ADS5525IRGZ25 - 12-bit 170 MSPS ADC with DDR LVDS/CMOS Outputs
部品番号: ADS5525IRGZ25 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.5 | $13,750.00 |
| 1,000 | $24.75 | $24,750.00 |
ADS5525IRGZ25 概要
What is a pipelined ADC? A pipelined analog-to-digital converter is a high-speed sampling architecture that cascades multiple low-resolution flash stages to achieve higher resolution while maintaining fast conversion rates. Each stage samples, quantizes, and passes a residue to the next stage, with digital error correction applied across the pipeline. Pipelined ADCs sit within the hierarchy of analog-to-digital converters -> data converters -> signal chain ICs -> semiconductors, and are the dominant choice for sampling rates between 10 MSPS and 500 MSPS where 8- to 16-bit resolution is required.
Key features of the ADS5525IRGZ25 include 12-bit resolution, 170 MSPS maximum sampling rate, differential analog inputs, integrated sample-and-hold, programmable internal gain for SFDR optimization at full-scale input, and an LVDS/CMOS selectable output interface that supports both single-data-rate and double-data-rate clocking. The device achieves high SNR and SFDR simultaneously at high input frequencies, making it suitable for digitizing wide-bandwidth IF signals without compromising dynamic range.
Architecturally, the converter uses a multi-stage pipelined core with internal reference and biasing networks. It operates from a single 3.3 V analog supply and a 3.3 V or 1.8 V digital supply, with separate analog and digital grounds to minimize coupling. The internal clock buffer accepts an external CMOS clock and distributes low-jitter sampling edges to the pipeline stages.
Typical applications include wireless communication base-station receivers, medical imaging systems such as ultrasound beamformers, radar and lidar front-ends, broadband satellite receivers, and high-speed industrial test instrumentation. Programmable gain enables SFDR optimization for narrow-band IF inputs.
A primary design consideration is the LVDS/CMOS output-mode selection: DDR LVDS reduces pin count and EMI but requires an LVDS receiver on the FPGA side, while parallel CMOS simplifies board layout but increases the package's digital I/O count. Power dissipation scales with sampling rate and output mode.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, with cross-references to companion clocking and amplifier parts for a complete signal-chain design.
ドロップイン代替品: ADS5525IRGZ25 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
ADS5525IRGZR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ADS5525IRGZT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ADS5525IRGZTG4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ADS5525IRGZ25 最大定格＆電気的特性
| 分解能 | 12 bit |
| サンプリングレート | 170 MSPS |
| Number of Channels | 1 |
| Architecture | Pipelined |
| Input Type | Differential |
| Output Interface | DDR LVDS / Parallel CMOS (selectable) |
| Analog Supply Voltage | 3.3 V |
| Digital Supply Voltage | 3.3 V or 1.8 V |
| Power Dissipation | 1275 mW (maximum, per FindIC) |
| 動作温度範囲 | -40C to +85C (industrial) |
| パッケージ | 48-VQFN (RGZ) 7x7 mm |
| 実装タイプ | Surface Mount |
| Temperature Grade | Industrial |
| Terminal Form | No Lead |
| Terminal Count | 48 |
| Package Code | HVQCCN |
| RoHS ステータス | Compliant |
ADS5525IRGZ25 ピン構成
| ピン 1 | AINP — Differential analog input positive |
| ピン 2 | AINN — Differential analog input negative |
| ピン 3 | VCM — Common-mode voltage output |
| ピン 4 | REFT — Reference decoupling top |
