BSC9131NJE7HHHB 800MHz QorIQ SoC | NXP | Communications
部品番号: BSC9131NJE7HHHB ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $59.0341 | $59.03 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
BSC9131NJE7HHHB 概要
A QorIQ Qonverge SoC is a highly integrated communications processor that consolidates one or more processor cores, memory interfaces, security functions, accelerators, and dedicated communications resources into one semiconductor device. Such devices sit between general-purpose microprocessors and dedicated digital signal processors: they provide software-configurable real-time processing for packet handling, baseband workloads, voice systems, and control tasks without requiring several separate chips.
The verified product information identifies an 800 MHz StarCore SC3850 core, an 800 MHz Power e500 CPU core, and MAPLE-B2F specialist DSP acceleration. It also identifies DDR3 memory support and SEC security capability. The BSC9131 is therefore suited to systems that combine control-plane processing with throughput-intensive communications or signal-processing work. Its operating-temperature range of -40°C to +105°C supports industrial and defense-oriented environments, although individual system qualification remains necessary.
The package is a 520-FCBGA, 21 mm by 21 mm component. Such a large ball-grid package supports the device's extensive processor, accelerator, memory, and I/O resources but demands careful PCB escape routing, multilayer interconnect, power delivery, and thermal design. The verified data does not provide core voltages, cache sizes, memory width, I/O counts, power limits, pin names, or ball assignments, so these details must be confirmed in the official NXP documentation before schematic capture or layout.
Typical deployments include small-cell base-station processing, enterprise VoIP equipment, smart-grid controllers, industrial automation systems, and military or defense platforms. Its value is architectural integration: software can allocate work among the e500 CPU, StarCore DSP, and MAPLE-B2F accelerator instead of requiring separate processors connected through external interfaces. This can reduce board-level component count while preserving specialized throughput.
For new PCB designs, treat the 520-FCBGA as a complex system-in-package-scale device requiring controlled power sequencing, high-speed memory routing, extensive via connectivity, and thermal analysis. Because the part is marked end of life by NXP, production continuity and software support require review of NXP's discontinuation and replacement information. This page synthesizes current distributor availability, lifecycle data, technical positioning, and sourcing constraints.
Before approving a design, verify the official NXP part page and datasheet for electrical limits, memory topology, interface multiplexing, ball assignments, reference power design, and software requirements. Distributor inventory does not establish long-term availability, and an end-of-life processor may require last-time-buy planning or a redesign rather than a simple drop-in substitution.
ドロップイン代替品: BSC9131NJE7HHHB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストBSC9131NJE7HHHB 最大定格＆電気的特性
| Product Type | QorIQ Qonverge SoC |
| StarCore DSP Frequency | 800 MHz |
| StarCore DSP Core | SC3850 |
| CPU Core | Power e500 |
| CPU Frequency | 800 MHz |
| Specialized Accelerator | MAPLE-B2F |
| Memory Support | DDR3 |
| Security Feature | SEC |
| Core Count | 1 core |
| Processor Word Size | 32-bit |
| 動作温度範囲 | -40°C to +105°C |
| パッケージ | 520-FCBGA |
| Package Dimensions | 21 mm × 21 mm |
| 実装タイプ | Surface Mount |
| ライフサイクル状態 | End of Life |
BSC9131NJE7HHHB 21 mm × 21 mm ピン配置ガイド
BSC9131NJE7HHHB (21 mm × 21 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: BSC9131NJE7HHHB.
詳細は データシート をご参照ください。
主な用途
BSC9131NJE7HHHB の用途: 6 件s: Small-Cell Base Stations, Enterprise VoIP Systems, Smart-Grid Control, Industrial Automation Controllers, Military and Defense Platforms, Real-Time Signal Processing.
Small-Cell Base Stations
The BSC9131NJE7HHHB fits small-cell base-station designs that require both control processing and specialized real-time work. Its 800 MHz Power e500 CPU can handle control-oriented tasks, while the 800 MHz StarCore SC3850 DSP and MAPLE-B2F accelerator address signal-processing workloads. DDR3 support provides a high-bandwidth memory path, and SEC adds a security function relevant to communications equipment. The verified 520-FCBGA package is complex, so the board must follow NXP's reference power and routing requirements. Procurement remains the principal constraint because the processor is marked end of life.
おすすめ
Enterprise VoIP Systems
BSC9131NJE7HHHB is appropriate for enterprise VoIP platforms that combine packet-control functions with real-time media processing. The Power e500 core supplies a 32-bit general-purpose processing environment, while the StarCore SC3850 DSP and MAPLE-B2F accelerator can support time-sensitive voice or signal-processing tasks. DDR3 and SEC support align with networked endpoints requiring memory bandwidth and security functions. Integration can simplify multi-processor designs, but software partitioning and real-time performance must be demonstrated. The -40°C to +105°C range also suits industrial communication equipment.
