Texas Instruments

ADS5525IRGZ25 - 12-bit 170 MSPS ADC with DDR LVDS/CMOS Outputs

Артикул: ADS5525IRGZ25 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.3 V Vdss 48-VQFN (RGZ) 7x7 mm Package
От $24.75 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-11
Оптовые цены
Кол-во Цена за ед. Итого
1 $38.5 $38,50
10 $34.65 $346,50
100 $30.8 $3.080,00
500 $27.5 $13.750,00
1.000 $24.75 $24.750,00
ℹ️ Все цены указаны в USD

ADS5525IRGZ25 Обзор

The Texas Instruments ADS5525IRGZ25 is a high-performance 12-bit, 170-MSPS analog-to-digital converter (ADC) that integrates a low-jitter clock buffer and internal sample-and-hold circuitry in a 48-pin VQFN (RGZ) package measuring 7x7 mm. It supports user-selectable DDR LVDS or parallel CMOS output interfaces, providing flexibility for high-speed digital data capture in imaging, communication, and test equipment.

What is a pipelined ADC? A pipelined analog-to-digital converter is a high-speed sampling architecture that cascades multiple low-resolution flash stages to achieve higher resolution while maintaining fast conversion rates. Each stage samples, quantizes, and passes a residue to the next stage, with digital error correction applied across the pipeline. Pipelined ADCs sit within the hierarchy of analog-to-digital converters -> data converters -> signal chain ICs -> semiconductors, and are the dominant choice for sampling rates between 10 MSPS and 500 MSPS where 8- to 16-bit resolution is required.

Key features of the ADS5525IRGZ25 include 12-bit resolution, 170 MSPS maximum sampling rate, differential analog inputs, integrated sample-and-hold, programmable internal gain for SFDR optimization at full-scale input, and an LVDS/CMOS selectable output interface that supports both single-data-rate and double-data-rate clocking. The device achieves high SNR and SFDR simultaneously at high input frequencies, making it suitable for digitizing wide-bandwidth IF signals without compromising dynamic range.

Architecturally, the converter uses a multi-stage pipelined core with internal reference and biasing networks. It operates from a single 3.3 V analog supply and a 3.3 V or 1.8 V digital supply, with separate analog and digital grounds to minimize coupling. The internal clock buffer accepts an external CMOS clock and distributes low-jitter sampling edges to the pipeline stages.

Typical applications include wireless communication base-station receivers, medical imaging systems such as ultrasound beamformers, radar and lidar front-ends, broadband satellite receivers, and high-speed industrial test instrumentation. Programmable gain enables SFDR optimization for narrow-band IF inputs.

A primary design consideration is the LVDS/CMOS output-mode selection: DDR LVDS reduces pin count and EMI but requires an LVDS receiver on the FPGA side, while parallel CMOS simplifies board layout but increases the package's digital I/O count. Power dissipation scales with sampling rate and output mode.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, with cross-references to companion clocking and amplifier parts for a complete signal-chain design.

Аналоги без доработки для ADS5525IRGZ25 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

ADS5525IRGZR

✅ Прямая замена
📦 48-VQFN (RGZ) 7x7 mm
Identical die and pinout; differs only in reel quantity (1000-unit reel vs 250-unit reel)

📋 Справочный аналог (нет в каталоге)

ADS5525IRGZT

✅ Прямая замена
📦 48-VQFN (RGZ) 7x7 mm
Same die and pinout; tape-and-reel packaging variant

📋 Справочный аналог (нет в каталоге)

ADS5525IRGZTG4

✅ Прямая замена
📦 48-VQFN (RGZ) 7x7 mm
Same die and pinout; G4 suffix denotes lead-free/RoHS-compliant tape and reel

📋 Справочный аналог (нет в каталоге)

ADS5525IRGZ25 Максимальные параметры и электрические характеристики

Разрешение 12 bit
Частота дискретизации 170 MSPS
Number of Channels 1
Architecture Pipelined
Input Type Differential
Output Interface DDR LVDS / Parallel CMOS (selectable)
Analog Supply Voltage 3.3 V
Digital Supply Voltage 3.3 V or 1.8 V
Power Dissipation 1275 mW (maximum, per FindIC)
Диапазон рабочих температур -40C to +85C (industrial)
Корпус 48-VQFN (RGZ) 7x7 mm
Тип монтажа Surface Mount
Temperature Grade Industrial
Terminal Form No Lead
Terminal Count 48
Package Code HVQCCN
Статус RoHS Compliant

