A3PE600-PQG208 - 600K Gate ProASIC3E FPGA 208-PQFP | Microchip
MPN: A3PE600-PQG208 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.72 | $13,860.00 |
| 1,000 | $24.64 | $24,640.00 |
Drop-in alternatives for A3PE600-PQG208 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600-PQG208IX218
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View Datasheet →A3PE1500-1PQG208
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View Datasheet →A3PE1500-2PQG208
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View Datasheet →A3P600-PQG208
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$44.6 / Unit
View Datasheet →A3PE3000L-PQ208I
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View Datasheet →A3PE3000L-1PQG208
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View Datasheet →A3PE3000-PQG208X3
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View Datasheet →A3PE600-PQG208 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 600,000 |
| User I/O | 147 |
| Total Embedded RAM | 110,592 bits |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Configuration Technology | Flash (nonvolatile, single-chip) |
| Package | 208-Pin PQFP (BFQFP), surface mount |
| Operating Temperature | 0C to +70C (commercial) |
| Mounting Type | Surface Mount |
| Programmability | In-system reprogrammable |
| Power-Up Behavior | Live at power-up (no external configuration device) |
| RoHS Status | Compliant |
| Lead Free Status | Lead Free |
| Target Markets | Consumer, networking/communications, computing, avionics |
A3PE600-PQG208 208-pin pqfp (bfqfp), surface mount Pin Configuration Guide
Complete pinout information for A3PE600-PQG208 (208-pin pqfp (bfqfp), surface mount package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-PQG208.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-PQG208 is suitable for 6 applications: ASIC Replacement in Consumer Electronics, Networking and Communications Equipment, Industrial Control and Automation, Computing Platform Glue Logic, Avionics and Aerospace Subsystems, Test and Measurement Instrumentation.
ASIC Replacement in Consumer Electronics
The Microchip ProASIC3E datasheet explicitly positions the family as a cost-effective ASIC replacement for consumer markets. The A3PE600-PQG208's 600,000 system gates and 231 MHz performance cover mid-complexity control, interface, and data-path logic that would otherwise require ASIC NRE and mask charges. Because configuration is stored in nonvolatile on-chip flash, the board needs no external boot PROM or configuration controller, cutting BOM cost and board area - critical in price-sensitive consumer designs. The single 1.5V nominal core supply keeps dynamic power low, and the 208-pin PQFP is inexpensive to assemble versus BGA packages. The device remains reprogrammable in the field, so late feature changes or bug fixes ship as firmware updates instead of hardware respins, protecting consumer product schedules.
Recommended
Networking and Communications Equipment
Networking and communications systems use the A3PE600-PQG208 for glue logic, line-card control, backplane interfacing, and protocol bridging. The 147 user I/Os, organized in multiple banks with independent VCCI supplies, map naturally to mixed-voltage interfaces common in communications backplanes, while the 110,592-bit embedded RAM implements FIFOs and buffering between clock domains. The 231 MHz system performance supports fast data-path functions, and flash-based, live-at-power-up startup means the card is functional the instant power is applied - valuable for hot-swap and fast-restart behavior in telecom shelves. The Microchip ProASIC3E datasheet lists networking/communications as a primary target market, and the commercial 0C to +70C grade fits centrally managed, climate-controlled equipment rooms.
Recommended
Industrial Control and Automation
In industrial control panels, PLC I/O modules, and machine controllers, the A3PE600-PQG208 implements deterministic state machines, encoder interfaces, and safety interlock logic. The flash fabric is live at power-up with no configuration delay, so the controller is ready within milliseconds of power application - an advantage over SRAM FPGAs that spend boot time loading a bitstream. For factory-floor environments beyond the commercial 0C to +70C range, the pin-identical industrial grade A3PE600-PQG208IX218 extends temperature capability without any PCB change, as both share the 208-pin PQFP footprint and identical die. The single 1.425V to 1.575V core eases power-supply design, and 147 I/Os provide ample banked interfaces to sensors, relays, and fieldbus transceivers.
Recommended
Computing Platform Glue Logic
Server, storage, and embedded computing boards use the A3PE600-PQG208 for address decoding, bus bridging, power-sequencing control, and board-management logic around the main processor. The 110,592 bits of embedded RAM buffer status and telemetry data, while 147 I/Os connect to I2C/SMBus-style management buses, LEDs, and reset trees. Flash configuration with live-at-power-up behavior means the management FPGA is supervising the board before the CPU leaves reset - essential for correct power sequencing and early fault reporting. The commercial temperature grade and inexpensive PQFP package suit high-volume computing hardware, and the Microchip ProASIC3E datasheet names computing as a target market for exactly this ASIC-replacement role.
