ADM2567EBRNZ - 3 kV Isolated RS-485 Transceiver, 25 Mbps | Analog Devices
部品番号: ADM2567EBRNZ ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $21.62 | $21.62 |
| 10 | $19.85 | $198.50 |
| 100 | $17.42 | $1,742.00 |
| 500 | $15.38 | $7,690.00 |
| 1,000 | $13.84 | $13,840.00 |
ADM2567EBRNZ 概要
A digital isolator with integrated isolated power is a single-package solution that combines galvanic isolation between the logic-side controller and the bus-side transceiver with an on-chip DC-DC converter, eliminating the need for an external isolated supply. This category sits inside the broader hierarchy: digital isolator → interface IC → integrated circuit → semiconductor. By embedding the isolated DC-DC, the ADM2567EBRNZ collapses two BOM items (an isolated RS-485 transceiver plus a discrete isolated supply) into one IC, saving PCB area and simplifying the safety-certification paperwork for IEC 60950 / IEC 62368-1 reinforced insulation.
Key features include 1.7 V to 5.5 V VIO logic-side supply, a wide-bus supply range supported through the integrated isolated DC-DC, hot-swap capable bus pins, slew-rate-limited driver options in the slower family members, and full fail-safe receiver inputs. The half-duplex/full-duplex topology and 25 Mbps maximum signaling rate make the part suitable for industrial fieldbus networks where high noise immunity and high throughput are simultaneously required.
Typical applications include PROFIBUS and Modbus nodes, isolated RS-485 links in factory automation, solar inverter communication buses, building-automation gateways, and any system that needs to meet IEC 61000-4-2 air-discharge Class B or IEC 61000-4-5 surge standards without an external TVS array. When designing with this part, follow the PCB layout recommendations in the ADM2561E/63E/65E/67E datasheet - particularly the placement of the decoupling and bypass capacitors across the integrated DC-DC and the creepage/clearance guidance that is built into the wide-body SOIC footprint.
ドロップイン代替品: ADM2567EBRNZ — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ADM2567EBRNZ （同一形状・フットプリント） — 相違点: Package, Protocol, Number of Drivers/Receivers, Function, Operating Temperature Range.
クイック比較ツール — 並列比較する代替部品を選択:
ADM2565EBRNZ
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ADM2563EBRNZ
✅ ドロップイン✓ 在庫あり
$12.21 / 個
データシートを見る →ADM2561EBRNZ-RL7
✅ ドロップイン✓ 在庫あり
$9.07 / 個
データシートを見る →ADM2461EBRWZ-RL
✅ ドロップイン✓ 在庫あり
$4.1 / 個
データシートを見る →MAX14882AWE+T
✅ ドロップイン✓ 在庫あり
$6.21 / 個
データシートを見る →ISO5852DW
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ADM2567EBRNZ 仕様
| Isolation Voltage | 3000 V rms |
| Data Rate (max) | 25 Mbps |
| Number of Channels | 4 (signal isolation) |
| Common-Mode Transient Immunity (CMTI) | 250 kV/us |
| Bus ESD (IEC 61000-4-2, contact) | ±15 kV (bus pins) |
| Bus ESD (IEC 61000-4-2, air) | ±15 kV |
| A/B/Y/Z ESD (IEC 61000-4-2, contact) | ±6 kV |
| Protocol | RS-422 / RS-485 |
| Logic-Side Supply (VIO) | 1.7 V to 5.5 V |
| Integrated Isolated DC-DC | Yes (isoPower) |
| パッケージ | 28-pin SOIC-W (0.295", 7.50 mm body width) |
| Compliance | ANSI/TIA/EIA-485-A-98, ISO 8482:1987 (E) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
| Number of Drivers / Receivers | 1 / 1 |
ADM2567EBRNZ ピン構成
| ピン 1 | VDD1 — Logic-side primary supply input |
| ピン 2 | GND1 — Logic-side ground |
| ピン 3 | VIO — Logic-side I/O supply (1.7 V to 5.5 V) |
| ピン 4 | RXD — Receiver output (logic-side) |
| ピン 5 | TXD — Driver input (logic-side) |
| ピン 6 | DE — Driver enable input (active high) |
| ピン 7 | RE — Receiver enable input (active low) |
| ピン 8 | NC — Not connected (per datasheet) |
| ピン 9 | GND1 — Logic-side ground |
| ピン 10 | NC — Not connected (per datasheet) |
| ピン 11 | NC — Not connected (per datasheet) |
| ピン 12 | NC — Not connected (per datasheet) |
| ピン 13 | NC — Not connected (per datasheet) |