おすすめ
Smart-Grid Control
The BSC9131NJE7HHHB can serve as the processing centerpiece of a smart-grid controller when a design needs deterministic DSP capability alongside general-purpose control. The 800 MHz StarCore SC3850 core and MAPLE-B2F accelerator suit repetitive waveform or communications workloads, while the 800 MHz Power e500 core manages protocols and supervisory logic. Its -40°C to +105°C specification range supports industrial environments. DDR3 enables a comparatively high-bandwidth working memory, but system designers must verify power rails, signal integrity, watchdog behavior, and functional-safety requirements. End-of-life status requires a deliberate maintenance plan.
おすすめ
Industrial Automation Controllers
BSC9131NJE7HHHB is suitable for industrial automation controllers that combine network management with real-time processing. Its Power e500 CPU supports general control functions, while the StarCore SC3850 DSP and MAPLE-B2F accelerator can handle data-intensive signal processing without requiring a separate processor. DDR3 support benefits memory-heavy control software, and the -40°C to +105°C range matches demanding industrial environments. Integration may reduce external component count, but the 520-FCBGA demands advanced assembly capability. Engineers should confirm EMC, thermal, watchdog, and functional-safety requirements at the system level.
おすすめ
Military and Defense Platforms
BSC9131NJE7HHHB can be evaluated for military and defense platforms that benefit from integrated control, DSP acceleration, and a broad temperature range. The 800 MHz Power e500 CPU executes general-purpose software, the 800 MHz StarCore SC3850 DSP handles real-time workloads, and MAPLE-B2F provides specialist acceleration. SEC support may assist security-sensitive designs. These capabilities do not by themselves establish military qualification, so program-specific temperature, shock, radiation, supply-chain, and software-assurance requirements must be verified. The processor's end-of-life status also requires a long-term sustainment assessment.
おすすめ
Real-Time Signal Processing
BSC9131NJE7HHHB is a strong architectural fit when a system must partition real-time signal processing from general-purpose control. The StarCore SC3850 DSP operates at 800 MHz, while the Power e500 CPU also operates at 800 MHz and can manage configuration or supervisory tasks. The MAPLE-B2F accelerator adds a dedicated processing path for supported workloads. DDR3 support is useful for trace, frame, or coefficient data, although bus width and supported density were not supplied. Exact throughput depends on memory topology and software. Confirm cache, DMA, accelerator interfaces, and timing from NXP documentation before performance commitments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: BSC9131NJE7HHHB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Brand | NXP Semiconductors |
| Package | 520-FCBGA, 21 mm × 21 mm |
| Product Type | QorIQ Qonverge SoC |
| CPU Core | Power e500 |
| CPU Frequency | 800 MHz |
| DSP Core | StarCore SC3850 |
| DSP Frequency | 800 MHz |
| Specialized Accelerator | MAPLE-B2F |
| Memory Support | DDR3 |
| Security Feature | SEC |
| Operating Temperature | -40°C to +105°C |
| Lifecycle Status | End of Life |
主な差別化要因
- Integrated heterogeneous processing （vs A general-purpose 800 MHz processor)
- Communications and signal-processing integration （vs A separate CPU-plus-DSP architecture)
- Named target-market fit （vs A general embedded microcontroller)
設計ノート
Do not begin PCB power planning from the distributor summary. The verified data does not provide rail names, voltages, current limits, sequencing, or power-up behavior. Download the official NXP data sheet and reference design, identify every supply and I/O tolerance, then validate the power-delivery network for the 520-FCBGA. Estimated regulator sizing and junction-temperature calculations must use those confirmed rail values rather than assumptions.
The 520-FCBGA requires a multilayer PCB with dense escape routing, short reference-plane connections, and adequate via structures beneath the device. Follow the NXP ball map and recommended stack-up rather than routing by apparent symmetry. Validate DDR3 and other high-speed interfaces with the specified topology and constraints. Assembly yield, warpage, via-in-pad policy, solder inspection, and rework capability also need evaluation because of package complexity.
Thermal design cannot be quantified from the supplied 520-FCBGA package name alone. Obtain the manufacturer's thermal model, junction-temperature limits, power map, and board construction guidance before selecting copper area, vias, heat spreaders, or airflow. Estimated total dissipation should be calculated from confirmed rail currents, and junction temperature should be checked with the applicable package and board thermal model rather than a generic assumption.
Do not interpret the 800 MHz CPU and DSP ratings as interchangeable performance or assume that a general-purpose SoC is pin compatible. A valid redesign comparison must cover the 520-FCBGA ball map, Power e500 software ecosystem, StarCore SC3850 tools, MAPLE-B2F acceleration, DDR3 topology, SEC implementation, peripherals, thermal constraints, and legacy software. Any proposed substitute requires board-level and software sign-off.
Separate sensitive clock, DDR3, and high-speed interface routing according to the official NXP reference design. Maintain continuous reference planes, avoid splits beneath active routes, control return paths for high-speed signals, and apply manufacturer-defined via and trace geometry. Signal-integrity or EMC validation must be repeated for each stack-up because the supplied data does not specify pinout, interface topology, or impedance requirements.
コンプライアンス情報
The supplied data does not state RoHS, REACH, halogen-free, lead-free, conflict-minerals, or automotive qualification status. AEC-Q100 is treated as not applicable because this is a communications SoC, not an identified automotive-qualified device.
