M1AFS600-1FG484K - Fusion FPGA 600K Gates 172 I/O | Microchip
MPN: M1AFS600-1FG484K ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $332.52 | $332.52 |
| 10 | $316.5 | $3,165.00 |
| 100 | $299.27 | $29,927.00 |
| 500 | $286 | $143,000.00 |
| 1,000 | $273.52 | $273,520.00 |
Drop-in alternatives for M1AFS600-1FG484K — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS600-1FGG484K
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →M1AFS600-1FG484I
✅ Drop-In✓ In Stock
$425 / Unit
View Datasheet →M1AFS600-FG484K
✅ Drop-In✓ In Stock
$108.5 / Unit
View Datasheet →M1AFS600-2FG484
✅ Drop-In✓ In Stock
$141.9 / Unit
View Datasheet →M1AFS600-2FGG484
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →AFS600-1FG484K
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS600-1FG484K Maximum Ratings & Electrical Characteristics
| Logic Technology | Flash-based FPGA (Fusion), 130 nm CMOS |
| System Gates | 600 K |
| Fabric Capacity (bits, distributor listed) | 110592 |
| User I/O | 172 |
| Processor Core | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| Package | 484-Ball FBGA (FG484) |
| Mounting Type | Surface Mount |
| Configuration | Flash-based, instant-on (no external configuration device) |
| Integrated Analog | Configurable analog blocks (Fusion mixed-signal architecture) |
| Clock Management | Integrated clock generation and management (CCC) |
| Embedded Memory | Large flash memory blocks |
| RoHS Status | RoHS Non-Compliant (contains lead, per distributor listing) |
| Lead-Free Status | Contains Lead |
M1AFS600-1FG484K 484-ball fbga (fg484) Pin Configuration Guide
Complete pinout information for M1AFS600-1FG484K (484-ball fbga (fg484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS600-1FG484K.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS600-1FG484K is suitable for 6 applications: Industrial Automation and Motor Control, Secure Embedded Systems, Mixed-Signal Instrumentation, Power Monitoring and Sequencing, Legacy System Repair and Sustainment, Communications and Interface Bridging.
Industrial Automation and Motor Control
The M1AFS600-1FG484K fits industrial motor control because its 600K-gate flash fabric generates multi-channel PWM while the integrated ARM Cortex-M1 runs the control loop, eliminating a separate MCU. Fusion's configurable analog blocks support current and voltage sense conditioning on-chip, and integrated clock generation simplifies drive-timing synchronization across the 172 available I/O. Instant-on flash configuration means the drive is active within milliseconds of power application - important for safety interlocks. Placed as the main controller, it replaces FPGA-plus-MCU-plus-PGA discrete chains, cutting BOM count; the trade-off is that the -1 speed grade bounds maximum fabric clock rate, which should be verified against your PWM resolution targets in Libero timing analysis.
Recommended
Secure Embedded Systems
Flash-based Fusion FPGAs are inherently suited to secure embedded designs: configuration data lives in nonvolatile on-chip flash, so there is no bitstream to intercept at power-up, unlike SRAM FPGAs that load from external PROMs. The M1AFS600-1FG484K adds an ARM Cortex-M1 processor, letting security-critical firmware and programmable logic coexist in one 484-ball FBGA with 172 I/O. Monolithic integration reduces the physical attack surface and board routing of secrets. Use it for secure industrial controllers and equipment authentication where IP protection matters. Note that this K variant is leaded; for products shipping under RoHS, substitute the pin-identical M1AFS600-1FGG484K green variant without any layout or firmware changes.
Recommended
Mixed-Signal Instrumentation
Bench and embedded instrumentation benefit directly from Fusion's monolithic integration of configurable analog, large flash memory blocks, and clock management alongside 600K gates of programmable logic. The M1AFS600-1FG484K implements acquisition sequencers, trigger logic, and interface bridges in fabric while the Cortex-M1 handles protocol and user-facing control, and on-chip analog blocks monitor supply and signal levels without external ADCs for supervisory functions. The 172 I/O support wide parallel data paths to front-end converters, and the FG484 BGA's short ball vias aid signal integrity on high-speed buses. Distributor listings confirm 110592 fabric bits and 1.5V core operation on 130nm flash CMOS, a proven low-power process for portable instruments.
Recommended
Power Monitoring and Sequencing
Fusion's original design intent includes power management: the M1AFS600-1FG484K's configurable analog block monitors multiple voltage and temperature channels on-chip, and the fabric implements custom sequencing and brown-out logic with microsecond-scale response - faster than a software-only supervisor. With 600K gates and 172 I/O, one chip can both supervise rails and gate downstream enable signals, while the ARM Cortex-M1 logs events and communicates over UART/I2C/SPI. Flash-based instant-on operation means monitoring begins immediately at power-up, before an external MCU could boot. Design consideration: this FG484K ordering code contains lead, so RoHS-regulated power products should use the identical green M1AFS600-1FGG484K instead.
