A3P060-2VQG100 - ProASIC3 Flash FPGA, 60K Gates | Microchip
MPN: A3P060-2VQG100 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.9 | $299.00 |
| 100 | $26.8 | $2,680.00 |
| 500 | $24.2 | $12,100.00 |
| 1,000 | $21.6 | $21,600.00 |
A3P060-2VQG100 Overview
A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash cells rather than an external configuration PROM. Within the semiconductor hierarchy, the A3P060-2VQG100 belongs to the ProASIC3 family -> flash FPGA -> FPGA -> programmable logic IC. Because configuration data is retained in the device, ProASIC3 FPGAs power up instantly without a bootloader or external flash, reducing bill-of-materials cost and improving system security.
Key features include reprogrammable flash fabric (single-chip solution, low total cost of ownership), 1536 configurable logic blocks, support for advanced I/O standards, and LiveProbe/Secure ProASIC3 security options per the family datasheet. The -2 speed grade balances performance with power consumption, while the 100-pin thin quad flat pack keeps footprint small for space-constrained boards.
Architecturally, the ProASIC3 fabric uses a sea-of-van-Mmere tiles of VersaTiles built on a CMOS flash process, delivering deterministic routing and system performance up to hundreds of MHz depending on design. Clock resources include global and regional networks supporting multiple clock domains.
Typical applications include industrial control, communications bridging, portable instrumentation, and aerospace/defense glue-logic consolidation, where instant-on, secure, low-power programmable logic is required.
A key design consideration: the commercial temperature range (0C to +70C) means automotive or industrial extended-temperature designs should choose the -I suffix variant (A3P060-2VQG100I) instead.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, drop-in same-package alternatives, comparison tables, and practical design notes in one AI-citable reference.
Drop-in alternatives for A3P060-2VQG100 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with A3P060-2VQG100 (same form factor and footprint) — differing in Operating Temperature, System Gates, Package, Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P060-2VQG100I
✅ Drop-In✓ In Stock
$19.75 / Unit
View Datasheet →A3P060-VQG100I
✅ Drop-In✓ In Stock
$6.95 / Unit
View Datasheet →A3P125-VQ100T
✅ Drop-In✓ In Stock
$7.5 / Unit
View Datasheet →A3P250-1VQ100M
✅ Drop-In✓ In Stock
$7.5 / Unit
View Datasheet →A3P250-PQG100
✅ Drop-In✓ In Stock
$7.2 / Unit
View Datasheet →A3P060-2VQG100 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 60000 |
| Configurable Logic Blocks (CLBs) | 1536 |
| Number of I/Os | 71 |
| Dedicated Flash Memory | 18432 bits |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Operating Supply Voltage | 1.5 V |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +70 C |
| Package / Case | VQFP / 100-TQFP |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Programmability Type | Flash-based (non-volatile, reprogrammable) |
| Configuration Memory | Internal flash (instant-on, no external config PROM) |
| Total RAM Bits | 18432 |
A3P060-2VQG100 vqfp / 100-tqfp Pin Configuration Guide
Pin configuration for A3P060-2VQG100 (vqfp / 100-tqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P060-2VQG100.
Refer to the datasheet for full pin configuration.
Typical Applications
A3P060-2VQG100 is suitable for 6 applications: Industrial Control and Automation, Communications Bridging and Line-Card Logic, Portable and Battery-Powered Instrumentation, Aerospace and Defense Glue-Logic Consolidation, Test and Measurement Equipment, Secure Embedded Control Systems.
Industrial Control and Automation
The A3P060-2VQG100 fits industrial control because its 60,000-gate flash fabric consolidates PLC I/O glue logic, motor-control sequencing, and sensor interfacing into one instant-on chip with 71 user I/Os. Because configuration lives in on-chip flash, the FPGA is operational within microseconds of the 24 V rail's derived 1.5 V supply stabilizing - no configuration PROM boot delay that could miss a watchdog window. The -2 speed grade supports the multi-MHz state machines typical of factory automation, while the commercial 0C to +70C range suits cabinet-mounted electronics. Designers typically pair it with RS-485 transceivers and isolated gate drivers; at 1.5 V core voltage, static power is low enough for fanless enclosures.
Recommended
Communications Bridging and Line-Card Logic
In communications equipment, the A3P060-2VQG100 serves as a protocol and bus bridge: its 71 I/Os and -2 speed grade handle parallel-to-serial conversion, backplane handshaking, and clock-domain crossing between line cards and backplanes. The ProASIC3 fabric's deterministic routing simplifies timing closure on fixed-latency paths, an important property for packet-framing logic. Its flash configuration means a hot-swapped card is alive immediately after power-good, without waiting for a bitstream load, improving availability metrics. With a 1.5 V core supply, per-device power stays in the sub-watt range for typical utilization, easing airflow budgets in dense chassis. The 100-pin TQFP keeps trace lengths short on 4-6 layer boards.
