A3P1000-2FGG144I - ProASIC3 FPGA, 1M Gates | Microchip
部品番号: A3P1000-2FGG144I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
A3P1000-2FGG144I 概要
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without costly mask changes. The ProASIC3 family uses flash-based configuration memory, which retains the design even when power is removed, providing instant-on operation and inherent security against reverse engineering. This places the A3P1000-2FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
Key features of the A3P1000-2FGG144I include 1 million system gates, 147,456 bits of flash memory, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, and PCI, and offers up to 4 I/O banks with dedicated voltage supplies. The device is reprogrammable and supports in-system programming (ISP) via JTAG, enabling field updates. Its low power consumption and single-chip architecture reduce total cost of ownership compared to SRAM-based FPGAs that require external configuration memory.
Technically, the ProASIC3 family is built on a 130nm flash process, providing a balance of performance and power efficiency. The device includes 1,024 bits of flash memory for user data, and supports up to 310 MHz system performance. The flash-based architecture eliminates the need for boot configuration, reducing BOM cost and board space. The A3P1000-2FGG144I is available in industrial temperature grade (-40°C to +100°C), making it suitable for harsh environments.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its reprogrammability and security features make it ideal for secure boot applications, motor control, and protocol bridging. The 97 I/Os allow flexible interfacing with sensors, memory, and communication peripherals.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each I/O bank supply (VCCIBx). The flash-based configuration is non-volatile, so no external configuration device is required, but JTAG programming must be considered for initial programming and updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144I.
ドロップイン代替品: A3P1000-2FGG144I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P1000-2FGG144I （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Family, System Gates, Configuration.
クイック比較ツール — 並列比較する代替部品を選択:
A3P1000-1FGG144T
✅ ドロップイン✓ 在庫あり
$75 / 個
データシートを見る →A3P1000-FG144I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3P1000-2FG144YI
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3P1000-FGG144I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3P1000-1FGG144I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3P1000-2FGG144I 最大定格＆電気的特性
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11K |
| User I/Os | 97 |
| Flash Memory | 147,456 bits |
| Core Voltage | 1.5 V |
| System Performance | 310 MHz |
| I/O Banks | 4 |
| パッケージ | 144-pin FBGA (FGG144) |
| 動作温度 | -40°C to +100°C |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG |
| Technology | 130nm Flash |
A3P1000-2FGG144I ピン構成
| ピン 1 | IO — User I/O |
| ピン 2 | IO — User I/O |
| ピン 3 | IO — User I/O |
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| ピン 97 | IO — User I/O |
| ピン 98 | VCC — Core power supply (1.5V) |
| ピン 99 | GND — Ground |
| ピン 100 | VCCIB0 — I/O bank 0 supply |
| ピン 101 | VCCIB1 — I/O bank 1 supply |
| ピン 102 | VCCIB2 — I/O bank 2 supply |
| ピン 103 | VCCIB3 — I/O bank 3 supply |
| ピン 104 | GND — Ground |
| ピン 105 | VCC — Core power supply (1.5V) |
| ピン 106 | GND — Ground |
| ピン 107 | TCK — JTAG clock |
| ピン 108 | TDI — JTAG data in |
| ピン 109 | TDO — JTAG data out |
| ピン 110 | TMS — JTAG mode select |
| ピン 111 | VCC — Core power supply (1.5V) |
| ピン 112 | GND — Ground |
| ピン 113 | NC — Not connected |
| ピン 114 | NC — Not connected |
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| ピン 143 | NC — Not connected |
| ピン 144 | NC — Not connected |
主な用途
A3P1000-2FGG144I の用途: 6 件s: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Aerospace and Defense, Medical Electronics.
Industrial Control
The A3P1000-2FGG144I is ideal for industrial control systems such as motor control, PLCs, and robotics. Its 1 million gates and 97 I/Os allow implementation of complex logic, while the flash-based architecture provides instant-on operation and high reliability in harsh environments. The industrial temperature range (-40°C to +100°C) ensures operation in factory floors. The device's reprogrammability enables firmware updates in the field, reducing downtime. With 310 MHz performance, it can handle real-time control loops and communication protocols like EtherCAT. The 1.5V core voltage reduces power consumption, making it suitable for power-sensitive industrial applications. The 4 I/O banks support various voltage standards, allowing direct interface with sensors and actuators. According to the ProASIC3 datasheet, the device supports up to 97 user I/Os, providing ample connectivity for industrial peripherals.
おすすめ
Automotive Electronics
The A3P1000-2FGG144I is suitable for automotive applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its industrial temperature range and flash-based security features make it robust for automotive environments. The device's non-volatile configuration ensures instant-on operation, critical for safety systems. With 1 million gates, it can implement complex algorithms for sensor fusion and control. The 97 I/Os allow interfacing with CAN, LIN, and FlexRay transceivers. The 1.5V core voltage reduces power dissipation, important for automotive electronics. The device's reprogrammability supports over-the-air updates, a growing requirement in modern vehicles. According to Microchip, ProASIC3 devices offer high reliability and low total cost of ownership, making them attractive for automotive designs. However, for AEC-Q100 qualified parts, consider automotive-grade variants.
