ATSAME53J19A-MFT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
部品番号: ATSAME53J19A-MFT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.95 | $9.95 |
| 10 | $9.2 | $92.00 |
| 100 | $7.95 | $795.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.45 | $6,450.00 |
ATSAME53J19A-MFT 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals into one package. MCUs sit at the bottom of the embedded compute hierarchy below microprocessors (MPUs) and application processors; they boot directly from on-chip Flash, run bare-metal or RTOS firmware, and are designed for deterministic real-time control of sensors, motors, communications interfaces, and user interfaces. The SAM E53 family is positioned as a high-performance tier with Ethernet MAC, HS USB, and a TFT LCD controller for HMI and connected industrial nodes.
Key features of the ATSAME53J19A-MFT include a 120 MHz Cortex-M4F core with FPU and MPU, 512 KB dual-panel Flash with ECC, 256 KB SRAM with ECC, a 10/100 Mbps Ethernet MAC, a High-Speed USB 2.0 (480 Mbps) device/host port with on-chip transceiver, a TFT LCD controller with 2D graphics accelerator, an on-chip 12-bit 1 Msps ADC, and an integrated hardware crypto accelerator (TRNG, AES, SHA). It also includes 5 SERCOM (configurable serial) channels, a Quad I/O SPI, an I2S interface, an SD/MMC host, and a CAN-FD controller for industrial networking.
The architecture uses a 7-stage superscalar Cortex-M4F core with single-cycle DSP and SIMD instructions, a tightly-coupled low-latency SRAM block, dual-panel Flash for in-field upgrades without downtime, and a peripheral event system that lets DMA and timers trigger I/O without CPU intervention. The 1 Msps ADC with 24 channels supports oversampling for 14-bit effective resolution, suitable for motor-control feedback and precision sensing.
Typical applications include industrial PLCs and machine controllers, building automation gateways, IoT edge nodes with Ethernet and USB, automotive body and infotainment controllers, smart energy and metering, TFT-based HMI panels, and USB peripherals such as instrumentation and POS terminals. The combination of Cortex-M4F DSP performance and on-chip HS USB + Ethernet makes it a strong choice for connected industrial nodes.
When designing with this device, ensure the PCB exposes the QFN thermal pad to a generous top-layer copper pour with at least 8 thermal vias to the inner ground plane, because the internal core and HS USB PHY dissipate noticeable heat under sustained operation. Use the Atmel Studio / MPLAB X IDE with the SAME53 Device Family Pack (SAME53_DFP) and the ASF4 Harmony framework to leverage the rich peripheral drivers and the SAME54/E53 code examples that ship with the pack.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Pricing and stock reflect real-time distributor data from DigiKey, Mouser, Octopart, and others.
ドロップイン代替品: ATSAME53J19A-MFT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAME53J19A-MFT （同一形状・フットプリント） — 相違点: ADC, Package, USB, Core Architecture, SRAM.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAME53J19A-MFE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME53J19A-AF
✅ ドロップイン✓ 在庫あり
$5.9 / 個
データシートを見る →ATSAME53J20A-MFT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME53J18A-MFT
✅ ドロップイン✓ 在庫あり
$7.45 / 個
データシートを見る →ATSAME51J19A-MFT
✅ ドロップイン✓ 在庫あり
$5.78 / 個
データシートを見る →ATSAME53J19A-MFT 最大定格＆電気的特性
| Core Architecture | ARM Cortex-M4F |
| 最大クロック周波数 | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) dual-panel with ECC |
| SRAM | 256 KB with ECC |