Recommended
Legacy System Repair and Sustainment
Because Microsemi Fusion devices have shipped since the mid-2000s, many defense, aerospace-adjacent, and industrial platforms still depend on them. The M1AFS600-1FG484K, and leaded-compatible alternatives such as AFS600-1FG484K, serve sustainment programs where the original design was qualified against leaded assembly and RoHS exemption applies. Drop-in same-footprint variants (M1AFS600-1FG484I for industrial temperature, M1AFS600-2FG484 for faster fabric) allow repair depots to adapt to available stock without PCB rework. Distributor channels including DigiKey, Mouser, LCSC, and Octopart-listed brokers currently show active inventory (as of 2026-09-02), which is essential for end-of-life-adjacent sourcing; verify date codes on broker stock.
Recommended
Communications and Interface Bridging
The M1AFS600-1FG484K works well as a protocol bridge: 172 I/O accommodates parallel legacy buses alongside serial interfaces implemented in fabric (UART, SPI, I2C, and higher-speed links within -1 speed-grade limits), while the ARM Cortex-M1 runs protocol stacks. Integrated clock generation and management circuitry provide the multiple synchronized domains typical of networking line cards and industrial gateways without external PLL chips, reducing jitter sources. Flash fabric retains the bridge configuration across power cycles, enabling fast bring-up in redundant systems. For designs pushing timing closure at -1, the pin-compatible M1AFS600-2FG484 offers faster fabric on the identical 484-ball footprint, making speed-grade upgrades a pure ordering-code change.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS600-1FG484K — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS600-1FGG484K | M1AFS600-1FG484I | M1AFS600-2FG484 | AFS600-1FG484K |
|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FG484) | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 600 K | 600 K | 600 K | 600 K | 600 K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | -1 |
| RoHS Compliance | Non-Compliant (contains lead) | Compliant (green) | [DATA_NEEDED] | [DATA_NEEDED] | Non-Compliant (K, leaded) |
| ARM Cortex-M1 Processor | Yes (M1 prefix) | Yes | Yes | Yes | Not designated (non-M1 Fusion) |
| Unit Price (qty 1, as of 2026-09-02) | $332.52 (LCSC) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | $791.79 (broker reference) |
Key Differentiators
- Integrated ARM Cortex-M1 processor (vs AFS600-1FG484K)
- Monolithic mixed-signal integration (vs M1AFS600-2FG484)
- Flash-based instant-on security (vs SRAM FPGAs (other vendors))
- Pin-identical RoHS upgrade path (vs M1AFS600-1FGG484K)
Design Notes
The FG484K ordering code is listed by distributors as containing lead (RoHS Non-Compliant). If your product ships into RoHS-regulated markets, order M1AFS600-1FGG484K instead - it is the identical die and 484-ball footprint with lead-free balls, so no PCB or firmware change is needed. Mixing leaded and lead-free BGA assemblies also affects reflow profile and long-term solder-joint reliability, so standardize on one metallurgy per build. Confirm compliance requirements at BOM creation, not at contract manufacture.
The 484-ball FBGA requires a controlled land pattern and solder-mask-defined or non-SMD pads per the Fusion family datasheet package section. Fan out with via-in-pad or dog-bone escape on 0.8 mm-class ball pitch, and verify your fabricator's minimum drill capability before routing the 172 user I/O. Because flash-based Fusion needs no external configuration PROM, reserve board area previously allocated for a config flash for decoupling instead. Follow the manufacturer datasheet ball map exactly - power, ground, JTAG, and clock balls are fixed and must not be repurposed.
The Fusion fabric operates from a 1.5 V core supply (per distributor specifications), with separate I/O bank supplies defined in the family datasheet. Estimated: total power depends on toggling rates and I/O loading, so use Microchip's Libero power calculator with your actual design rather than rule-of-thumb numbers, then size regulators with margin. Sequence supplies per the datasheet power-up requirements, and place bulk plus 0.1 uF ceramic decoupling at each supply ball group. Verify the operating temperature range of the K grade against your worst-case ambient before finalizing thermal design.
Compliance Information
Distributor listings (DigChip, DigiKey) state Contains Lead and RoHS Non-Compliant for the FG484K ordering code. Use M1AFS600-1FGG484K for RoHS-compliant applications. REACH, halogen-free, and conflict-minerals status not stated in provided data.