| ピン 14 | NC — Not connected (per datasheet) |
| ピン 15 | VDDB — Bus-side isolated supply (output of internal isoPower) |
| ピン 16 | GNDB — Bus-side isolated ground |
| ピン 17 | NC — Not connected (per datasheet) |
| ピン 18 | NC — Not connected (per datasheet) |
| ピン 19 | A — Non-inverting driver output / non-inverting receiver input |
| ピン 20 | B — Inverting driver output / inverting receiver input |
| ピン 21 | Z — Inverting receiver output (full-duplex variant) |
| ピン 22 | Y — Non-inverting receiver output (full-duplex variant) |
| ピン 23 | NC — Not connected (per datasheet) |
| ピン 24 | NC — Not connected (per datasheet) |
| ピン 25 | NC — Not connected (per datasheet) |
| ピン 26 | NC — Not connected (per datasheet) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
主な用途
ADM2567EBRNZ の用途: 6 件s: Industrial PROFIBUS / Modbus Nodes, Solar Inverter Communication Bus, Building Automation Gateways, Medical Equipment Isolation, Renewable Energy / Battery Management, Industrial Sensor Networks.
Industrial PROFIBUS / Modbus Nodes
The ADM2567EBRNZ's 25 Mbps data rate and 3 kV rms isolation make it a strong fit for PROFIBUS DP and high-speed Modbus RTU nodes in factory automation. The on-chip isoPower DC-DC eliminates an external isolated supply, simplifying the IEC 61131-2 compliance paperwork. With ±15 kV IEC 61000-4-2 contact discharge and 250 kV/µs CMTI, the part tolerates the motor-drive noise environment typical of PLC cabinets without an external TVS. Placed between the MCU UART and the bus pins with the recommended 100 nF bus-side bypass, it delivers PROFIBUS DP at 12 Mbps with full galvanic isolation.
おすすめ
Solar Inverter Communication Bus
Solar inverter and PV-monitoring gateways require RS-485 isolation between the high-voltage DC bus and the SCADA controller. The ADM2567EBRNZ provides the 3 kV rms reinforced isolation required by IEC 62109-1 and the ±15 kV ESD rating needed to survive installation-induced cable transients. The 250 kV/µs CMTI ensures that the high dv/dt from the inverter's IGBT switches does not corrupt the bus. With isoPower integrated, only a single logic-side supply is needed - cutting the BOM by one transformer.
おすすめ
Building Automation Gateways
Building automation systems typically aggregate RS-485 nodes for HVAC, lighting, and access control. The ADM2567EBRNZ acts as the isolated bus interface between a low-voltage controller (e.g., a 3.3 V MCU) and the building-wide RS-485 trunk, providing 3 kV rms isolation to protect the controller from mis-wired field cabling. The 25 Mbps capability supports modern BACnet MS/TP and high-speed Modbus backbones, while the integrated isoPower eliminates an external DC-DC and reduces enclosure size.
おすすめ
Medical Equipment Isolation
Medical devices such as patient monitors, infusion pumps, and imaging systems require reinforced isolation between patient-connected circuits and the operator console, per IEC 60601-1. The ADM2567EBRNZ's 3 kV rms isolation and on-chip isoPower reduce PCB footprint in densely packed medical instruments. The ±15 kV ESD on the bus pins protects against electrostatic discharge during cleaning and operator handling. The wide-body SOIC package also provides the creepage and clearance margins needed for 2 MOPP (Means of Patient Protection) certification.
おすすめ
Renewable Energy / Battery Management
Battery management systems (BMS) for grid-scale storage and electric-vehicle charging stations require isolated RS-485 between the high-voltage battery stack and the supervisory controller. The ADM2567EBRNZ provides 3 kV rms isolation and 250 kV/µs CMTI, ensuring robust communication despite the high-switching-noise environment. The integrated isoPower simplifies the thermal design by removing an external transformer from the high-voltage side. With 25 Mbps capability, the part also supports high-throughput telemetry for cell-balancing monitoring.