| ピン 5 | REFB — Reference decoupling bottom |
| ピン 6 | VD1 — Digital supply voltage |
| ピン 7 | GND — Ground |
| ピン 8 | VD2 — Digital supply voltage |
| ピン 9 | D0_DOUT_L0_P — DDR LVDS / CMOS data output |
| ピン 10 | D0_DOUT_L0_N — DDR LVDS / CMOS data output complement |
| ピン 11 | D1_DOUT_L1_P — DDR LVDS / CMOS data output |
| ピン 12 | D1_DOUT_L1_N — DDR LVDS / CMOS data output complement |
| ピン 13 | D2_DOUT_L2_P — DDR LVDS / CMOS data output |
| ピン 14 | D2_DOUT_L2_N — DDR LVDS / CMOS data output complement |
| ピン 15 | D3_DOUT_L3_P — DDR LVDS / CMOS data output |
| ピン 16 | D3_DOUT_L3_N — DDR LVDS / CMOS data output complement |
| ピン 17 | D4_DOUT_L4_P — DDR LVDS / CMOS data output |
| ピン 18 | D4_DOUT_L4_N — DDR LVDS / CMOS data output complement |
| ピン 19 | D5_DOUT_L5_P — DDR LVDS / CMOS data output |
| ピン 20 | D5_DOUT_L5_N — DDR LVDS / CMOS data output complement |
| ピン 21 | D6_DOUT_L6_P — DDR LVDS / CMOS data output |
| ピン 22 | D6_DOUT_L6_N — DDR LVDS / CMOS data output complement |
| ピン 23 | D7_DOUT_L7_P — DDR LVDS / CMOS data output |
| ピン 24 | D7_DOUT_L7_N — DDR LVDS / CMOS data output complement |
| ピン 25 | D8_DOUT_L8_P — DDR LVDS / CMOS data output |
| ピン 26 | D8_DOUT_L8_N — DDR LVDS / CMOS data output complement |
| ピン 27 | D9_DOUT_L9_P — DDR LVDS / CMOS data output |
| ピン 28 | D9_DOUT_L9_N — DDR LVDS / CMOS data output complement |
| ピン 29 | D10_DOUT_L10_P — DDR LVDS / CMOS data output |
| ピン 30 | D10_DOUT_L10_N — DDR LVDS / CMOS data output complement |
| ピン 31 | D11_DOUT_L11_P — DDR LVDS / CMOS data output |
| ピン 32 | D11_DOUT_L11_N — DDR LVDS / CMOS data output complement |
| ピン 33 | CLKOUT_P — DDR LVDS clock output positive |
| ピン 34 | CLKOUT_N — DDR LVDS clock output complement |
| ピン 35 | DRDY_P — Data ready DDR LVDS output positive |
| ピン 36 | DRDY_N — Data ready DDR LVDS output complement |
| ピン 37 | MODE — Output mode select (LVDS/CMOS) |
| ピン 38 | GAIN — Programmable gain control |
| ピン 39 | CLKIN — External clock input |
| ピン 40 | SEN — Serial interface enable |
| ピン 41 | SCLK — Serial interface clock |
| ピン 42 | SDATA — Serial interface data |
| ピン 43 | RESET — Hardware reset |
| ピン 44 | PDN — Power-down control |
| ピン 45 | VA1 — Analog supply voltage |
| ピン 46 | VA2 — Analog supply voltage |
| ピン 47 | VBGAP — Bandgap reference bypass |
| ピン 48 | EPAD — Exposed thermal pad (ground) |
主な用途
ADS5525IRGZ25 の用途: 6 件s: Wireless Base-Station IF Sampling, Medical Ultrasound Beamformer, Radar and Lidar Signal Capture, Broadband Satellite Receiver, High-Speed Test Instrumentation, Industrial Spectrum Analyzer.
Wireless Base-Station IF Sampling
The ADS5525IRGZ25 digitizes intermediate-frequency (IF) signals in multi-carrier GSM, W-CDMA, and LTE base-station receivers where 12-bit resolution at 170 MSPS provides adequate dynamic range for adjacent-channel rejection. Its DDR LVDS outputs reduce pin count and EMI when interfacing to Altera or Xilinx FPGAs that perform digital down-conversion and channelization. Programmable internal gain optimizes SFDR at the typical -6 to -10 dBFS input levels used in receiver chains.
おすすめ
Medical Ultrasound Beamformer
In ultrasound imaging systems the ADS5525IRGZ25 samples 5-15 MHz transducer IF signals at 170 MSPS, providing the 12-bit dynamic range needed for harmonic imaging while leaving sufficient headroom for time-gain compensation. The differential inputs accept outputs from a low-noise LNA, and the LVDS outputs drive multi-channel FPGA beamforming ASICs across 64-128 channel probes. The 48-VQFN package's small footprint enables compact multi-channel board layouts.
