A3PE600-PQ208I - 600K-Gate Flash FPGA, 147 I/O | Microchip
部品番号: A3PE600-PQ208I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.8 | $5,780.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.9 | $47,900.00 |
A3PE600-PQ208I 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor), flash FPGAs occupy a distinct niche: they are Instant On at power-up, retain their programmed design when power is removed, and require no external boot flash, unlike SRAM FPGAs from Xilinx or Intel/Altera.
Key features include reprogrammable 130-nm, 7-layer metal (6 copper) flash-based CMOS technology, a single-chip solution with low total cost of ownership, up to 231 MHz system performance, on-chip user nonvolatile memory, and support for Level 0 instant-on operation. The ProASIC3E fabric combines logic tiles with embedded true dual-port SRAM blocks (108 kbits on this device), enabling FIFOs, buffers, and register files without external memory.
Architecturally, the A3PE600 uses a sea-of-tiles fabric of VersaTiles, each configurable as combinational or sequential logic, with flash switches providing nonvolatility and inherent security benefits: no bitstream is streamed at power-up, making reverse engineering significantly harder than SRAM FPGAs.
Typical applications include industrial automation and motor control, aerospace and defense systems requiring instant-on secure configuration, medical instrumentation, and communications line cards, where single-chip nonvolatile programmable logic reduces BOM cost and board complexity.
A key design consideration is power: the 1.5V core rail must be tightly regulated within 1.425V to 1.575V, and I/O bank voltages must be planned early since the 147 user I/Os are grouped into banks.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE600-PQ208I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE600-PQ208I （同一形状・フットプリント） — 相違点: Package, Family, Process Technology, Configuration Memory, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE600-1PQ208I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE600-2PQ208I
✅ ドロップイン✓ 在庫あり
$26.4 / 個
データシートを見る →A3PE600-PQG208
✅ ドロップイン✓ 在庫あり
$24.64 / 個
データシートを見る →A3PE600-PQG208IX218
✅ ドロップイン✓ 在庫あり
$47.8 / 個
データシートを見る →A3P600-PQ208I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
A3PE600-PQ208I 最大定格＆電気的特性
| Family | ProASIC3E |
| System Gates | 600,000 gates |
| User I/Os | 147 |
| Embedded RAM | 110,592 bits (108 kbit) true dual-port SRAM |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Maximum System Performance | 231 MHz |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration Memory | Nonvolatile on-chip flash, Instant On Level 0 |
| 動作温度 | -40C to +100C (industrial) |
| パッケージ | 208-BFQFP (PQ208) |
| 実装タイプ | Surface Mount |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Single-Chip Solution | Yes (no external configuration device required) |
| Program Retention | Retains programmed design when powered off |
A3PE600-PQ208I 208-bfqfp (pq208) ピン配置ガイド
A3PE600-PQ208I (208-bfqfp (pq208) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE600-PQ208I.
詳細は データシート をご参照ください。
主な用途
A3PE600-PQ208I の用途: 6 件s: Industrial Automation and Motor Control, Aerospace and Defense Secure Logic, Medical Instrumentation Interface Logic, Communications Line Cards, Test and Measurement Equipment, Secure Embedded Systems and IoT Gateways.
Industrial Automation and Motor Control
The A3PE600-PQ208I fits industrial automation because its -40C to +100C industrial temperature range, 147 user I/Os, and instant-on flash configuration survive electrically noisy factory-floor environments. With 108 kbit of true dual-port SRAM, it implements PWM sequencers, quadrature encoder interfaces, and interlock logic without external memory. Because the ProASIC3E fabric is Instant On at Level 0, safety interlocks and motor-disable logic are active within microseconds of power application, before any MCU boots. Typical designs pair it with a 1.5V precision buck regulator and 3.3V I/O banks driving optocoupled interfaces; the trade-off versus an MCU is that control logic is hardware-implemented, delivering deterministic microsecond-class latency that software loops cannot guarantee.
おすすめ
Aerospace and Defense Secure Logic
Defense and aerospace designs choose the A3PE600-PQ208I because flash-based configuration never streams a bitstream at power-up, dramatically raising the reverse-engineering barrier compared with SRAM FPGAs. The device retains its programmed design when powered off and is reprogrammable in the field, supporting mission hardware updates without socketed parts. Its 600K-gate fabric implements glue logic, bus interfaces, and telemetry formatting, while 147 user I/Os interface MIL-STD buses through level-translated banks. Industrial -40C to +100C operation covers most embedded defense platforms; full military-temperature screening requires the appropriate Microchip order flow. Designers should budget for recompilation and timing re-verification when porting designs between family members, as 130-nm fabric timing varies with speed grade.