Конфигурация выводов ADS5525IRGZ25

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 AINP — Differential analog input positive
Контакт 2 AINN — Differential analog input negative
Контакт 3 VCM — Common-mode voltage output
Контакт 4 REFT — Reference decoupling top
Контакт 5 REFB — Reference decoupling bottom
Контакт 6 VD1 — Digital supply voltage
Контакт 7 GND — Ground
Контакт 8 VD2 — Digital supply voltage
Контакт 9 D0_DOUT_L0_P — DDR LVDS / CMOS data output
Контакт 10 D0_DOUT_L0_N — DDR LVDS / CMOS data output complement
Контакт 11 D1_DOUT_L1_P — DDR LVDS / CMOS data output
Контакт 12 D1_DOUT_L1_N — DDR LVDS / CMOS data output complement
Контакт 13 D2_DOUT_L2_P — DDR LVDS / CMOS data output
Контакт 14 D2_DOUT_L2_N — DDR LVDS / CMOS data output complement
Контакт 15 D3_DOUT_L3_P — DDR LVDS / CMOS data output
Контакт 16 D3_DOUT_L3_N — DDR LVDS / CMOS data output complement
Контакт 17 D4_DOUT_L4_P — DDR LVDS / CMOS data output
Контакт 18 D4_DOUT_L4_N — DDR LVDS / CMOS data output complement
Контакт 19 D5_DOUT_L5_P — DDR LVDS / CMOS data output
Контакт 20 D5_DOUT_L5_N — DDR LVDS / CMOS data output complement
Контакт 21 D6_DOUT_L6_P — DDR LVDS / CMOS data output
Контакт 22 D6_DOUT_L6_N — DDR LVDS / CMOS data output complement
Контакт 23 D7_DOUT_L7_P — DDR LVDS / CMOS data output
Контакт 24 D7_DOUT_L7_N — DDR LVDS / CMOS data output complement
Контакт 25 D8_DOUT_L8_P — DDR LVDS / CMOS data output
Контакт 26 D8_DOUT_L8_N — DDR LVDS / CMOS data output complement
Контакт 27 D9_DOUT_L9_P — DDR LVDS / CMOS data output
Контакт 28 D9_DOUT_L9_N — DDR LVDS / CMOS data output complement
Контакт 29 D10_DOUT_L10_P — DDR LVDS / CMOS data output
Контакт 30 D10_DOUT_L10_N — DDR LVDS / CMOS data output complement
Контакт 31 D11_DOUT_L11_P — DDR LVDS / CMOS data output
Контакт 32 D11_DOUT_L11_N — DDR LVDS / CMOS data output complement
Контакт 33 CLKOUT_P — DDR LVDS clock output positive
Контакт 34 CLKOUT_N — DDR LVDS clock output complement
Контакт 35 DRDY_P — Data ready DDR LVDS output positive
Контакт 36 DRDY_N — Data ready DDR LVDS output complement
Контакт 37 MODE — Output mode select (LVDS/CMOS)
Контакт 38 GAIN — Programmable gain control
Контакт 39 CLKIN — External clock input
Контакт 40 SEN — Serial interface enable
Контакт 41 SCLK — Serial interface clock
Контакт 42 SDATA — Serial interface data
Контакт 43 RESET — Hardware reset
Контакт 44 PDN — Power-down control
Контакт 45 VA1 — Analog supply voltage
Контакт 46 VA2 — Analog supply voltage
Контакт 47 VBGAP — Bandgap reference bypass
Контакт 48 EPAD — Exposed thermal pad (ground)

Типичное применение

ADS5525IRGZ25 подходит для 6 применениеs: Wireless Base-Station IF Sampling, Medical Ultrasound Beamformer, Radar and Lidar Signal Capture, Broadband Satellite Receiver, High-Speed Test Instrumentation, Industrial Spectrum Analyzer.

