A3P125-VQG100 ProASIC3 Flash FPGA 71 I/O TQFP-100 | Microchip
部品番号: A3P125VQG100 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.33 | $14.33 |
| 10 | $13.9 | $139.00 |
| 100 | $13.4 | $1,340.00 |
| 500 | $12.8 | $6,400.00 |
| 1,000 | $12.3 | $12,300.00 |
A3P125VQG100 概要
A flash-based FPGA is a type of field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration ROM. Within the programmable-logic hierarchy, the A3P125 sits at the low end of the ProASIC3 family, below the A3P250, A3P600, and A3P1000, making it a power-management-friendly, single-chip programmable logic solution for glue logic and control applications.
Key features include nonvolatile Flash technology that eliminates the external boot PROM and enables instant-on, single-chip operation; reprogrammability for field updates; live_SEE secure programming support within the ProASIC3 family; and low total cost of ownership (TOC) as highlighted by Microchip. The 1.5K-logic-element density suits state machines, bus interfaces, and control-plane logic that do not justify larger FPGAs.
The ProASIC3 architecture uses a sea-of-vanilla-core logic fabric with optional Soft ARM support in the family, allowing small embedded controllers to be instantiated alongside user logic. Routing and timing are deterministic, and the flash cells retain configuration through power cycles without serial configuration devices.
Typical applications include industrial control boards, communication interface bridging, portable instruments, and aerospace/defense systems where low power, instant-on flash configuration, and a compact 100-pin footprint are priorities.
Design consideration: budget I/O banking rules and core voltage (1.5 V nominal for the ProASIC3 fabric) early in the schematic, since the 71 available I/Os constrain wide bus designs.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing from DigiKey, Mouser, LCSC, and Octopart, same-package drop-in alternatives, and practical sourcing guidance for the A3P125-VQG100.
ドロップイン代替品: A3P125VQG100 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P125VQG100 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, System Gates, Family, Configuration.
クイック比較ツール — 並列比較する代替部品を選択:
A3P125-1VQG100I
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.44 / 個
データシートを見る →A3P125-1VQG100T
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$17.6 / 個
データシートを見る →A3P125-VQ100T
✅ ドロップイン✓ 在庫あり
$7.5 / 個
データシートを見る →A3P060-2VQG100
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$21.6 / 個
データシートを見る →A3P250-2VQG100
✅ ドロップイン✓ 在庫あり
$17.5 / 個
データシートを見る →A3P125VQG100 最大定格＆電気的特性
| Logic Elements | 1500 LEs (1.5K) |
| Number of I/O | 71 |
| Embedded Memory | 36864 bits true dual-port SRAM |
| Family | ProASIC3 Flash FPGA |
| Technology | Nonvolatile Flash |
| パッケージ | 100-TQFP (VQG100, 14x14 mm) |
| 実装タイプ | Surface Mount |
| Configuration | Self-contained, instant-on (no external boot PROM) |
| Soft ARM Support | Optional (ProASIC3 family feature) |
| LVDS-capable I/O | Supported in ProASIC3 family (700 Mbps DDR on A3P250 and above) |
| Standard Package Quantity | 90 |
A3P125VQG100 90 ピン配置ガイド
A3P125VQG100 (90 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3P125VQG100.
詳細は データシート をご参照ください。
主な用途
A3P125VQG100 の用途: 6 件s: Industrial Control and Automation, Communication Interface Bridging, Portable and Battery-Powered Instruments, Aerospace and Defense Control Logic, Motor Drive and Power Electronics Sequencing, Security and Surveillance Electronics.
Industrial Control and Automation
The A3P125-VQG100 fits industrial control boards that need deterministic, instant-on logic without an external configuration device. Its nonvolatile flash fabric powers up functional in microseconds - critical for factory automation nodes that must respond to sensors the moment power is applied. With 1,500 logic elements, 71 user I/Os, and 36,864 bits of dual-port SRAM, it implements state machines, encoder interfaces, and PLC I/O bridges in one chip. Placed between a microcontroller and field I/O, it offloads timing-critical handshake logic while the MCU runs supervision tasks. The 14x14 mm TQFP fits standard 2-layer and 4-layer industrial PCBs, and the industrial-grade A3P125-1VQG100I variant shares the footprint for harsh-temperature deployments, eliminating PCB respins.
おすすめ
Communication Interface Bridging
The A3P125-VQG100 serves as a protocol bridge between legacy buses and modern interfaces in networking and industrial communication equipment. The ProASIC3 fabric provides LVDS-capable I/O within the family, and the 71 user I/Os in the 100-pin TQFP support wide parallel buses such as 16- or 32-bit data paths with control signals. Its 36,864-bit true dual-port SRAM enables FIFO buffering between clock domains - for example, crossing a UART or SPI stream into a parallel microprocessor bus. Because flash configuration is instant-on, link logic is live before host software boots, simplifying bring-up and reducing external sequencing. For designs needing 700 Mbps DDR signaling, migrate to the pin-compatible A3P250-2VQG100 without PCB rework.
おすすめ
Portable and Battery-Powered Instruments
Low total cost of ownership and small footprint make the A3P125-VQG100 attractive for portable measurement instruments, handheld testers, and battery-operated data loggers. The single-chip flash architecture eliminates the external configuration PROM, saving board area and quiescent configuration current - relevant where every milliwatt of standby budget counts. The 14x14 mm, 100-pin TQFP keeps layout compact, and its 1,500 logic elements handle display multiplexing, sensor-front-end timing, and button-scanning logic that would burden a small MCU. Dual-port SRAM buffers sampled data between acquisition logic and a host MCU or USB bridge. Designers should confirm exact Icc numbers from the datasheet for their battery budget and consider the A3P060-2VQG100 footprint-mate for even lower cost at reduced density.