おすすめ
Industrial Sensor Networks
Distributed 4-20 mA loops and HART networks are increasingly being migrated to RS-485 multi-drop buses for higher density. The ADM2567EBRNZ provides the isolated bus interface for HART and Modbus sensor hubs, with 3 kV rms isolation protecting the central controller from field-cable faults. The 25 Mbps data rate supports multi-MHz sensor aggregation, while the integrated isoPower shrinks the sensor-hub PCB to a quarter of the size of a discrete-isolator-plus-DC-DC implementation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ADM2567EBRNZ — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ADM2565EBRNZ | ADM2563EBRNZ | ADM2561EBRNZ-RL7 | ADM2461EBRWZ-RL | MAX14882AWE+T | ISO5852DW |
|---|---|---|---|---|---|---|---|
| Package | 28-pin SOIC-W | 28-pin SOIC-W (same) | 28-pin SOIC-W (same) | 28-pin SOIC-W (same) | 16-pin SOIC-W (different) | 16-pin SOIC-W (different) | 16-pin SOIC-W (different) |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices (Maxim) | Texas Instruments |
| Isolation Voltage | 3 kV rms | 3 kV rms | 3 kV rms | 3 kV rms | 5 kV rms | 5 kV rms | 5 kV rms |
| Integrated Isolated DC-DC | Yes (isoPower) | Yes (isoPower) | Yes (isoPower) | Yes (isoPower) | No (external supply) | No (external supply) | No (external supply) |
| Channels | 4 (signal) | 4 (signal) | 4 (signal) | 4 (signal) | 3 (signal) | 2 (signal) | 2 (signal) |
主な差別化要因
- Integrated isoPower DC-DC eliminates external isolated supply （vs TI ISO5852DW)
- ±15 kV IEC 61000-4-2 contact-discharge ESD on bus pins （vs TI ISO5852DW (4 kV))
- 25 Mbps maximum data rate (vs slew-rate-limited siblings) （vs ADM2565EBRNZ / ADM2563EBRNZ)
設計ノート
Per the ADM2561E/63E/65E/67E datasheet, place 100 nF and 10 µF bypass capacitors as close as possible to VDD1 and the isolated VDDB pin. The wide-body SOIC footprint provides the creepage required for 3 kV rms reinforced isolation - do not place any traces under the package body that would reduce clearance. A grounded guard ring around the bus-side pins improves surge immunity and prevents surface arcing during IEC 61000-4-2 testing.
Estimated: with VDD1 = 5 V at 100 mA logic current, plus 50 mA of bus-side load, the isoPower DC-DC dissipates roughly (5 V - 3.3 V) × 0.15 A ≈ 255 mW. The 28-pin SOIC-W has θJA ≈ 80 °C/W on a 4-layer board, yielding a junction rise of ~20 °C above ambient - well within the 125 °C limit. Derate by 25% if using a 2-layer board or if the part sits in a sealed enclosure without forced airflow.
Do not place a TVS diode directly across the A/B bus pins of the ADM2567EBRNZ - the on-chip ±15 kV ESD protection already meets IEC 61000-4-2 contact-discharge requirements, and an external TVS can clip the bus signal and corrupt high-speed data. If you need additional surge protection (IEC 61000-4-5), use a lower-capacitance TVS such as the PESD3V3L4UG at the connector, not at the IC pins.
Keep the bus-side traces (A, B, Y, Z) as short as possible and route them away from the logic-side RXD/TXD/DE/RE traces to minimize coupling. The integrated isolated DC-DC operates at ~125 MHz; place a small ferrite bead or RC snubber on the VDD1 supply pin if the logic-side supply is shared with a noisy switching converter. Use a continuous ground plane on layer 2 and stitch the logic-side and bus-side grounds with 0402 capacitors at the package corners.
コンプライアンス情報
RoHS and REACH compliance per Analog Devices product page. Not AEC-Q100 qualified (not an automotive-grade part). The datasheet declares compliance with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987 (E) for the RS-485 protocol layer, and IEC 61000-4-2 / IEC 61000-4-5 for ESD/surge immunity.