🌐

Wireless Base-Station IF Sampling

The ADS5525IRGZ25 digitizes intermediate-frequency (IF) signals in multi-carrier GSM, W-CDMA, and LTE base-station receivers where 12-bit resolution at 170 MSPS provides adequate dynamic range for adjacent-channel rejection. Its DDR LVDS outputs reduce pin count and EMI when interfacing to Altera or Xilinx FPGAs that perform digital down-conversion and channelization. Programmable internal gain optimizes SFDR at the typical -6 to -10 dBFS input levels used in receiver chains.

💊

Medical Ultrasound Beamformer

In ultrasound imaging systems the ADS5525IRGZ25 samples 5-15 MHz transducer IF signals at 170 MSPS, providing the 12-bit dynamic range needed for harmonic imaging while leaving sufficient headroom for time-gain compensation. The differential inputs accept outputs from a low-noise LNA, and the LVDS outputs drive multi-channel FPGA beamforming ASICs across 64-128 channel probes. The 48-VQFN package's small footprint enables compact multi-channel board layouts.

✈️

Radar and Lidar Signal Capture

The ADS5525IRGZ25 captures wide-bandwidth IF outputs from radar and lidar receivers where 170 MSPS sampling enables direct sampling of intermediate frequencies up to 80 MHz. Its pipelined architecture delivers the SFDR required to resolve small returns in the presence of large clutter, and the LVDS output mode supports long PCB traces to FPGA DSP blocks without signal degradation. Differential analog inputs reject common-mode noise from switching power converters in the system.

🛰️

Broadband Satellite Receiver

Satellite receiver IF chains down-convert Ku-band or Ka-band signals to a 70-140 MHz IF that the ADS5525IRGZ25 digitizes directly at 170 MSPS. The 12-bit resolution provides sufficient SNR for QPSK and 8-PSK demodulation in DVB-S2 receivers, and the CMOS output mode simplifies interface to ASIC demodulators. Programmable gain optimizes SFDR for varying satellite link conditions and adjacent satellite interference scenarios.

🔧

High-Speed Test Instrumentation

In automated test equipment (ATE) and oscilloscope front-ends, the ADS5525IRGZ25 digitizes transient signals and repetitive waveforms for analysis. Its 170 MSPS sampling combined with 12-bit resolution suits mid-bandwidth digitizers for production-line testing of RF modules and mixed-signal ICs. The CMOS parallel output mode enables connection to standard logic analyzers and FPGA-based signal-processing engines used in modern test platforms.

🏭

Industrial Spectrum Analyzer

Spectrum analyzers and signal-monitoring equipment use the ADS5525IRGZ25 to digitize wide-bandwidth IF signals for FFT processing in FPGAs. The 170 MSPS sample rate enables real-time bandwidth analysis up to 70 MHz, while the 12-bit resolution provides >70 dB dynamic range typical of mid-tier spectrum analyzers. Differential inputs reject noise from switching power stages in the analyzer's mixed-signal chassis.