| Operating Voltage | 3.3 V typical (1.62 V to 3.6 V core/IO supply range) |
| 動作温度 | -40C to +125C (extended industrial) |
| パッケージ | 64-QFN (9x9 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| FPU | Single-precision IEEE 754 |
| MPU | Yes (Memory Protection Unit) |
| DSP Instructions | Yes (single-cycle MAC, SIMD) |
| Ethernet MAC | 10/100 Mbps (RMII/MII) |
| USB | USB 2.0 High-Speed (480 Mbps) Device/Host with on-chip PHY |
| ADC | 12-bit, up to 1 Msps, up to 24 channels |
| Crypto Accelerator | AES, SHA, TRNG hardware acceleration |
| TFT LCD Controller | Yes, with 2D graphics accelerator |
| CAN-FD | Yes |
| SERCOM Channels | 5 (each configurable as USART/SPI/TWI) |
| SPI | Quad I/O SPI / QSPI supported |
| ピン数 | 64 |
| Packaging | Tape & Reel (suffix -MFT) |
| RoHS ステータス | Compliant |
ATSAME53J19A-MFT ピン構成
| ピン 1 | PA00 — GPIO, XIN1 crystal input |
| ピン 2 | PA01 — GPIO, XOUT1 crystal output |
| ピン 3 | PA02 — GPIO, ADC AIN[0] |
| ピン 4 | PA03 — GPIO, ADC AIN[1] |
| ピン 5 | VDDIO — IO supply voltage (3.3 V typical) |
| ピン 6 | GND — Ground |
| ピン 7 | PA04 — GPIO, ADC AIN[2] |
| ピン 8 | PA05 — GPIO, ADC AIN[3] |
| ピン 9 | PA06 — GPIO, ADC AIN[4] |
| ピン 10 | PA07 — GPIO, ADC AIN[5] |
| ピン 11 | PA08 — GPIO, I2S MCK |
| ピン 12 | PA09 — GPIO, SERCOM1 PAD[1] |
| ピン 13 | PA10 — GPIO, SERCOM1 PAD[2] |
| ピン 14 | PA11 — GPIO, SERCOM1 PAD[3] |
| ピン 15 | VDDIO — IO supply voltage |
| ピン 16 | GND — Ground |
| ピン 17 | PB00 — GPIO, USB DP |
| ピン 18 | PB01 — GPIO, USB DM |
| ピン 19 | PB02 — GPIO, ETH TXD0 |
| ピン 20 | PB03 — GPIO, ETH TXD1 |
| ピン 21 | PB04 — GPIO, ETH TXEN |
| ピン 22 | PB05 — GPIO, ETH MDC |
| ピン 23 | PB06 — GPIO, ETH MDIO |
| ピン 24 | PB07 — GPIO, ETH RXD0 |
| ピン 25 | PB08 — GPIO, ETH RXD1 |
| ピン 26 | PB09 — GPIO, ETH CRS_DV / RX_DV |
| ピン 27 | PB10 — GPIO, ETH RXER |
| ピン 28 | PB11 — GPIO, ETH TXCK / REF_CLK |
| ピン 29 | VDDIO — IO supply voltage |
| ピン 30 | GND — Ground |
| ピン 31 | PB12 — GPIO, CAN-FD TX |
| ピン 32 | PB13 — GPIO, CAN-FD RX |
| ピン 33 | PB14 — GPIO, SERCOM2 PAD[0] |
| ピン 34 | PB15 — GPIO, SERCOM2 PAD[1] |
| ピン 35 | PC00 — GPIO, SERCOM2 PAD[2] |
| ピン 36 | PC01 — GPIO, SERCOM2 PAD[3] |
| ピン 37 | PC02 — GPIO, SERCOM3 PAD[0] |
| ピン 38 | PC03 — GPIO, SERCOM3 PAD[1] |
| ピン 39 | PC04 — GPIO, SERCOM3 PAD[2] |
| ピン 40 | PC05 — GPIO, SERCOM3 PAD[3] |
| ピン 41 | PC06 — GPIO, SERCOM4 PAD[0] |
| ピン 42 | PC07 — GPIO, SERCOM4 PAD[1] |
| ピン 43 | VDDIO — IO supply voltage |
| ピン 44 | GND — Ground |
| ピン 45 | PC08 — GPIO, SERCOM4 PAD[2] |
| ピン 46 | PC09 — GPIO, SERCOM4 PAD[3] |
| ピン 47 | PC10 — GPIO, SERCOM5 PAD[0] |
| ピン 48 | PC11 — GPIO, SERCOM5 PAD[1] |
| ピン 49 | PC12 — GPIO, SERCOM5 PAD[2] |
| ピン 50 | PC13 — GPIO, SERCOM5 PAD[3] |
| ピン 51 | PC14 — GPIO, QSPI SCK |
| ピン 52 | PC15 — GPIO, QSPI CS |
| ピン 53 | PC16 — GPIO, QSPI IO0 |
| ピン 54 | PC17 — GPIO, QSPI IO1 |
| ピン 55 | PC18 — GPIO, QSPI IO2 |
| ピン 56 | PC19 — GPIO, QSPI IO3 |
| ピン 57 | VDDIO — IO supply voltage |
| ピン 58 | GND — Ground |
| ピン 59 | PD00 — GPIO, I2S SCK |
| ピン 60 | PD01 — GPIO, I2S WS |
| ピン 61 | PD02 — GPIO, I2S SD |
| ピン 62 | PD03 — GPIO, ADC AIN[18] |
| ピン 63 | RESET — Reset input, active low |
| ピン 64 | VDDCORE — Internal core voltage (1.2 V), do not connect externally |
| ピン EP | EP — Exposed thermal pad, must be soldered to GND plane with thermal vias |
主な用途
ATSAME53J19A-MFT の用途: 6 件s: Industrial Ethernet Gateway / IoT Edge Node, USB Instrumentation / Data Acquisition, TFT-based HMI Panel / Building Automation, Automotive Body / Infotainment Controller, Smart Energy Metering, Connected IoT Sensor Hub / Wearable.
