AFS600-1FG484K - 600K Gate Fusion FPGA | Microchip Technology
部品番号: AFS600-1FG484K ✓ 生産中AFS600-1FG484K 概要
A field-programmable gate array is a semiconductor whose digital logic and interconnect can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, which includes complex programmable logic devices, while a mixed-signal FPGA adds configurable analog functions to that programmable digital fabric. The AFS600 belongs to the Fusion mixed-signal FPGA family and is positioned for designs that require substantial logic resources, programmable I/O, and analog integration.
Verified product information identifies the AFS600-1FG484K as a 600,000-system-gate Fusion FPGA with 172 I/Os and a 484-BGA package. Related AFS600 family information lists 13,824 logic cells, and the AFS600-FG484K configuration is documented with 108 Kb of block RAM. The package is supplied in a tray according to the Newark listing and measures 23 mm by 23 mm by 2.44 mm. The Newark product record also identifies the device as RoHS compliant.
The Fusion architecture is designed to place configurable analog, large embedded flash-memory blocks, clock-management circuitry, and flash-based programmable logic in one device. This integration can reduce the number of external components in applications that combine control logic with analog measurement or output functions. Flash-based configuration is also useful for designs that must retain their programmed configuration when power is removed, although developers should consult the manufacturer datasheet for complete programming, configuration, and power specifications.
Typical AFS600 applications include industrial control and automation, communications equipment, instrumentation, embedded mixed-signal subsystems, and test systems requiring flexible logic and analog resources. The 172 I/O count provides a substantial external interface, while 600,000 system gates support larger control and datapath designs. Engineers should confirm that the selected board footprint, speed grade, temperature grade, and configuration requirements exactly match the original device before releasing production hardware.
The primary design consideration is package-level continuity. The target uses a 484-BGA footprint measuring 23 mm by 23 mm, so a substitute must match the ball layout, pin functions, power requirements, configuration interface, and electrical timing. Sufficient PCB-routing density, ground-plane continuity, decoupling, and thermal management are essential for this high-pin-count BGA device. Pin-level details must be checked against the official AFS600 datasheet before layout release.
This page consolidates verified distributor and manufacturer information, same-package replacement candidates, pricing context, and practical selection guidance. It distinguishes documented facts from missing device data so engineers can assess drop-in suitability without relying on an unsupported assumption that a similar package or gate count guarantees compatibility.
ドロップイン代替品: AFS600-1FG484K — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: AFS600-1FG484K （同一形状・フットプリント） — 相違点: Package, System Gates, Clock Management, Processor Core, RoHS Status.
M1AFS600-1FGG484K
✅ ドロップイン価格はお問い合わせください
データシートを見る →M1AFS600-1FG484K
✅ ドロップイン価格はお問い合わせください
データシートを見る →M1AFS600-FG484K
✅ ドロップイン価格はお問い合わせください
データシートを見る →M1AFS600-1FG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →AFS600-1FGG484YK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
AFS600-1FG484K 最大定格＆電気的特性
| Device Type | Fusion mixed-signal FPGA |
| System Gates | 600,000 gates |
| Logic Cells | 13,824 logic cells |
| I/O Count | 172 I/Os |
| パッケージ | 484-BGA |
| Package Dimensions | 23 mm x 23 mm x 2.44 mm |
| Package Body Width | 23 mm |
| Package Body Length | 23 mm |
| Package Height | 2.44 mm |
| Block RAM | 108 Kb |
| Architecture | Flash-based programmable logic with configurable analog and clock-management circuitry |
| Logic Family | CMOS |
| 実装タイプ | Surface Mount |
| Shipping Container | Tray |
| RoHS ステータス | Compliant |
AFS600-1FG484K 2.44 mm ピン配置ガイド
AFS600-1FG484K (2.44 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: AFS600-1FG484K.
詳細は データシート をご参照ください。
主な用途
AFS600-1FG484K の用途: 6 件s: Industrial Automation Controllers, Communications and Network Interface Equipment, Precision Instrumentation and Measurement, Test and Measurement Systems, Embedded Mixed-Signal Subsystems, Data Acquisition and Signal Conditioning.
Industrial Automation Controllers
The AFS600-1FG484K fits industrial automation controllers that need 600,000 system gates and 172 I/Os for sequencing, communications, and machine-control logic. Its Fusion architecture combines programmable digital logic with configurable analog resources and embedded flash, allowing a controller to integrate control and measurement functions in one 484-BGA device. The documented 23 mm by 23 mm package provides a relatively compact high-pin-count footprint, but the PCB must support adequate BGA escape routing and power distribution. Before selection, verify the exact analog channels, I/O standards, speed grade, temperature range, and timing against the official manufacturer datasheet.
おすすめ
Communications and Network Interface Equipment
The AFS600-1FG484K is suitable for communications equipment requiring a substantial programmable datapath, 172 external I/Os, and flexible mixed-signal resources. Its 600,000 system gates and 13,824 logic cells provide capacity for protocol state machines, packet processing, framing, and supervisory logic, while the Fusion family integrates flash-based configuration and clock-management circuitry. The 484-BGA package supports dense routing but demands careful layer planning, uninterrupted ground planes, and decoupling close to power balls. Verify transceiver interfaces, I/O voltage standards, clock tolerances, and device timing before assigning pins.