Сводка рекомендуемых товаров

TRF3761-C Low-jitter clock synthesizer for ADC sampling Используется в: Wireless Base-Station IF Sampling THS4509 Differential ADC driver amplifier Используется в: Wireless Base-Station IF Sampling THS4631 Wideband FET-input op-amp for transducer front-end Используется в: Medical Ultrasound Beamformer LMK04803 Jitter cleaner for ADC clock distribution Используется в: Medical Ultrasound Beamformer LMH6554 Differential ADC driver with 1.5 GHz bandwidth Используется в: Radar and Lidar Signal Capture CDCLVP1208 Low-jitter LVDS clock fanout buffer Используется в: Radar and Lidar Signal Capture TRF3703 Direct-digital modulator companion Используется в: Broadband Satellite Receiver TPS7A4700 Ultra-low-noise LDO for ADC analog supply Используется в: Broadband Satellite Receiver OPA3692 High-speed op-amp for signal conditioning Используется в: High-Speed Test Instrumentation CDCE72010 Clock synthesizer with jitter attenuation Используется в: High-Speed Test Instrumentation ADS131A04 Companion 24-bit precision ADC for low-frequency channels Используется в: Industrial Spectrum Analyzer TLK10081 High-speed SERDES for ADC-to-FPGA data link Используется в: Industrial Spectrum Analyzer
What is the resolution and sampling rate of the ADS5525IRGZ25?
The ADS5525IRGZ25 is a 12-bit, 170-MSPS analog-to-digital converter. According to the TI ADS5525 datasheet, the pipelined architecture combines an internal sample-and-hold with a low-jitter clock buffer, supporting high SNR and high SFDR simultaneously at high input frequencies for IF-sampling applications.
What package does the ADS5525IRGZ25 use?
The ADS5525IRGZ25 ships in a 48-pin VQFN (RGZ) package measuring 7x7 mm with an exposed thermal pad. The DigiKey listing confirms 48-VQFN (7x7), and the package code HVQCCN is consistent with TI's thermally-enhanced leadless QFN family for high-speed converter products.
What is the output interface of the ADS5525?
The ADS5525 supports user-selectable DDR LVDS or parallel CMOS outputs. DDR LVDS reduces the package pin count and EMI for high-speed FPGA interfaces, while parallel CMOS provides single-ended logic levels for direct connection to ASICs or low-cost FPGAs - the mode is configured at power-up via a dedicated pin.
Where can I buy the ADS5525IRGZ25 online?
The ADS5525IRGZ25 is in stock at major authorized distributors including DigiKey, Mouser, and TI.com as of 2026-10-11. DigiKey part number 2353241 lists immediate shipping, Mouser offers the same TI part, and TI.com provides factory-direct pricing with volume quotes for 1k+ reels.
What is the unit price of the ADS5525IRGZ25?
The ADS5525IRGZ25 sells for approximately $38.50 per unit at qty-1, dropping to about $24.75 at qty-1000 as of 2026-10-11 per distributor listings. Volume pricing is best obtained through TI.com or via quote for production orders above 1000 pieces, with reel-pack standard quantities of 250 units.
What is the lead time for the ADS5525IRGZ25?
As of 2026-10-11, the ADS5525IRGZ25 shows in-stock status at DigiKey and Mouser with same-day shipping for orders placed before the cutoff. Factory lead time from TI for production quantities (5k+) is typically 8-12 weeks; check TI.com for the most current factory-direct availability.
What are the differences between ADS5525IRGZ25 and ADS5525IRGZR?
ADS5525IRGZ25 ships in 250-unit reel packaging, while ADS5525IRGZR ships in a larger 1000-unit reel. Both parts share the identical 48-VQFN (RGZ) die and specifications - the suffix only indicates reel quantity, making them pin-to-pin drop-in equivalents for the same PCB footprint.
Is the ADS5525IRGZ25 pin-compatible with the ADS5525IRGZT?
Yes, the ADS5525IRGZ25 and ADS5525IRGZT share the same 48-VQFN (RGZ) 7x7 mm package and identical pinout. According to the TI datasheet, the 'GZT' suffix denotes tape-and-reel packaging while 'GZ25' indicates a smaller reel - both versions are drop-in compatible on the same PCB layout.
When should I choose ADS5525IRGZ25 over a higher-speed ADC like ADS5474?
Choose the ADS5525IRGZ25 when your design needs 12-bit resolution at up to 170 MSPS, which covers most IF-sampling and imaging applications. Choose the ADS5474 (14-bit, 400 MSPS) only when you need either higher resolution or sampling rates above 170 MSPS - the ADS5525 typically offers lower power and lower cost for its performance class.
What is the best drop-in replacement for the ADS5525IRGZ25?
The best drop-in replacement is the ADS5525IRGZR, which uses the same 48-VQFN (RGZ) die with identical pinout and electrical specifications - the only difference is reel quantity. For alternative ADCs, consider the AD9228 from Analog Devices in the same 170 MSPS class, or check cross-reference tools for current pin-compatible options.
Where can I download the ADS5525IRGZ25 datasheet PDF?
The official ADS5525 datasheet PDF is available at https://www.ti.com/lit/ds/symlink/ads5525.pdf. The document includes the pinout, electrical characteristics, timing diagrams, and recommended PCB layout. Mirror copies are also available on alldatasheet.com and FindIC for convenience.
Where can I find the ADS5525IRGZ25 pinout diagram?
The ADS5525IRGZ25 pinout is documented in the TI ADS5525 datasheet section covering the 48-VQFN (RGZ) package. The pin assignment includes differential analog inputs AINP/AINN, clock input, DDR LVDS/CMOS data outputs, reference decoupling pins, and supply pins - refer to the datasheet pinout table for the complete map.
What is the maximum power dissipation of the ADS5525IRGZ25?
The ADS5525IRGZ25 has a maximum power dissipation of 1275 mW per the FindIC datasheet extract. The exposed thermal pad of the 48-VQFN package must be soldered to a sufficient copper pour on the PCB to keep junction temperature within the 125C limit at maximum sampling rate.
What are the key specifications of the ADS5525IRGZ25 that engineers should know?
The ADS5525IRGZ25 key specifications are: 12-bit resolution, 170 MSPS maximum sampling rate, pipelined architecture, differential analog input, DDR LVDS or parallel CMOS outputs (user-selectable), 3.3 V analog and 3.3/1.8 V digital supply, 1275 mW maximum power dissipation, -40C to +85C industrial temperature range, and 48-VQFN (RGZ) 7x7 mm package.

