ATSAM3N00AA-AUR - 48MHz Cortex-M3 16KB Flash MCU | Microchip
部品番号: ATSAM3N00AA-AUR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.08 | $3.08 |
| 10 | $2.79 | $27.90 |
| 100 | $2.45 | $245.00 |
| 500 | $1.9 | $950.00 |
| 1,000 | $1.61 | $1,610.00 |
ATSAM3N00AA-AUR 概要
A microcontroller (MCU) is a compact integrated circuit that combines a processor core, program memory, data memory, and peripherals on a single die, serving as the control brain of embedded systems. The SAM3N family sits within the broader hierarchy of ARM-based 32-bit microcontrollers, part of Microchip's SAM product line of flash MCUs that succeeded the Atmel SAM3 series.
Key features of the ATSAM3N00AA-AUR include the ARM Cortex-M3 RISC core with a 3-stage pipeline and nested vectored interrupt controller (NVIC), supply operation from 1.62 V to 3.6 V, and a rich peripheral set that includes USART, UART, TWI (I2C) and SPI serial interfaces, an 8-channel 10-bit ADC, PWM timers, and a real-time clock. Its low-power architecture provides sleep, wait, and backup operating modes for battery-sensitive designs.
Technically, the device integrates a power management controller that allows per-peripheral clock gating, reducing dynamic current consumption. The Flash memory supports in-system programming via JTAG or the serial UART/TWI boot loader, and an 8-level priority interrupt structure simplifies deterministic real-time firmware design.
Typical applications include industrial control nodes, consumer appliance interfaces, metering front-ends, and low-cost sensing systems where 16 KB of Flash and a 48-pin footprint provide the right balance of capability and cost.
When designing with this MCU, budget code size carefully: after the SAM3N ROM library footprint, roughly 14 KB of usable Flash remains, so consider pin-compatible SAM3N family members with larger memory if code growth is expected.
This page synthesizes distributor pricing, drop-in family alternatives, comparison data, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-19.
ドロップイン代替品: ATSAM3N00AA-AUR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM3N00AA-AUR （同一形状・フットプリント） — 相違点: Packaging, Operating Temperature, Connectivity, Flash Memory, Peripherals.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM3N00AA-AU
✅ ドロップイン✓ 在庫あり
$2.95 / 個
データシートを見る →ATSAM3N001AA-AUR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3N0AA-AUR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.38 / 個
データシートを見る →ATSAM3N1AA-AUR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3N2AA-AUR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3S4AA-AUR
✅ ドロップイン✓ 在庫あり
$5.42 / 個
データシートを見る →ATSAM3N00AA-AUR 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| 最大クロック周波数 | 48 MHz |
| Flash Memory Size | 16 KB (16K x 8) |
| SRAM Size | 4 KB |
| Operating Voltage Range | 1.62 V to 3.6 V |
| 動作温度 | -40C to +85C (TA) |
| パッケージ | 48-LQFP (7 x 7 mm) |
| ADC Resolution | 10 bit |
| Connectivity | I2C, SPI, UART/USART |
| 実装タイプ | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Series | SAM3N |
| Peripherals | DMA, PWM, WDT, RTC |
| Program Memory Type | FLASH |
ATSAM3N00AA-AUR 48-lqfp (7 x 7 mm) ピン配置ガイド
ATSAM3N00AA-AUR (48-lqfp (7 x 7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM3N00AA-AUR.
詳細は データシート をご参照ください。
主な用途
ATSAM3N00AA-AUR の用途: 6 件s: Industrial Control Nodes, Utility Metering Front-Ends, Consumer Appliance Interfaces, Battery-Powered Sensor Nodes, Building Automation Sensors, Test and Measurement Accessories.
Industrial Control Nodes
The ATSAM3N00AA-AUR fits industrial control nodes that need deterministic 32-bit control logic with modest code density. Its -40C to +85C industrial rating, 1.62 V to 3.6 V supply tolerance, and watchdog timer support deployment on factory floors with unstable power. The USART handles Modbus RTU links to PLCs, while the 10-bit ADC acquires sensor feedback and PWM outputs drive actuators or fans. Per-peripheral clock gating in the power management controller cuts average current in duty-cycled nodes. With 16 KB Flash, keep protocol stacks lean; if firmware grows, the pin-compatible ATSAM3N1AA-AUR (64 KB Flash) swaps in without a PCB change, protecting the board investment across product generations.
おすすめ
Utility Metering Front-Ends
In electricity, water, and gas metering front-ends, the ATSAM3N00AA-AUR provides the acquisition and communication core in a compact 7 x 7 mm LQFP footprint that fits crowded meter PCBs. The 8-channel 10-bit ADC digitizes analog metrology signals, the RTC with backup mode maintains timestamps across power loss, and the TWI interface reads external energy-measurement front ends. The wide 1.62 V to 3.6 V input range rides through battery-backed supply sags, and wait/backup modes keep standby drain low between meter-reading events. Firmware including the metrology state machine and DLMS-style communication framing must fit in 16 KB Flash - designs approaching that limit should select the pin-compatible 32 KB ATSAM3N0AA-AUR instead.
おすすめ
Consumer Appliance Interfaces
Consumer appliance control panels - ovens, air conditioners, washing machines - benefit from the ATSAM3N00AA-AUR's balance of performance and cost. The 48 MHz Cortex-M3 core with 3-stage pipeline runs the UI state machine and touch/sensor polling with headroom, PWM channels drive displays, buzzers, and triac firing circuits, and the 10-bit ADC reads NTC temperature sensors and user potentiometers. Industrial temperature rating covers unheated garage-laundry installations, and the green RoHS LQFP suits consumer compliance requirements. At roughly $1.61 per unit at 1000-piece volume as of 2026-09-19, the BOM cost stays competitive against 8-bit alternatives while providing 32-bit headroom for feature updates via the UART boot loader.