おすすめ
Precision Instrumentation and Measurement
The AFS600-1FG484K can serve in programmable instrumentation where measurement sequencing, calibration control, and data processing benefit from the Fusion combination of logic and configurable analog functions. The device provides 600,000 system gates for control algorithms and 172 I/Os for external interfaces, while related AFS600 information documents 108 Kb of block RAM for data buffering. Because measurement accuracy depends on analog reference, grounding, and noise-control details not present in the verified excerpt, engineers must consult the full manufacturer datasheet for ADC and DAC resources, input ranges, and acquisition timing before finalizing the architecture.
おすすめ
Test and Measurement Systems
The AFS600-1FG484K is appropriate for configurable test systems that combine pattern generation, sequencing, acquisition control, and external stimulus management. Its 600,000-system-gate capacity can support parallel test logic, while 172 I/Os provide substantial connectivity to instruments and device-under-test fixtures. The flash-based Fusion architecture can simplify standalone control systems that need nonvolatile program storage, although configuration, boot, and update behavior must be verified in the manufacturer documentation. Layout engineers should reserve clean clock routes, controlled-power areas, and ample BGA escape resources to preserve signal integrity.
おすすめ
Embedded Mixed-Signal Subsystems
The AFS600-1FG484K is a strong fit when a product needs programmable logic and configurable analog functions without splitting the design across separate FPGA and analog devices. The Fusion family integrates configurable analog blocks, large embedded flash-memory resources, clock generation, and programmable logic in a monolithic 484-BGA package. This integration can simplify board partitioning while retaining the flexibility of in-system programmable logic. The exact analog-performance limits, embedded-memory capacity, configuration pins, and supply requirements are not present in the supplied excerpts, so all channel assignments and operating conditions must be checked against the official AFS600 datasheet.
おすすめ
Data Acquisition and Signal Conditioning
The AFS600-1FG484K can support data-acquisition systems where analog conditioning, control, buffering, and digital processing are closely coupled. Its 600,000 system gates and 13,824 logic cells provide substantial capacity for channel sequencing, filtering, correction, and data formatting, while the mixed-signal Fusion architecture can reduce interface fragmentation. The available 172 I/Os are useful for digital triggering and status signals, but they do not independently define analog performance. Before using the device in a precision acquisition path, verify converter resolution, sampling characteristics, input ranges, noise, reference requirements, and synchronization behavior in the full manufacturer documentation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: AFS600-1FG484K — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | AFS600-1FGG484K | M1AFS600-1FG484K | AFS600-FG484K | M1AFS600-1FG484I | AFS600-1FGG484YK |
|---|---|---|---|---|---|---|
| Package | 484-BGA | 484-BGA | 484-BGA | 484-FPBGA | 484-BGA | 484-BGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Product Family | Fusion mixed-signal FPGA | Fusion mixed-signal FPGA | Fusion FPGA with ARM Cortex-M1 | Fusion mixed-signal FPGA | Fusion FPGA with ARM Cortex-M1 | Fusion mixed-signal FPGA |
主な差別化要因
- Documented 172-I/O integration in the 484-BGA target （vs M1AFS600-1FG484K)
- Fusion mixed-signal integration without an identified embedded processor （vs M1AFS600-1FG484K)
- Documented package dimensions for mechanical planning （vs AFS600-1FGG484K)
- Traceable source-level pricing and inventory context （vs AFS600-1FGG484K)
設計ノート
The AFS600-1FG484K uses a 484-BGA package measuring 23 mm by 23 mm. Plan the escape fanout, microvias, ball-pitch compliance, and layer-transition rules against the manufacturer land pattern rather than treating the package name as sufficient PCB data. Preserve uninterrupted reference planes beneath the device, minimize return-path discontinuities, and validate the completed stack-up with assembly and signal-integrity analysis before fabrication.
Separate core, I/O, and analog supply requirements must be taken directly from the official AFS600 datasheet because the supplied excerpts do not expose voltage rails, current limits, or sequencing rules. Place the required bulk and high-frequency decoupling capacitors at the corresponding power and ground balls using the manufacturer-recommended layout. Do not infer acceptable rail combinations from related AFS600 suffixes, and verify startup, shutdown, and power-supply sequencing during design review.
A 484-BGA package provides substantial electrical connectivity but concentrates heat beneath the device. Use the manufacturer thermal model and the actual PCB stack-up, copper area, airflow, and surrounding component loading for junction-temperature calculations. The supplied data does not provide junction-temperature limits, theta-JA, theta-JC, or power dissipation, so no numerical thermal result can be verified here. Avoid relying on the nominal package dimensions as a substitute for thermal characterization.
Do not treat M1AFS600-1FG484K as a transparent substitute merely because its package name and gate count match. The verified M1AFS600 record identifies an integrated ARM Cortex-M1, which can change configuration, boot, and embedded-software requirements. Likewise, verify every AFS600 speed, temperature, and ordering suffix against the manufacturer device table. A valid drop-in decision requires identical ball assignments, supply rails, I/O standards, timing, configuration pins, and user-programmed bitstream compatibility.
コンプライアンス情報
The Newark AFS600-1FG484K product record explicitly states RoHS Compliant: Yes. No verified data was supplied for the other compliance categories.