おすすめ
Aerospace and Defense Control Logic
Microsemi (now Microchip) ProASIC3 flash FPGAs have a long heritage in terrestrial aerospace and defense subsystems, and the A3P125-VQG100 extends that lineage to low-density control logic such as telemetry formatting, sensor aggregation, and safe-mode controllers. Nonvolatile flash configuration avoids configuration-readout concerns of SRAM FPGAs and delivers instant-on behavior required by power-cycled payloads. The ProASIC3 family is documented with optional Soft ARM support, enabling a small embedded controller beside custom logic in a single chip. For programs requiring higher densities or additional radiation and military-screening options within the same fabric and toolchain, the A3P600 and A3P1000 members offer migration paths while the flash architecture and Libero design flow remain unchanged.
おすすめ
Motor Drive and Power Electronics Sequencing
In motor-drive and power-conversion boards, the A3P125-VQG100 handles gate-timing coordination, dead-time generation, and fault-latching logic that must operate deterministically and survive brownouts. Because the flash fabric is instant-on, protection interlocks are active immediately at power-up, before any microcontroller finishes booting - a safety benefit for high-voltage systems. The 71 I/Os accommodate multiple PWM channels, current-sense comparators inputs, and status flags, while dual-port SRAM logs fault histories for diagnostics. Pair it with gate-driver ICs and an MCU supervisory layer; the FPGA executes cycle-accurate timing while the MCU handles communication and setpoints. Verify the datasheet I/O banking rules so high-edge-count PWM signals share compatible banks within the 100-pin footprint.
おすすめ
Security and Surveillance Electronics
Camera and surveillance hardware benefits from the A3P125-VQG100 as glue logic between image sensors, video encoders, and host processors. Its 1,500 logic elements manage sensor timing generation, frame-sync distribution, and GPIO expansion, while 36,864 bits of dual-port SRAM implement line buffers that smooth data flow into the video pipeline. The LVDS-capable I/O within the ProASIC3 family supports differential clocking for longer board-level traces in multi-board camera enclosures, and the instant-on flash configuration means camera-control logic is live before the SoC completes boot - useful for motion-triggered recording. Designs outgrowing 1,500 LEs can drop in the pin-compatible A3P250-2VQG100 to gain DDR I/O bandwidth without changing the PCB footprint or layout.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P125VQG100 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P125-1VQG100I | A3P125-VQ100T | A3P060-2VQG100 | A3P250-2VQG100 |
|---|---|---|---|---|---|
| Package | 100-TQFP (VQG100, 14x14 mm) | 100-TQFP (VQG100) - same | 100-TQFP (VQ100) - same footprint | 100-TQFP (VQG100) - same | 100-TQFP (VQG100) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 1500 LEs | 1500 LEs | 1500 LEs | ~600 LEs | ~3000 LEs |
| DDR/LVDS I/O Performance | LVDS-capable (700 Mbps DDR specified for A3P250 and above) | Same as A3P125 | Same as A3P125 | LVDS-capable | 700 Mbps DDR / LVDS |
主な差別化要因
- Lowest-cost ProASIC3 density point （vs A3P250-2VQG100)
- Industrial temperature option on identical footprint （vs A3P125-1VQG100I)
- Instant-on single-chip flash configuration （vs SRAM-based low-density FPGAs (Lattice/Gowin equivalents))
設計ノート
The ProASIC3 fabric uses a low-voltage core supply with separate I/O bank supplies; decouple each VCC and bank VCCI pin with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk 10 uF per rail. Estimated: with 1,500 LEs of typical toggling activity, core current is modest (tens of mA), but I/O switching current on a 32-bit bus can dominate - budget per datasheet ICC tables rather than rules of thumb. Ensure power-up monotonicity so flash configuration read-out is glitch-free; the device is instant-on, so rail sequencing directly determines when user logic becomes valid.
The 100-pin TQFP has 0.5 mm pitch leads - use 0.25 mm-wide traces with solder-mask-defined pads and a 4x4 perimeter thermal via-free courtyard. Route JTAG (TCK, TMS, TDI, TDO) as a short daisy chain with 10 kOhm pull-ups on TMS/TDI to ensure Libero/FlashPro programming reliability across the full length of a programming cable. Assign wide buses to I/O banks first so bank voltage requirements (3.3 V vs 2.5 V vs 1.8 V) are fixed before layout; re-banking late in the design forces PCB respins.
Do not confuse ordering-code variants: A3P125-VQG100, A3P125-VQ100T, and A3P125-1VQG100I share the die and footprint but differ in speed/temperature grade and packing - verify the exact suffix against the Microchip ordering-code table before BOM substitution. Also note that 700 Mbps DDR LVDS I/O is specified for A3P250 and above; assuming that performance on the A3P125 is a design error. Finally, regenerate and re-verify the bitstream whenever swapping to A3P060 or A3P250, since resource utilization and timing change with density.
コンプライアンス情報
Compliance status not stated in provided web data; the VQG100 suffix generally indicates green/RoHS packaging in Microchip ordering codes, but verify on the official Microchip product page before relying on it. AEC-Q100 qualification is not indicated for this commercial-grade ordering code.