Recommended
Portable and Battery-Powered Instrumentation
Handheld instrumentation benefits from the A3P060-2VQG100's flash-based low-power architecture: 1.5 V core operation and no external configuration device reduce both dynamic power and board area. The 100-pin TQFP measures roughly 14 x 14 mm, compact enough for portable enclosures while keeping hand-solderable lead pitch for prototypes. Instant-on behavior means measurements begin as soon as the operator presses power, since the FPGA requires no boot sequence. The 18,432 bits of dedicated flash can hold calibration constants or a device serial number, removing an external EEPROM from the BOM. Commercial 0C to +70C ratings match typical indoor instrument environments.
Recommended
Aerospace and Defense Glue-Logic Consolidation
Defense programs use ProASIC3 devices like the A3P060-2VQG100 to replace ASIC and ASSP glue logic, because flash FPGA fabric resists single-event configuration upset better than SRAM FPGAs - the configuration is stored in non-volatile cells rather than volatile latches. Single-chip operation removes the external configuration PROM, shrinking card area and eliminating a failure point in high-shock environments. The 60,000-gate capacity accommodates memory controllers, bus interfaces, and housekeeping state machines. For space-qualified or extended-temperature builds, the A3P060-2VQG100I variant covers -40C to +100C. Design security features of the ProASIC3 family protect RTL IP on deployed hardware.
Recommended
Test and Measurement Equipment
Bench and modular instruments deploy the A3P060-2VQG100 for trigger engines, timing generators, and front-end mux control. The -2 speed grade supports the tens-of-MHz state machines required for trigger recognition, while deterministic ProASIC3 routing keeps trigger-path latency consistent shot-to-shot - a measurable quality differentiator in oscilloscope and logic-analyzer front ends. Instant-on flash configuration lets the instrument enumerate on PCIe or USB within the host's power-up timeout. The 71 I/Os provide abundant channels for relay, attenuator, and ADC control lines, and the 18,432-bit flash stores calibration tables local to the FPGA.
Recommended
Secure Embedded Control Systems
Applications that must protect firmware IP - payment terminals, access-control readers, and licensed medical accessories - use the A3P060-2VQG100 because ProASIC3 flash FPGAs store the bitstream in on-chip non-volatile memory with no external configuration file to intercept. Family security features (documented in the Microchip ProASIC3 literature) plus the absence of a boot-time bitstream download raise the bar against cloning compared with SRAM FPGAs. The 60,000-gate fabric implements crypto accelerators, tamper-response state machines, and secure key storage interfaces, while 71 I/Os connect smart-card and sensor front ends. The single 1.5 V rail simplifies compliance with low-power standby regulations.
Recommended
Recommended Products Summary
Engineering reference data for A3P060-2VQG100 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P060-2VQG100I | A3P060-VQG100I | A3P125-VQ100T | A3P250-1VQ100M |
|---|---|---|---|---|---|
| Package | 100-TQFP (VQFP-G100) | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same footprint family | 100-TQFP - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 | -2 | base (-1) | base | -1 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Key Differentiators
- Fastest commercial-grade speed grade in the A3P060 TQFP family (vs A3P060-VQG100I)
- Extended-temperature drop-in exists on the same die (vs A3P060-2VQG100I)
- Instant-on flash configuration vs SRAM FPGA alternatives (vs A3P125-VQ100T)
Design Notes
Power the 1.5 V core with a regulator capable of at least the datasheet ICC estimate for your utilization plus margin; decouple each VCC/VCCI pin pair with 0.1 uF ceramic capacitors placed within 2 mm of the pin, and add bulk 10 uF per rail. ProASIC3 flash devices draw near-zero configuration current at power-up because no bitstream load occurs - but I/O bank voltages (VCCI) must be present before enabling external drivers to avoid latch-up on mixed-voltage buses.
The 100-pin TQFP lead pitch (0.5 mm) favors a 4-layer board with dedicated ground plane: route JTAG (TCK/TMS/TDI/TDO) as a short daisy chain with a 10 kOhm pull-up on TMS and TCK sequencing consideration per the programming spec. Keep the programming header accessible for in-system flash updates. For the exposed corner of the package, tie all GND pins to plane with multiple vias to reduce ground bounce on the 71 I/Os.
The most common mistake with this MPN is temperature-grade confusion: A3P060-2VQG100 is commercial (0C to +70C); specifying it in an industrial enclosure design will cause field failures - use A3P060-2VQG100I instead. Second, the -2 speed grade is not interchangeable with the base A3P060-VQG100 in timing-closed designs; re-run timing if substituting. Finally, cross-package migrations (e.g., to FG144) require full pin reassignment - never assume port compatibility across ProASIC3 package families.
Compliance Information
Compliance data not present in the provided web data; Microchip ProASIC3 devices are generally RoHS-compliant but this must be verified on the Microchip product page.
