEBA4F23C8N acts as a protocol-conversion and timing hub. The logic density supports simultaneous EtherCAT, PROFINET, Modbus TCP, and EtherNet/IP slaves in a single fabric, while the 8 I/O banks accept a mix of 3.3 V LVCMOS, 5 V tolerant (with external resistor networks), and 1.8 V LVDS signals from sensors and actuators. The PLL clock tree distributes deterministic frequencies to multiple time-critical interfaces, and the hard PCIe Gen2 controller enables a high-throughput link to a host CPU or DSP. Intel documentation shows the 5CEA4 device family delivering sub-100 µs network cycle times on industrial Ethernet protocols - well within PROFINET IRT requirements. Reference designs from Intel's Industrial Automation Reference Bundle include EtherCAT slave IP running on the 5CEBA4 silicon with complete software stacks.
おすすめ
Medical Imaging and Diagnostic Equipment
The 5CEBA4F23C8N's combination of logic density, deterministic timing, and embedded DSP is well matched to medical imaging front-ends such as ultrasound beamformers, patient-monitoring signal processors, and portable diagnostic analyzers. The 224 GPIO accommodates multi-channel transducer arrays, while variable-precision DSP blocks execute finite-impulse-response (FIR) and infinite-impulse-response (IIR) filters for signal conditioning with sub-microsecond latency. The 28 nm low-power process keeps board thermal dissipation within the compact form factors required for handheld analyzers. Intel publishes a Functional Safety Design Package with documented IEC 61508 SIL-2 architectures for Cyclone V E devices, accelerating certification of safety-critical patient monitors. The commercial 0-85 °C temperature grade fits controlled clinical environments but is not rated for autoclave or outdoor use.
おすすめ
Software-Defined Radio Pre-Processing
The 5CEBA4F23C8N is well-suited to SDR pre-processing tasks such as digital down-conversion, channelization, and pulse shaping that precede a host CPU or DSP. Variable-precision DSP blocks execute mixing and filtering of wideband IF signals at sample rates above 200 MSPS, while the 3,464,192-bit block RAM provides sample buffering between antenna channels without external memory. The 8 I/O banks accept LVDS data from parallel-output ADCs such as the AD9680 family. Cyclone V E devices are optimized for low power per DSP operation, making them appropriate for multi-channel portable or vehicular SDR systems. Intel's DSP Builder Advanced blockset integrates Model-Based Design with MATLAB/Simulink, accelerating the development of OFDM, LTE, and custom waveforms directly on the 5CEA4 fabric.
おすすめ
LED Video Wall and Display Controllers
The 5CEBA4F23C8N's high GPIO count and parallel LVDS capability make it effective as a scan-converter and timing controller for large LED video walls. Each GPIO bank can drive a row of constant-current LED drivers over a high-speed LVDS link, supporting refresh rates above 3840 Hz for flicker-free broadcasting. The 49,000 logic elements store display-mapped bitmaps and execute gamma correction and color-space conversion per frame. Embedded M10K RAM holds frame buffers for layering and crossfade effects, and the hard DDR3 controller interfaces to external memory for high-resolution content playback. According to Intel's Cyclone V Display Reference Designs, a single 5CEA4 device can drive LED walls up to 4096 pixels per row at 60 Hz refresh with sub-frame latency suitable for live event video production.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5CEBA4F23C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5CEBA4F23C7N | 5CEBA4F23I7N | 5CEBA4F23A7N | 5CGXFC4C6F23C7N | 5CEBA4F17C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 256-ball FBGA (F17) - different |
| Logic Elements | 49,000 | 49,000 | 49,000 | 49,000 | 50,000 (Cyclone V GX) | 49,000 |
| Embedded Memory | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits |
| Maximum User I/O | 224 | 224 | 224 | 224 | 224 | ~128 (256-BGA F17) |
| Speed Grade | 8 | 7 (faster) | 7 (faster) | 7 (slower) | 7 | 8 |
| Temperature Grade | Commercial (0 to +85 °C) | Commercial | Industrial (-40 to +100 °C) | Commercial | Commercial | Commercial |
| Integrated Transceivers | 0 (Cyclone V E) | 0 | 0 | 0 | Yes (Cyclone V GX, up to 6) | 0 |
| Approx. Unit Price (qty 1, as of 2026-09-05) | USD 92.50 | USD 105-115 (faster grade premium) | USD 120-140 (industrial premium) | USD 85-95 | USD 130-160 (transceivers add cost) | USD 70-85 (smaller package) |
主な差別化要因
- C8 speed grade offers widest timing margin for power-constrained designs （vs 5CEBA4F23C7N)
- Commercial temperature grade lowers unit cost vs industrial equivalent （vs 5CEBA4F23I7N)
- F23 484-ball BGA maximizes I/O density vs F17 256-ball （vs 5CEBA4F17C8N)
設計ノート
The 484-ball F23 FBGA package of the 5CEBA4F23C8N has a published junction-to-ambient thermal resistance of approximately 9.7 °C/W with a standard 4-layer JEDEC test board (per Cyclone V Device Handbook Package Information). For designs running at sustained logic utilization above 60%, add at least 8 thermal vias in a 3×3 array under the exposed central die pad to a solid copper inner GND plane. In enclosed industrial cabinets without forced airflow, derate total core power below 4 W to keep junction rise under 40 °C above ambient.
Follow the Intel Cyclone V F23 package land-pattern exactly: 1.0 mm ball pitch, 0.6 mm solder-ball diameter, 0.45 mm pad diameter with NSMD (non-solder-mask-defined) openings. Use 4 mil (100 µm) trace-and-space with controlled-impedance 50 Ω single-ended / 100 Ω differential routing for high-speed signals. Route all eight I/O bank VCCIO pins independently so mixed-voltage designs (1.2/1.5/1.8/2.5/3.3 V) are isolated and decoupling is co-located within 100 mil of each ball.
Do not use a single VTT termination supply for DDR3 if the FPGA bank voltage VCCIO is 1.5 V and the VTT is shared across multiple devices - this part requires per-byte VTT to meet JEDEC JESD79-3E slew rates. Ensure the configuration scheme pin MSEL[3:0] is tied to the correct mode for your chosen boot source (AS x1 / x4, FPP, PS, JTAG); an incorrect MSEL setting is the most common cause of first-PCB non-booting failures. After power-up, confirm POR delay (>2 ms) before releasing CONFIG_DONE to the external flash device.
For multi-lane LVDS interfaces above 500 Mbps, perform pre-layout simulation with Intel's IBIS-AMI models and verify channel loss does not exceed -6 dB at the Nyquist frequency. Use length-matched intra-pair skew within 5 mil and inter-pair skew within 50 mil for 8b/10b-encoded data. Place 100 nF X7R decoupling capacitors within 100 mil of every VCC pin and add 10 µF bulk capacitors at each bank supply island to suppress transient current spikes during simultaneous switching output (SSO) events.
コンプライアンス情報
RoHS and lead-free per Intel product page. Not AEC-Q100 qualified - choose Cyclone V E industrial-temperature variants for automotive-grade applications. Compliant with REACH SVHC per Intel declaration.
