ATSAM4SD32CB-AN - 2MB Flash Cortex-M4 MCU 100-LQFP | Microchip
部品番号: ATSAM4SD32CB-AN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.55 | $13.55 |
| 10 | $12.2 | $122.00 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.6 | $4,800.00 |
| 1,000 | $8.45 | $8,450.00 |
ATSAM4SD32CB-AN 概要
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core designed by Arm that includes a single-precision IEEE 754 floating-point unit (FPU), a Memory Protection Unit (MPU), and DSP extensions. Within Microchip's broader hierarchy it sits under the SAM family -> SAM4S sub-family -> ARM Cortex-M4 series, occupying a position aimed at high-performance industrial and consumer embedded designs where deterministic control and connectivity coexist.
Key features of the ATSAM4SD32CB-AN include dual-bank Flash for in-application reprogramming, a unique 128-bit serial number, a true random number generator (TRNG), and Cryptography accelerators (AES, TDES). The part is rated for the extended industrial temperature range up to +105C, and uses a 1.2V core supply. It is pin-compatible with the rest of the SAM4S family (SAM4S2/4/8/16/32) in the same 100-LQFP outline, allowing design scalability.
Architecturally, the SAM4SD32 pairs the Cortex-M4 core with a multi-layer bus matrix that gives the CPU, DMAC, and peripherals simultaneous access to Flash and SRAM, eliminating contention. The dual-bank Flash and the peripheral event system enable deterministic interrupt latency and zero-latency interrupt responses, which are critical for motor control, power conversion, and real-time communications.
Typical applications include industrial control and HMI, USB peripherals and HID devices, smart energy metering, point-of-sale terminals, barcode scanners, and machine-to-machine (M2M) gateways. The combination of USB, Ethernet, and Cortex-M4 DSP capability also makes it attractive for audio processing nodes and low-cost PLCs. When designing with this device, ensure that the 1.2V core rail is decoupled close to the VDD pins and that the external reset circuit meets the datasheet's minimum reset pulse width. The flash dual-bank layout also requires that bootloader and application boundaries are planned early.
This page synthesizes distributor pricing, pin-to-pin compatible SAM4S family alternatives, and practical design notes not consolidated on the manufacturer product page.
ドロップイン代替品: ATSAM4SD32CB-AN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM4SD32CB-AN （同一形状・フットプリント） — 相違点: Package, ADC, RoHS Status, Operating Temperature, SRAM.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM4SD32CA-AN
✅ ドロップイン✓ 在庫あり
$9.45 / 個
データシートを見る →ATSAM4SD32CB-ANR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAM4SD16CB-ANR
✅ ドロップイン✓ 在庫あり
$7.3 / 個
データシートを見る →ATSAM4S16CB-AN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAM4S8CB-AN
✅ ドロップイン✓ 在庫あり
$4.2 / 個
データシートを見る →ATSAM4SA16CB-AN
✅ ドロップイン✓ 在庫あり
$5.95 / 個
データシートを見る →ATSAM4SD32CB-AN 最大定格＆電気的特性
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 2 MB (2048 Kbytes, dual-bank) |
| SRAM | 160 KB |
| Supply Voltage (Core) | 1.2 V |
| Supply Voltage (I/O) | 3.3 V |
| パッケージ | 100-LQFP (14x14 mm) |
| 動作温度 | -40C to +105C (Extended) |
| USB | Full-Speed USB Device with embedded transceiver |
| Ethernet | 10/100 GMAC (Ethernet MAC) |
| ADC | 10-bit, up to 24 channels |
| PWM Channels | 16-bit PWM |
| Communication Interfaces | UART, USART, SPI, TWI (I2C), CAN (optional via variant) |
| Cryptography | AES, TDES accelerators; True Random Number Generator (TRNG) |
| RoHS ステータス | ROHS3 Compliant |
| 実装タイプ | Surface Mount (LQFP) |
ATSAM4SD32CB-AN 100-lqfp (14x14 mm) ピン配置ガイド
ATSAM4SD32CB-AN (100-lqfp (14x14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM4SD32CB-AN.
詳細は データシート をご参照ください。
主な用途
ATSAM4SD32CB-AN の用途: 6 件s: Industrial Control & HMI, USB Peripherals and HID Devices, Smart Energy Metering, Point-of-Sale (POS) Terminals, Machine-to-Machine (M2M) Gateways, Audio Processing Nodes.
Industrial Control & HMI
The ATSAM4SD32CB-AN's 120 MHz Cortex-M4 with FPU and 2 MB of dual-bank Flash make it well-suited to industrial controllers and human-machine interfaces (HMIs). Its operating temperature range of -40C to +105C matches the requirements of factory-floor enclosures, and the integrated PWM timers, ADC, and event system drive motor-control loops and graphical displays with deterministic latency. In an HMI the 2 MB Flash holds a TFT GUI plus bootloader, while 160 KB SRAM buffers the frame buffer and protocol stacks.
おすすめ
USB Peripherals and HID Devices
With its full-speed USB Device port and embedded transceiver, the ATSAM4SD32CB-AN targets USB peripherals such as HID controllers, custom instrumentation, and USB-to-UART bridges. The dual-bank Flash enables safe firmware upgrades over USB without bricking the device, while the Cortex-M4 FPU handles signal conditioning or audio streaming simultaneously. An external 5V-to-3.3V LDO and proper VBUS handling per the SAM4S datasheet are the key implementation considerations.
