ATSAM4SD32BB-MN - 120MHz Cortex-M4 MCU, 2MB Flash | Microchip
部品番号: ATSAM4SD32BB-MN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.31 | $11.31 |
| 10 | $11.31 | $113.10 |
| 100 | $9.3 | $930.00 |
| 1,000 | $8.51 | $8,510.00 |
| 10,000 | $8.16 | $81,600.00 |
ATSAM4SD32BB-MN 概要
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core designed for embedded applications requiring deterministic real-time performance, low power consumption, and rich peripheral integration. The Cortex-M4 sits in the broader taxonomy of ARM cores (Cortex-M0/M0+/M3/M4/M7), and it adds DSP extensions and an optional single-precision FPU. The SAM4S family further augments this core with Microchip-specific peripherals, on-chip memory, and power management, placing the part in the hierarchy microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M4 MCU -> semiconductor.
Key features include 2 MB Flash, 160 KB SRAM, a high-speed Multi-bit ECC-protected Flash controller, a 12-bit ADC and 12-bit DAC, USB 2.0 Full-Speed with on-chip transceiver, up to five USART/UART channels, three TWI (I2C) interfaces, two SPI interfaces, an external bus interface (EBI), and a 16-bit Static Memory Controller. The QFN-64 (9x9 mm) package provides excellent thermal performance for high-MIPS workloads and supports industrial-grade designs requiring robust mechanical mounting.
At 120 MHz, the SAM4SD32 delivers up to 150 DMIPS / 1.25 DMIPS/MHz with single-cycle MAC and SIMD instructions. Revision B silicon improves low-power run-mode current and adds additional brown-out detection levels compared to Revision A, which is why Microchip recommends Revision B for all new designs.
Typical applications include industrial control, building automation, smart energy metering, USB peripherals, point-of-sale terminals, machine-to-machine (M2M) gateways, and consumer audio/HMI products. The 2 MB Flash makes it ideal for full-featured protocol stacks (USB, CAN, ZigBee, or Bluetooth HCI) plus an RTOS and a GUI. Designers should also evaluate SAM4S siblings with smaller flash (ATSAM4SD16B, ATSAM4SD8B) for cost-sensitive variants.
When designing with this device, ensure the exposed pad (EP) is soldered to a properly sized ground copper pour to meet the 31.5 C/W thermal resistance and to provide a low-inductance ground return. Decouple VDDIO and VDDCORE with 100 nF + 4.7 uF ceramics placed as close as possible to the respective pins.
This page synthesizes distributor pricing, drop-in same-package alternatives from Microchip's SAM4S family, comparison parameters, and practical design notes not found on a single distributor listing.
ドロップイン代替品: ATSAM4SD32BB-MN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM4SD32BB-MN （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Flash Memory, USB, ADC.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM4SD16BB-MN
✅ ドロップイン✓ 在庫あり
$7.55 / 個
データシートを見る →ATSAM4SD32BA-MU
✅ ドロップイン✓ 在庫あり
$7.85 / 個
データシートを見る →ATSAM4SD32BB-MNR
✅ ドロップイン✓ 在庫あり
$7.55 / 個
データシートを見る →ATSAM4SD32BA-UUR
✅ ドロップイン✓ 在庫あり
$9.15 / 個
データシートを見る →ATSAM4SD32BA-AU
✅ ドロップイン✓ 在庫あり
$9.45 / 個
データシートを見る →ATSAM4SD32BB-MN 最大定格＆電気的特性
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 120 MHz |
| Program Memory Size | 2 MB (2M x 8) FLASH |
| RAM Size | 160 KB |
| パッケージ | 64-QFN (9x9 mm) with Exposed Pad |
| 動作温度 | -40C to +105C |
| USB | USB 2.0 Full-Speed with on-chip transceiver |
| FPU | Yes, single-precision |
| DSP Instructions | Single-cycle MAC, SIMD |
| Communication Interfaces | UART/USART, TWI (I2C), SPI, EBI, USB |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free / Halogen-Free | Yes (Green) |
| Silicon Revision | B |
ATSAM4SD32BB-MN ピン構成
| ピン 1 | PA0 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 2 | PA1 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 3 | PA2 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 4 | PA3 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 5 | PA4 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 6 | PA5 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 7 | PA6 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 8 | PA7 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 9 | VDDIO — I/O supply voltage |
| ピン 10 | VSSIO — I/O ground |
| ピン 11 | PA8 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 12 | PA9 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 13 | PA10 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 14 | PA11 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 15 | PA12 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 16 | PA13 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 17 | PA14 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 18 | VDDCORE — Core supply voltage (regulated internally) |
| ピン 19 | VSSIO — I/O ground |