Industrial Ethernet Gateway / IoT Edge Node
The ATSAME53J19A-MFT fits industrial Ethernet gateways because of its 120 MHz Cortex-M4F core, integrated 10/100 Ethernet MAC with RMII/MII PHY interface, HS USB 2.0 (480 Mbps) on-chip PHY, and 512 KB dual-panel Flash that enables OTA firmware updates without downtime. The 256 KB SRAM comfortably holds TLS 1.2 / 1.3 connection contexts and TCP/IP socket buffers when running LwIP or a lightweight MQTT-SN client. Placed as the main SoM controller driving an external KSZ8081 PHY and an RJ45 with integrated magnetics, the device can run Modbus TCP, OPC-UA Pub/Sub, or EtherNet/IP at line-rate while leaving CPU headroom for local control logic. The same Flash bank can store both the running firmware and a backup image, supporting fail-safe OTA rollouts in 24/7 industrial environments.
おすすめ
USB Instrumentation / Data Acquisition
The ATSAME53J19A-MFT is well suited for USB-connected test and measurement instruments thanks to its HS USB 2.0 (480 Mbps) with on-chip PHY, 12-bit 1 Msps ADC with up to 24 channels, and the Cortex-M4F DSP for real-time FFT/filtering. Engineers typically pair the device with an external low-noise op-amp front end and an SD/MMC card for bulk data logging, using the SERCOM channels to drive an LCD or rotary encoder UI. Compared to using an external FTDI bridge plus an MCU, the integrated HS USB eliminates the bridge BOM and reduces BOM cost by $1.50-2.00 per unit. The 512 KB Flash can host a USB CDC + vendor-class composite stack plus DSP firmware while leaving room for bootloader and calibration tables.
おすすめ
TFT-based HMI Panel / Building Automation
The ATSAME53J19A-MFT is an excellent fit for TFT-based HMI panels because it integrates a TFT LCD controller with a 2D graphics accelerator, a 120 MHz Cortex-M4F with DSP for fast widget rendering, and 256 KB SRAM that can host a framebuffer plus emWin / Microchip Graphics Suite objects. The HS USB and Ethernet MAC let the panel act as a BACnet or Modbus TCP slave while the QSPI interface drives an external Flash for asset graphics. Designers typically connect a 4.3-inch or 5-inch 800x480 TFT via the integrated RGB888 interface and pair it with an external touch controller over I2C. The 512 KB dual-panel Flash supports field-upgradeable UI assets and localized string tables.
おすすめ
Automotive Body / Infotainment Controller
The ATSAME53J19A-MFT's CAN-FD controller, 120 MHz Cortex-M4F DSP performance, 512 KB Flash, and -40C to +125C extended industrial temperature range make it well suited for automotive body controllers, HVAC panels, and CAN gateway nodes. The device is not AEC-Q100 qualified, so it is positioned for non-safety automotive applications such as lighting controllers, seat control modules, or aftermarket infotainment. Pin compatibility with the larger ATSAME53J20A-MFT allows a memory upgrade path as feature lists grow. Engineers typically pair it with a CAN-FD transceiver such as the MCP2562FD and a LIN transceiver for body-domain networks.
おすすめ
Smart Energy Metering
The ATSAME53J19A-MFT suits single-phase smart energy meters because its 12-bit 1 Msps ADC with 24 channels can simultaneously sample voltage and current CTs / shunt paths while the Cortex-M4F DSP runs real-time FFT-based harmonic analysis up to the 50th harmonic. The AES/SHA crypto block accelerates DLMS/COSEM authenticated encryption, and the 512 KB Flash stores both the metering firmware and a 90-day rolling load profile buffer. Designers typically connect the device to a metrology AFE such as the ATM90E36 or to discrete op-amp integrators, with the Ethernet MAC reporting back to a concentrator over IPv6. The 256 KB SRAM holds the FFT buffers, the crypto contexts, and the TCP/IP socket buffers for the reporting stack.