おすすめ
Battery-Powered Sensor Nodes
For battery-operated sensing and IoT endpoints, the ATSAM3N00AA-AUR's SAM3N power architecture is the key fit: sleep, wait, and backup modes combined with per-peripheral clock gating let the MCU sleep between measurement intervals and wake on RTC or external interrupt. The 1.62 V floor permits direct operation from two alkaline cells or a single Li-SOCl2 cell through a low-current LDO. SPI and TWI interfaces read MEMS sensors, and 4 KB SRAM buffers modest sample windows. Design duty-cycle firmware within 16 KB Flash; sampling-heavy applications should verify RAM margin, since 4 KB is the family-wide SRAM allocation and cannot be expanded without changing silicon families.
おすすめ
Building Automation Sensors
Building automation sensor and actuator endpoints - occupancy detectors, damper controllers, HVAC zone modules - use the ATSAM3N00AA-AUR as a cost-efficient RS-485 or TWI node. Two USART/UART channels support multi-drop field bus protocols, the ADC digitizes light, temperature, or potentiometer feedback, and PWM outputs position actuators smoothly. The -40C to +85C rating survives rooftop and unconditioned mechanical rooms, and the 7 x 7 mm LQFP fits slim wall-mounted enclosures. Over-the-air style field updates are handled through the UART ROM boot loader with SAM-BA, eliminating socket programming in production. Keep the field protocol stack compact within 16 KB, or select the pin-compatible 64 KB ATSAM3N1AA-AUR for richer BACnet-style implementations.
おすすめ
Test and Measurement Accessories
Low-cost test and measurement accessories such as data loggers, handheld adapters, and sensor dongles leverage the ATSAM3N00AA-AUR's USB-free peripheral set and deterministic 48 MHz core. The SPI interface streams ADC samples, the DMA offloads data movement to free CPU cycles for scaling and filtering, and the UART boot loader plus JTAG port supports both production flashing and in-lab debugging with Atmel-ICE under Microchip Studio. The industrial temperature range and 1.62 V to 3.6 V operation allow battery or USB-host-powered designs. Instrument firmware with a simple command parser fits comfortably in 16 KB Flash; loggers needing FAT file-system code should step up to the pin-compatible SAM3N parts with 32 KB or 64 KB Flash.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM3N00AA-AUR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM3N00AA-AU | ATSAM3N001AA-AUR | ATSAM3N0AA-AUR | ATSAM3N1AA-AUR | ATSAM3S4AA-AUR |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz | ARM Cortex-M3 / 48 MHz |
| Flash Memory | 16 KB | 16 KB | 8 KB | 32 KB | 64 KB | 256 KB |
| USB Controller | No | No | No | No | No | Yes (USB device) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主な差別化要因
- Entry-price 32-bit option in the SAM3N family （vs ATSAM3N1AA-AUR)
- Identical-function lower-memory drop-in （vs ATSAM3N0AA-AUR)
- No-USB simplicity for non-USB designs （vs ATSAM3S4AA-AUR)
- Tape-and-reel production packing （vs ATSAM3N00AA-AU)
設計ノート
Design the supply rail for the 1.62 V to 3.6 V operating window with margin below the 3.6 V absolute maximum. Use a 3.3 V LDO with at least 100 nF ceramic decoupling at each VDDIO/VDDCORE pin pair plus a bulk 10 uF capacitor. Estimated: a typical SAM3N running at 48 MHz with most peripherals gated draws on the order of tens of milliamps - size the regulator for the measured active current of your firmware, not the datasheet typical figure, and verify wake-up inrush from backup mode does not droop the rail below 1.62 V.
Budget Flash conservatively. 16 KB is the entry density of the SAM3N family; a printf-style library, RTOS, or full protocol stack can exhaust it quickly. Compile early with -Os and check the map file; leave at least 2 KB of margin for field updates. If your build exceeds roughly 13-14 KB, migrate the BOM to the pin-compatible ATSAM3N0AA-AUR (32 KB) - identical footprint means no PCB change, only a reel-code swap in procurement.
Keep the 48-LQFP footprint per the Microchip land-pattern recommendation in the SAM3N datasheet, with 0.5 mm pitch escapes and no under-package vias in the center area. Route the crystal (XIN/XOUT) with short traces, guard rings to ground, and nearby 100 nF/short ground return to minimize jitter on the 48 MHz clock. Provide a 10-pin SWD or JTAG header (SWDIO/SWCLK, NRST, GND, VTG) even on production boards for in-field reprogramming via SAM-BA or Atmel-ICE.
Thermal design is generally non-critical for this MCU: Estimated dissipation at 48 MHz active operation is well under 150 mW, so the 48-LQFP (7 x 7 mm) with normal 2-layer copper pour stays far below the +85C ambient rating. Only in sealed enclosures at elevated ambient near +70C to +85C should you verify junction temperature with the theta-JA figure from the datasheet thermal table and consider pouring extra copper under the package.
コンプライアンス情報
Mouser lists the part as 'LQFP, GREEN, IND TEMP, MRL A', indicating Microchip's green (halogen concerns managed) RoHS packaging line. Specific REACH and conflict-minerals statements were not present in the provided data.