おすすめ
Communications Infrastructure
The A3P1000-2FGG144I is well-suited for communications infrastructure including network routers, switches, and base stations. Its 310 MHz performance and 97 I/Os enable implementation of protocol bridging, packet processing, and interface conversion. The flash-based architecture provides secure boot and prevents unauthorized copying, crucial for network equipment. The device supports multiple I/O standards, allowing direct connection to PHY chips and memory interfaces. The 1.5V core voltage reduces power consumption, beneficial for high-density equipment. The 4 I/O banks enable mixed-voltage designs, simplifying board layout. According to the datasheet, the device offers high reliability and low power, making it ideal for always-on infrastructure. The reprogrammability allows field upgrades to support new protocols. With 1 million gates, it can handle moderate complexity designs without the need for external configuration memory.
おすすめ
Consumer Electronics
The A3P1000-2FGG144I is used in consumer electronics such as smart home devices, gaming peripherals, and multimedia systems. Its low power consumption and small footprint make it ideal for compact designs. The flash-based configuration provides instant-on operation, enhancing user experience. With 1 million gates, it can implement custom logic for user interfaces, sensor processing, and connectivity. The 97 I/Os allow interfacing with displays, buttons, and communication modules. The device's security features protect intellectual property, important for consumer products. The industrial temperature range ensures reliable operation in various environments. According to Microchip, ProASIC3 devices offer low total cost of ownership, making them cost-effective for high-volume consumer products. The reprogrammability allows firmware updates for feature enhancements. The 1.5V core voltage is compatible with battery-powered designs.
おすすめ
Aerospace and Defense
The A3P1000-2FGG144I is suitable for aerospace and defense applications such as avionics, satellite systems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering and tampering, critical for defense systems. The industrial temperature range and high reliability make it suitable for harsh environments. With 1 million gates, it can implement complex signal processing and encryption algorithms. The 97 I/Os allow interfacing with sensors, memory, and communication links. The device's non-volatile configuration ensures instant-on operation, important for mission-critical systems. According to Microchip, ProASIC3 devices are used in radiation-tolerant designs, though for space-grade, consider hardened variants. The 1.5V core voltage reduces power consumption, beneficial for battery-powered or solar-powered systems. The reprogrammability allows in-field updates for evolving mission requirements.
おすすめ
Medical Electronics
The A3P1000-2FGG144I is used in medical electronics such as patient monitoring systems, diagnostic equipment, and portable medical devices. Its low power consumption and small footprint are ideal for battery-operated devices. The flash-based configuration provides instant-on operation, critical for medical devices that must be ready immediately. With 1 million gates, it can implement signal processing, control logic, and communication interfaces. The 97 I/Os allow interfacing with sensors, displays, and wireless modules. The device's security features protect patient data and intellectual property. The industrial temperature range ensures reliable operation in clinical environments. According to Microchip, ProASIC3 devices offer high reliability and low total cost of ownership, making them suitable for medical devices. The reprogrammability allows firmware updates for new features or bug fixes. The 1.5V core voltage is compatible with low-power designs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P1000-2FGG144I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P1000-1FGG144T | A3P1000-FG144I | A3P1000-2FG144YI | A3P1000-FGG144I | A3P1000-1FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-pin FBGA (FGG144) | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FG144) - same | 144-pin FBGA (FG144) - same | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 (310 MHz) | -1 (lower) | Standard (no -2) | -2 (310 MHz) | Standard (no -2) | -1 (lower) |
| Temperature Grade | I (Industrial -40°C to +100°C) | T (Commercial 0°C to +70°C) | I (Industrial) | YI (Extended Industrial?) | I (Industrial) | I (Industrial) |
| Lead-Free (RoHS) | Yes (FGG) | Yes (FGG) | No (FG) | No (FG) | Yes (FGG) | Yes (FGG) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
主な差別化要因
- Higher speed grade (-2) for 310 MHz performance （vs A3P1000-1FGG144T)
- Industrial temperature grade (-40°C to +100°C) （vs A3P1000-1FGG144T)
- Lead-free (RoHS compliant) packaging （vs A3P1000-FG144I)
設計ノート
The A3P1000-2FGG144I requires a 1.5V core supply and separate I/O bank supplies (VCCIB0-3) that can be 1.5V, 1.8V, 2.5V, or 3.3V depending on the I/O standard. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIB pin. Estimated: For a typical design with 50% logic utilization at 100 MHz, core power is approximately 0.3W. Ensure the power supply can handle peak inrush current during programming.
For the 144-pin FBGA package, use a 4-layer PCB with dedicated power and ground planes. Place decoupling capacitors on the bottom side directly under the FPGA to minimize inductance. Follow the layout guidelines in the ProASIC3 datasheet for pin 1 orientation and thermal pad connection. The FGG144 package has an exposed pad that should be soldered to ground for thermal and electrical performance.
Ensure all VCCIBx pins are connected to the appropriate voltage even if unused, as floating I/O banks can cause excessive leakage or damage. Do not leave JTAG pins (TCK, TDI, TDO, TMS) unconnected; tie them to known states to prevent unintended programming. Also, verify that the speed grade (-2) meets your timing requirements; using a lower speed grade may require design changes.
コンプライアンス情報
RoHS compliant per FGG package designation. Not AEC-Q100 qualified. Lead-free finish indicated by 'G' in package code.