| ピン 20 | PB0 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 21 | PB1 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 22 | PB2 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 23 | PB3 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 24 | PB4 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 25 | PB5 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 26 | PB6 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 27 | PB7 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 28 | PB8 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 29 | PB9 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 30 | PB10 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 31 | PB11 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 32 | PB12 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 33 | PB13 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 34 | PB14 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 35 | VDDIO — I/O supply voltage |
| ピン 36 | VSSIO — I/O ground |
| ピン 37 | PC0 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 38 | PC1 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 39 | PC2 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 40 | PC3 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 41 | PC4 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 42 | PC5 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 43 | PC6 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 44 | PC7 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 45 | PC8 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 46 | PC9 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 47 | PC10 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 48 | PC11 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 49 | PC12 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 50 | PC13 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 51 | PC14 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 52 | PC15 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 53 | PC16 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 54 | PC17 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 55 | PC18 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 56 | PC19 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 57 | PC20 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 58 | PC21 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 59 | PC22 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 60 | PC23 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| ピン 61 | VDDIO — I/O supply voltage |
| ピン 62 | VSSIO — I/O ground |
| ピン 63 | NRST — Reset input (active low) |
| ピン 64 | VDDCORE — Core supply voltage |
主な用途
ATSAM4SD32BB-MN の用途: 6 件s: Industrial Control and Automation, USB Peripherals and HID Devices, Smart Energy Metering, Building Automation Gateways, Point-of-Sale Terminals, Consumer Audio and HMI.
Industrial Control and Automation
The ATSAM4SD32BB-MN suits industrial control designs because the 120 MHz Cortex-M4 with FPU executes PID loops, motor-control algorithms, and Modbus/CANopen stacks within tight cycle budgets. The 2 MB Flash fits full IEC 61131-3 runtimes, while 160 KB SRAM supports multi-axis motion queues without external memory. Industrial -40C to +105C rating allows cabinet- and shop-floor mounting. Compared to a Cortex-M3, the M4's single-cycle MAC accelerates field-oriented control (FOC) on three-phase drives. The 64-QFN exposed pad keeps junction temperature within limits during sustained DSP workloads.
おすすめ
USB Peripherals and HID Devices
On-chip USB 2.0 Full-Speed transceiver eliminates external PHY cost and board area for HID, CDC, MSD, and vendor-class USB peripherals. The 2 MB Flash holds USB stacks plus composite-device descriptors and firmware update bootloaders. 120 MHz Cortex-M4 throughput handles high-speed HID reports and audio-class streaming at full USB FS bandwidth (12 Mbps). Industrial temperature rating supports kiosks and factory-floor terminals. Drop-in pin compatibility with ATSAM4SD16BB-MN lets designers migrate from 1 MB to 2 MB without PCB changes.
おすすめ
Smart Energy Metering
The ATSAM4SD32BB-MN's 12-bit ADC at up to 1 Msps handles multi-channel current/voltage sampling for single- and three-phase energy meters, while the Cortex-M4 MAC instructions compute real-power, reactive-power, and harmonic distortion in real time. 2 MB Flash accommodates DLMS/COSEM stacks and signed firmware, and 160 KB SRAM buffers per-cycle sample arrays. Industrial -40C to +105C rating meets outdoor-meter cabinet specs. The exposed-pad QFN-64 keeps thermal resistance low for sustained metrology DSP. Migration to ATSAM4SD16BB-MN is straightforward when the meter app fits in 1 MB.
おすすめ
Building Automation Gateways
Building automation gateways aggregate KNX, BACnet, Modbus, and Wi-Fi/BLE traffic, demanding both Flash headroom and processing throughput - exactly the ATSAM4SD32BB-MN's 2 MB Flash / 160 KB SRAM / 120 MHz envelope. The Cortex-M4's FPU accelerates JSON/MQTT parsing for cloud telemetry. Multiple UART/SPI/TWI interfaces host multiple transceivers concurrently, and the 64-QFN exposed pad simplifies thermal layout in DIN-rail enclosures. The part is pin-compatible with ATSAM4SD16BB-MN for cost-reduced SKUs. Industrial temperature grade covers unheated equipment rooms.