おすすめ
Radar and Lidar Signal Capture
The ADS5525IRGZ25 captures wide-bandwidth IF outputs from radar and lidar receivers where 170 MSPS sampling enables direct sampling of intermediate frequencies up to 80 MHz. Its pipelined architecture delivers the SFDR required to resolve small returns in the presence of large clutter, and the LVDS output mode supports long PCB traces to FPGA DSP blocks without signal degradation. Differential analog inputs reject common-mode noise from switching power converters in the system.
おすすめ
Broadband Satellite Receiver
Satellite receiver IF chains down-convert Ku-band or Ka-band signals to a 70-140 MHz IF that the ADS5525IRGZ25 digitizes directly at 170 MSPS. The 12-bit resolution provides sufficient SNR for QPSK and 8-PSK demodulation in DVB-S2 receivers, and the CMOS output mode simplifies interface to ASIC demodulators. Programmable gain optimizes SFDR for varying satellite link conditions and adjacent satellite interference scenarios.
おすすめ
High-Speed Test Instrumentation
In automated test equipment (ATE) and oscilloscope front-ends, the ADS5525IRGZ25 digitizes transient signals and repetitive waveforms for analysis. Its 170 MSPS sampling combined with 12-bit resolution suits mid-bandwidth digitizers for production-line testing of RF modules and mixed-signal ICs. The CMOS parallel output mode enables connection to standard logic analyzers and FPGA-based signal-processing engines used in modern test platforms.
おすすめ
Industrial Spectrum Analyzer
Spectrum analyzers and signal-monitoring equipment use the ADS5525IRGZ25 to digitize wide-bandwidth IF signals for FFT processing in FPGAs. The 170 MSPS sample rate enables real-time bandwidth analysis up to 70 MHz, while the 12-bit resolution provides >70 dB dynamic range typical of mid-tier spectrum analyzers. Differential inputs reject noise from switching power stages in the analyzer's mixed-signal chassis.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ADS5525IRGZ25 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ADS5525IRGZR | ADS5525IRGZT | ADS5525IRGZTG4 |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 48-VQFN (RGZ) 7x7 mm | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit |
| Sampling Rate | 170 MSPS | 170 MSPS | 170 MSPS | 170 MSPS |
| Architecture | Pipelined | Pipelined | Pipelined | Pipelined |
| Analog Supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Output Interface | DDR LVDS / CMOS | DDR LVDS / CMOS | DDR LVDS / CMOS | DDR LVDS / CMOS |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主な差別化要因
- Identical die and pinout - lowest-risk replacement option （vs ADS5525IRGZR)
- Same die in lead-free tape-and-reel packaging （vs ADS5525IRGZTG4)
- User-selectable DDR LVDS or parallel CMOS outputs in one device （vs ADS5525IRGZT)
設計ノート
The 48-VQFN package requires the exposed thermal pad (EPAD, pin 48) to be soldered directly to a ground plane on the top layer for both thermal dissipation and electrical grounding. Use an array of thermal vias beneath the pad to conduct heat to inner ground planes. Separate analog (VA1/VA2) and digital (VD1/VD2) supply planes, joining them at a single point near the ADC's ground pin to prevent digital switching noise from coupling into the analog front-end.
Estimated: At 170 MSPS sampling rate with CMOS outputs enabled, the ADS5525 draws up to 1275 mW total. Provide 3.3 V from a low-noise LDO such as TPS7A4700 (4.17 uVrms noise) rather than a switching converter to avoid degrading SNR. Decouple each VA/VD pin with a 10 uF bulk plus 0.1 uF and 1 nF ceramic capacitors placed within 2 mm of the package pin.
Drive the CLKIN pin with a low-jitter, low-phase-noise clock source such as the CDCE72010 or LMK04803; jitter above 1 ps rms directly degrades SNR at high input frequencies. Route the differential analog input pair (AINP/AINN) with controlled 100-ohm differential impedance, length-matched within 0.5 mm, and isolated from digital output traces by a ground strip to prevent digital-to-analog crosstalk.
コンプライアンス情報
RoHS compliant per TI product page. Industrial temperature grade (-40C to +85C) is not automotive-qualified; for AEC-Q100 applications use a Q100-graded ADC such as the ADS62P49 family.