おすすめ
Connected IoT Sensor Hub / Wearable
The ATSAME53J19A-MFT is appropriate for connected IoT sensor hubs and high-end wearables because the Cortex-M4F DSP can run on-device sensor fusion at low power, the QSPI interface drives external Flash / PSRAM for asset storage, and the HS USB handles charging + data sync. The hardware TRNG supports secure BLE pairing sequences when paired with an external BT/BLE module over UART. Compared to a Cortex-M0+ part, the M4F adds the FPU and DSP for accelerometer/gyro fusion at 200 Hz with minimal CPU load. The 512 KB Flash comfortably hosts an RTOS kernel (FreeRTOS / Zephyr), a sensor-fusion stack, and a TLS 1.3 client.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAME53J19A-MFT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAME53J19A-MFE | ATSAME53J19A-AF | ATSAME53J20A-MFT | ATSAME53J18A-MFT | ATSAME51J19A-MFT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-TQFP (14x14 mm) - different land pattern | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 1 MB (+100%) | 256 KB (-50%) | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | No |
| USB Type | HS USB 2.0 (480 Mbps) | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | FS USB (12 Mbps) |
| Packaging | Tape & Reel | Tray | Tape & Reel (TQFP) | Tape & Reel | Tape & Reel | Tape & Reel |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
主な差別化要因
- Integrated 10/100 Ethernet MAC and HS USB 2.0 (480 Mbps) on-chip PHY in a 64-QFN package （vs ATSAME51J19A-MFT)
- Dual-panel Flash with read-while-write OTA support （vs ATSAME53J18A-MFT)
- Integrated TFT LCD controller with 2D graphics accelerator （vs ATSAME51N20A-AU-EFP)
設計ノート
Expose the central exposed thermal pad (EP) of the 64-QFN (9x9 mm) package with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the top thermal copper pour to the inner ground plane. Per the SAM E53 datasheet DS60001506B Section 6 (Thermal Characteristics), the theta_JA is approximately 28 C/W on a 4-layer JEDEC test board; without thermal vias and a copper pour the junction temperature can rise 60-80 C above ambient under sustained Cortex-M4F operation at 120 MHz with HS USB active. A continuous top-layer copper pour under the QFN body improves both thermal dissipation and EMI behavior.
Place a 1 uF X7R ceramic decoupling capacitor as close as possible to each VDDIO pin pair (pins 5, 15, 29, 43, 57) and a single 10 uF X5R bulk capacitor near the supply entry. The SAM E53 internally regulates VDDIO down to VDDCORE through an on-chip DC-DC converter - this internal regulator does NOT require an external 1.2 V LDO. Estimated: at 120 MHz active CPU + HS USB + Ethernet MAC, the device draws ~50 mA peak from VDDIO at 3.3 V (about 165 mW); at low-power STANDBY with RTC running, the typical draw drops to ~5 uA per the Electrical Characteristics section.
Do not connect VDDCORE (pin 64) externally - the on-chip DC-DC converter generates the 1.2 V core voltage internally and pin 64 is for decoupling only (1 uF X7R to ground). Do not apply 1.2 V to pin 64 from an external LDO; doing so can damage the device. Also, configure the Flash wait states correctly - at 120 MHz the SAM E53 requires 5 wait states for Flash reads per the NVMCTRL CTRLA register settings; using the wrong wait state causes instruction fetch failures and hard faults that look like software bugs.
Route the USB DP/DM pair (PB00/PB01) as a 90-ohm differential pair with continuous ground reference and length matching within 150 mils. Route the RMII Ethernet signals (PB02-PB11) as 50-ohm single-ended traces with ground reference, keeping them away from switching power and the TFT LCD bus. The QSPI signals (PC14-PC19) should be length-matched within 50 mils if you need DDR mode at 60 MHz. Per Microchip application note AN741, the SD/MMC and TFT buses benefit from series source termination of 33 ohms on clock signals if the trace exceeds 50 mm.
コンプライアンス情報
RoHS compliant per Microchip product page. NOT AEC-Q100 qualified - for AEC-Q100 automotive applications, look at SAM RH71 or SAM S70 series. Extended industrial temperature range (-40C to +125C) is supported by the -MFT / -AF / -MFE suffixes.