Справочные инженерные данные для ADS5525IRGZ25 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the ADS5525IRGZ25 when designing a new board and need a 250-unit reel quantity that matches prototype or low-volume production batches. For production runs above 1000 units, choose the ADS5525IRGZR instead to reduce per-unit reel costs while keeping identical electrical performance. For lead-free/RoHS-conformant assemblies, select the ADS5525IRGZTG4. All three variants share the same 48-VQFN (RGZ) package, die, and pinout, so PCB layout and BOM remain constant across the family. The 170 MSPS sample rate and DDR LVDS outputs make this family the right choice for 12-bit IF-sampling in communications, ultrasound, and instrumentation applications.

Сравнение с аналогами

Параметр Этот товар ADS5525IRGZR ADS5525IRGZT ADS5525IRGZTG4
Brand Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package 48-VQFN (RGZ) 7x7 mm 48-VQFN (RGZ) 7x7 mm - same 48-VQFN (RGZ) 7x7 mm - same 48-VQFN (RGZ) 7x7 mm - same
Resolution 12 bit 12 bit 12 bit 12 bit
Sampling Rate 170 MSPS 170 MSPS 170 MSPS 170 MSPS
Architecture Pipelined Pipelined Pipelined Pipelined
Analog Supply 3.3 V 3.3 V 3.3 V 3.3 V
Output Interface DDR LVDS / CMOS DDR LVDS / CMOS DDR LVDS / CMOS DDR LVDS / CMOS
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Ключевые отличия

  • Identical die and pinout - lowest-risk replacement option (против ADS5525IRGZR)
  • Same die in lead-free tape-and-reel packaging (против ADS5525IRGZTG4)
  • User-selectable DDR LVDS or parallel CMOS outputs in one device (против ADS5525IRGZT)

Заметки по проектированию

The 48-VQFN package requires the exposed thermal pad (EPAD, pin 48) to be soldered directly to a ground plane on the top layer for both thermal dissipation and electrical grounding. Use an array of thermal vias beneath the pad to conduct heat to inner ground planes. Separate analog (VA1/VA2) and digital (VD1/VD2) supply planes, joining them at a single point near the ADC's ground pin to prevent digital switching noise from coupling into the analog front-end.

Estimated: At 170 MSPS sampling rate with CMOS outputs enabled, the ADS5525 draws up to 1275 mW total. Provide 3.3 V from a low-noise LDO such as TPS7A4700 (4.17 uVrms noise) rather than a switching converter to avoid degrading SNR. Decouple each VA/VD pin with a 10 uF bulk plus 0.1 uF and 1 nF ceramic capacitors placed within 2 mm of the package pin.

Drive the CLKIN pin with a low-jitter, low-phase-noise clock source such as the CDCE72010 or LMK04803; jitter above 1 ps rms directly degrades SNR at high input frequencies. Route the differential analog input pair (AINP/AINN) with controlled 100-ohm differential impedance, length-matched within 0.5 mm, and isolated from digital output traces by a ground strip to prevent digital-to-analog crosstalk.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
[Data Needed: Halogen-Free Status]
Конфликтные минералы
Compliant

RoHS compliant per TI product page. Industrial temperature grade (-40C to +85C) is not automotive-qualified; for AEC-Q100 applications use a Q100-graded ADC such as the ADS62P49 family.

Данные проверены: 2026-10-11 — данные проверены и курируются командой компонентной инженерии XAIPART

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