おすすめ
Smart Energy Metering
The ATSAM4SD32CB-AN suits single-phase and three-phase smart energy meters: 160 KB SRAM holds metering firmware and metrology buffers, while the 16-bit PWM and event system drive calibration routines and zero-crossing detection. The TRNG and AES accelerators enable secure communications for AMI (Advanced Metering Infrastructure), and the extended temperature range ensures accuracy in outdoor cabinets. Designers should reference the Atmel-11100 datasheet for ADC calibration to meet IEC-style metrology tolerances.
おすすめ
Point-of-Sale (POS) Terminals
POS terminals benefit from the ATSAM4SD32CB-AN's combination of USB Device, GMAC, and 2 MB Flash. The Cortex-M4 FPU accelerates encryption for PCI-PTS payment flows, and the dual-bank Flash supports secure firmware updates without service interruption. Up to five USARTs and three SPIs connect to mag-stripe readers, NFC modules, and thermal printers, while the Ethernet MAC provides IP-based reporting. The trade-off versus higher-end Cortex-M7 parts is modest CPU throughput but significantly lower BOM cost.
おすすめ
Machine-to-Machine (M2M) Gateways
The ATSAM4SD32CB-AN's GMAC plus USB plus serial interfaces make it a low-power M2M gateway controller. The Cortex-M4 can run MQTT or HTTP clients directly from Flash, while hardware AES/TDES offloads secure transport handshakes. Dual-bank firmware allows OTA updates critical for remote deployments. Compared to Cortex-M7 gateways, the SAM4SD32 sacrifices raw throughput but gains power efficiency and a simpler PCB layout thanks to its integrated Ethernet MAC.
おすすめ
Audio Processing Nodes
The Cortex-M4 FPU in the ATSAM4SD32CB-AN executes single-precision DSP routines, supporting audio preprocessing, equalization, and basic codec algorithms. The 160 KB SRAM is sufficient for small audio buffers, while 2 MB Flash stores waveform tables and configuration presets. Combined with the I2S-ready peripherals and DMA, this part is used in networked speakers, intercom panels, and voice prompt modules. A hardware floating-point engine typically delivers 3-5x performance gains over fixed-point cores at the same clock.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM4SD32CB-AN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM4SD32CA-AN | ATSAM4SD32CB-ANR | ATSAM4SD16CB-ANR | ATSAM4S16CB-AN | ATSAM4S8CB-AN | ATSAM4SA16CB-AN |
|---|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz |
| Flash Memory | 2 MB (dual-bank) | 2 MB (dual-bank) | 2 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (single-bank) | 512 KB (single-bank) | 1 MB (single-bank) |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB | 160 KB |
| Operating Temperature | -40C to +105C (Extended) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| USB Device | Full-Speed (embedded transceiver) | Full-Speed (embedded transceiver) | Full-Speed (embedded transceiver) | Full-Speed (embedded transceiver) | Full-Speed (embedded transceiver) | Full-Speed (embedded transceiver) | Full-Speed (embedded transceiver) |
| Ethernet MAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC | 10/100 GMAC |
主な差別化要因
- Dual-bank Flash for in-application firmware updates （vs ATSAM4S16CB-AN)
- Latest errata-revision silicon (Revision B) （vs ATSAM4SD32CA-AN)
- Extended temperature grade (+105C) （vs ATSAM4S8CB-AN (commercial variants))
設計ノート
Decouple the 1.2V core rail and 3.3V I/O rail with separate bulk and high-frequency capacitors placed within 5 mm of the respective VDD pins. Per the Atmel-11100 SAM4S datasheet, the recommended 1.2V decoupling network is one 4.7 uF ceramic plus one 100 nF ceramic per VDD pin pair; failing to do this can produce brownouts during CPU load steps. A linear LDO or switching regulator with at least 200 mA headroom is recommended.
At 120 MHz and full peripheral utilization, the ATSAM4SD32CB-AN can dissipate around 200-250 mW. The 100-LQFP package has theta_JA of approximately 35-40 C/W on a standard JEDEC 4-layer board, so junction temperature rise above ambient stays under 10 C. For +105C ambient industrial use, ensure copper pour on VDD/GND pads and at least one inner ground plane to keep die temperature below +125C.
Route the USB DP/DM traces as a 90-ohm differential pair per the SAM4S datasheet, and place the series source-matching resistors within 2 mm of the IC. The GMAC RMII/REFI clock and data lines should be routed with controlled impedance and length-matched; do not run them parallel to switching traces. A continuous ground plane under the LQFP improves signal integrity and EMI.
Do not exceed the 3.3V I/O absolute maximum. Always run the bootloader with the BSCR (Boot Select) register configured to match the actual boot media (Flash bank 0, bank 1, or SAM-BA bootloader). Firmware that assumes bank 0 boot will fail to start when the dual-bank swap is enabled. The 32.768 kHz crystal selection affects RTC accuracy: a 12 pF load crystal requires corresponding crystal loading capacitors.
コンプライアンス情報
ROHS3 Compliant per Heisener and Microchip USA product listings. Not AEC-Q100 qualified (industrial MCU, not automotive grade).