Recommended
Avionics and Aerospace Subsystems
The Microchip ProASIC3E datasheet explicitly targets avionics applications, and the A3PE600-PQG208 fits roles such as discrete-to-digital adaptation, ARINC-style interface consolidation, and Built-In Test logic in avionics line-replaceable units. The single-chip flash architecture eliminates the external configuration device - a common reliability and security concern in airborne hardware - and the nonvolatile bitstream resists readback-based IP extraction. 147 I/Os absorb the large discrete counts typical of avionics interfaces, and the 600K-gate fabric implements dual-redundant control paths with margin. For programs with environmental qualification requirements, specify the industrial-temperature A3PE600-PQG208IX218 drop-in, which preserves the PCB footprint while extending the operating range beyond the commercial 0C to +70C grade.
Recommended
Test and Measurement Instrumentation
Bench instruments, automated test equipment, and data-acquisition front ends deploy the A3PE600-PQG208 for timing generation, trigger logic, and interface translation. The 231 MHz fabric performance supports fast trigger paths and counter/timer functions, while the 110,592-bit embedded RAM captures transient event logs or sample buffers without external SRAM. Designers value the flash fabric's deterministic, configuration-free startup: the instrument is measuring from the moment power stabilizes, with no boot latency. The 208-pin PQFP simplifies prototyping and rework compared with fine-pitch BGAs, an advantage in instrumentation programs with frequent engineering changes, and the field-reprogrammable fabric lets one PCB serve multiple instrument variants simply by loading different firmware images.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-PQG208 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-PQG208IX218 | A3PE1500-1PQG208 | A3P600-PQG208 | A3PE3000L-PQ208I |
|---|---|---|---|---|---|
| Package | 208-Pin PQFP (PQG208) | 208-Pin PQFP - same | 208-Pin PQFP - same | 208-BFQFP - same | 208-Pin PQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 1,500,000 | 600,000 | 3,000,000 |
| User I/O | 147 | 147 | [DATA_NEEDED] | 154 | [DATA_NEEDED] |
| Total RAM (bits) | 110,592 | 110,592 | [DATA_NEEDED] | 110,592 | [DATA_NEEDED] |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature | 0C to +70C (commercial) | Industrial (extended) | Commercial grade (-1 speed) | Commercial grade | Industrial (extended) |
| Configuration | Nonvolatile flash, live at power-up | Nonvolatile flash - same | Nonvolatile flash - same | Nonvolatile flash - same | Nonvolatile flash - same |
| Process / Performance | 130 nm, 231 MHz | 130 nm, 231 MHz | 130 nm, speed grade -1 | 130 nm, ProASIC3 | 130 nm, low-power 3000L |
Key Differentiators
- Nonvolatile flash configuration - no external boot device (vs A3P600-PQG208)
- Footprint-compatible upward migration (vs A3PE1500-1PQG208)
- Commercial-grade cost advantage (vs A3PE600-PQG208IX218)
- Trade-off: lower I/O count within family (vs A3P600-PQG208)
Design Notes
Supply the 1.5V core from a dedicated regulator meeting the 1.425V to 1.575V tolerance across all load and temperature corners; do not share the rail with noisy digital loads such as DDR terminations. Bank I/O supplies (VCCI) must each be pinned out per the ProASIC3E datasheet package tables - mixing 3.3V and lower-voltage banks on one rail defeats the banked I/O standard flexibility. Estimated: at 600K gates, core current scales with toggle rate, so size the core regulator using Libero SmartPower estimates rather than assuming worst-case datasheet numbers.
The 208-pin PQFP dissipates heat primarily through its leads into the PCB. Estimated: dynamic power at 231 MHz with a heavily toggling fabric can reach the watt class; verify junction temperature using the datasheet thermal resistance figures for the PQG208 package and your airflow assumption. Provide solid ground planes under the package and connect all GND pins; avoid thermal relief spokes on ground leads to keep effective theta_JA low. If your application runs near the +70C commercial limit, consider the A3PE600-PQG208IX218 industrial variant for added margin.
Three frequent mistakes with ProASIC3E PQFP designs: (1) Assuming SRAM-FPGA behavior - the A3PE600 is live at power-up, so input glitching during configuration does not occur, but designers must still define pin states during power ramp. (2) Exceeding the commercial 0C to +70C rating with the standard part in industrial enclosures - specify the PQG208I grade up front. (3) Neglecting JTAG access in PCB layout - keep the TDI/TDO/TMS/TCK chain routable to a programming header for FlashPro in-circuit programming and field updates.
Group high-speed I/O within the same VCCI bank and keep stub lengths on the PQFP gull-wing leads short; 231 MHz fabric paths allow fast output edges that can ring on unmatched traces. Reference timing-critical signals to a contiguous ground plane and add series termination (22-33 ohm, estimated starting values) on fast single-ended outputs driving off-board loads. Route JTAG as a clean, short chain even in production boards - it doubles as your in-system update path.
Compliance Information
RoHS Compliant and Lead Free per digchip distributor datasheet summary. REACH and conflict-minerals declarations not stated in provided data.