おすすめ
Medical Instrumentation Interface Logic
In medical diagnostics and patient-monitoring equipment, the A3PE600-PQ208I serves as deterministic interface logic between analog front ends and host processors. The 108 kbit true dual-port SRAM buffers sample streams from ADCs without processor intervention, and 147 user I/Os connect sensor banks, displays, and communication modules. Flash nonvolatility means calibration constants and configuration firmware survive power cycling in portable devices with battery management. Its single-chip solution removes the external configuration flash whose bitstream loading can introduce startup latency unacceptable in alarm-critical circuits. Designs typically use 3.3V I/O banks with series termination for signal integrity on ribbon-cable sensor links; the 231 MHz fabric ceiling comfortably supports multi-MHz sampling pipelines.
おすすめ
Communications Line Cards
Telecom and datacom line cards use the A3PE600-PQ208I for framing, elastic buffering, and status aggregation across multiple PHY devices. The true dual-port SRAM implements FIFOs for clock-domain crossing between line-side and system-side clocks, a mandatory function at card boundaries. Instant-on operation lets link-status and protection-switching logic be live before the network processor completes boot, minimizing service interruption on hot-swappable or redundant cards. With 147 user I/Os, one PQ208 device aggregates dozens of PHY status lines that would otherwise consume MCU pins. Design consideration: at line-card scale, 1.5V core consumption scales with toggle rate, so power estimation in Libero should precede regulator sizing for high-activity designs.
おすすめ
Test and Measurement Equipment
Bench instruments and automated test fixtures deploy the A3PE600-PQ208I as stimulus/response logic, trigger engines, and bus bridges. The 231 MHz fabric performance and deterministic hardware timing make it suitable for precision trigger generation and edge-aligned capture, tasks where software timing jitter is unacceptable. On-chip flash supports field-updatable instrument personality files without opening the enclosure, and the 108 kbit SRAM implements capture memories for short transaction traces. The industrial temperature grade suits rack-mounted equipment with elevated internal ambient temperatures; designers should verify junction temperature using the PQ208 thermal data in the ProASIC3E datasheet when the device is in a sealed chassis with limited airflow.
おすすめ
Secure Embedded Systems and IoT Gateways
The A3PE600-PQ208I provides a hardware security root in embedded gateways where bitstream confidentiality matters. Because configuration resides in on-chip flash and is never exposed on a bus at power-up, cloning via bus snooping is impractical, and Microchip flash FPGAs additionally support design-security features in the fabric. The 600K gates implement custom cryptographic interfaces, secure boot companions, or tamper-response logic alongside general glue logic, while 147 I/Os bridge legacy buses (8/16-bit parallel, SPI, I2C) to modern host processors. Instant-on behavior ensures security monitors are active before the main SoC releases reset. Trade-off: 130-nm technology lacks modern crypto hard blocks, so symmetric ciphers consume fabric resources and should be budgeted in Libero timing closure.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE600-PQ208I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE600-1PQ208I | A3PE600-2PQ208I | A3PE600-PQG208 | A3PE600-PQG208IX218 | A3P600-PQ208I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQ208) | 208-BFQFP (PQ208) - same | 208-BFQFP (PQ208) - same | 208-BFQFP (PQG208, lead-free) - same footprint | 208-BFQFP (PQG208) - same footprint | 208-BFQFP (PQ208) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | Standard | -1 (faster) | -2 (fastest) | Standard | Standard | Standard (ProASIC3) |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
主な差別化要因
- True nonvolatile single-chip configuration （vs A3P600-PQ208I)
- Fastest timing closure option available in the same footprint （vs A3PE600-PQG208IX218)
- RoHS-compliant drop-in path exists （vs A3PE600-1PQ208I)
設計ノート
The 1.5V core rail (VCC) must stay within 1.425V to 1.575V under all load transients. Core current scales with fabric toggle rate, so run Libero SmartPower estimation after place-and-route before selecting the regulator; do not size the 1.5V supply from datasheet typical values alone. I/O bank supplies (VCCI) are independent per bank - plan 3.3V, 2.5V, and 1.8V banks during pin assignment, not after layout, because bank voltage mixing constrains which I/Os can serve which connector.
Decouple each VCC/VCCI pin with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10 uF per voltage domain. The PQFP 0.5 mm pitch leads require careful fanout on outer layers; a 208-pin PQFP typically fanouts on 4 signal layers. For JTAG programming, keep TCK traces short and add a 10k pull-down on TCK and 10k pull-ups on TMS/TDI to prevent floating-state configuration activity at power-up.
The most common PQ208I procurement mistake is confusing leaded (PQ208I) and lead-free (PQG208) assembly variants when RoHS compliance is contractual - verify the exact suffix on the date-code label at receiving inspection. Second, designs ported from A3P600 (ProASIC3) to A3PE600 (ProASIC3E) must re-verify embedded RAM sizing since the families allocate memory differently. Third, always re-run timing analysis after any speed-grade substitution: a -2 part replacing a standard part is safe, but the reverse can fail timing closure.
コンプライアンス情報
Compliance data conflicts across sources: digchip lists the PQ208I as containing lead / RoHS non-compliant, while xsourcepart lists it as lead-free / RoHS compliant. The PQG208 suffix variants are the lead-free assembly. Verify with Microchip PCN documentation before contractual commitment.