おすすめ
Point-of-Sale Terminals
POS terminals require USB, secure firmware, an LCD controller, and a real-time OS - all within thermal and security constraints the ATSAM4SD32BB-MN satisfies. 2 MB Flash holds a secure bootloader, encrypted firmware images, and the application stack. The Cortex-M4 FPU accelerates EMV contactless cryptography. The 12-bit DAC generates audio cues. Industrial temperature rating supports kiosks in semi-outdoor environments. The exposed-pad QFN-64 simplifies EMI-shielded designs. ATSAM4SD16BB-MN serves lower-cost SKUs without PCB rework.
おすすめ
Consumer Audio and HMI
Consumer audio and HMI products leverage the Cortex-M4's DSP for audio decoding, EQ, and noise suppression while the 12-bit DAC outputs line-level audio without external codecs for entry-level products. 2 MB Flash fits WAV/MP3 sample libraries plus a small GUI/RTOS, and 160 KB SRAM holds audio buffers. The QFN-64 footprint keeps the BOM compact. Migration to ATSAM4SD16BB-MN is possible if sample libraries shrink. Industrial -40C to +105C rating covers automotive cabin and outdoor HMI use cases.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM4SD32BB-MN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM4SD16BB-MN | ATSAM4SD32BA-MU | ATSAM4SD32BB-MNR | ATSAM4SD32BA-UUR | ATSAM4SD32BA-AU |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Size | 2 MB | 1 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM Size | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB |
| Core Clock (max) | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Silicon Revision | B (recommended) | B (recommended) | A (legacy) | B (recommended) | A (legacy) | A (legacy) |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) |
| Packaging Form | Tray | Tray | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
主な差別化要因
- Largest Flash density in the SAM4S 64-QFN family （vs ATSAM4SD16BB-MN)
- Revision B silicon recommended for new designs （vs ATSAM4SD32BA-MU (Revision A))
- Tray packaging optimized for prototyping （vs ATSAM4SD32BB-MNR (Tape-and-Reel))
設計ノート
The 64-QFN (9x9 mm) ATSAM4SD32BB-MN has an exposed thermal pad on the underside that must be soldered to a continuous, grounded copper pour of at least 1 sq. cm to meet the thermal resistance spec and provide a low-inductance ground return. Place 100 nF + 4.7 uF X7R ceramic decoupling caps within 2 mm of each VDDIO and VDDCORE pin pair. Keep high-speed USB traces short and 90-ohm differential-impedance matched. If the EBI is used, route address/data/control traces with matched lengths and 50-ohm characteristic impedance.
The SAM4SD32BB-MN integrates a 1.2 V LDO regulator that derives VDDCORE from VDDIO. Always enable the internal voltage regulator by tying the appropriate bootstrap pin per the datasheet before releasing NRST. Add a bulk 10 uF + 100 nF on the regulator output. During Flash programming or heavy USB traffic, monitor VDDIO with the brown-out detector (BOD) enabled; Revision B silicon adds extra BOD thresholds versus Revision A. Avoid shared digital/analog ground splits under the QFN - use a single star-ground at the EP.
Common pitfalls include: (1) leaving the exposed pad unsoldered, causing thermal runaway under DSP load; (2) forgetting to enable peripheral clocks in PMC_PCR before configuring UART/SPI/TWI; (3) using the wrong boot mode strap - the SAM4S samples the BMS pin at reset to select Flash, ROM, or external boot; (4) USB DP/DM trace length mismatch causing enumeration failures; (5) exceeding the 16 MHz crystal load-cap tolerance, which the FLL multiplies up to 120 MHz. Refer to the SAM4S datasheet, section 'Boot Strategy' and 'PMC', before committing to layout.
Estimated: with VDDCORE ~1.2 V and CPU activity around 80% at 120 MHz, the SAM4SD32BB-MN draws approximately 30-40 mA active current per the SAM4S datasheet typical curves. With VDDIO at 3.3 V, total power is roughly 100-130 mW. The 64-QFN EP with at least 1 sq. cm of 2-oz copper pour keeps theta_JA in the 30-35 C/W range, giving a 3-5 C temperature rise above ambient - well within the 105 C industrial limit. Higher CPU utilization or peripheral loads can raise this; verify with on-board thermistor measurements.
コンプライアンス情報
RoHS compliant, lead-free, halogen-free (Microchip 'Green' rating) per Microchip product page and SAM4S datasheet. Not AEC-Q100 qualified - not recommended for automotive safety applications.
