C8051F506-IM - 50MHz 8051 32KB Flash Automotive MCU | Silicon Labs
部品番号: C8051F506-IM ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.83 | $5.83 |
| 10 | $5.25 | $52.50 |
| 100 | $4.68 | $468.00 |
| 500 | $4.2 | $2,100.00 |
| 1,000 | $3.75 | $3,750.00 |
C8051F506-IM 概要
An 8051 microcontroller is a Harvard-architecture 8-bit CPU originally introduced by Intel in 1980 and now widely licensed and extended by Silicon Labs (formerly Cygnal), Nuvoton, and others. The C8051F50x family belongs to the broader Mixed-Signal ISP Flash MCU Family - a hypernym hierarchy that places it under 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. Modern 8051 cores from Silicon Labs achieve up to 50 MIPS throughput and integrate analog peripherals such as ADC, DAC, comparators, voltage references, and communication controllers onto a single die, eliminating external analog components.
Key features of the C8051F506-IM include 32 KB (32K x 8) Flash, 4.25 KB RAM (256 bytes standard + 4 KB AUX RAM), a 12-bit ADC with up to 25 channels, an on-chip temperature sensor, two analog comparators, integrated CAN 2.0B and LIN 2.1 controllers, and 25 digital I/O lines. The 50 MHz core delivers 50 MIPS instruction throughput, making it suitable for real-time control loops. On-chip oscillators (24 MHz internal) eliminate external crystals in many designs.
Typical applications include automotive body controllers and sensor nodes, LIN/CAN-connected ECUs, industrial CANopen or DeviceNet slaves, brushless DC motor control, and low-power sensor hubs. The AEC-Q100 grade and 125 °C capability let designers deploy the same firmware into under-hood and cabin environments. The wide 1.8 V-5.25 V supply range also enables direct connection to Li-ion or 3.3 V digital rails without level shifters.
When designing with the C8051F506-IM, place the bypass capacitors (one 0.1 µF plus one 4.7 µF bulk) within 5 mm of the VDD pin to minimize digital switching noise on the analog reference. For automotive applications, follow the Silicon Labs EMC guidelines for CAN bus termination (typically 120 Ω split termination) and route LIN bus traces away from switching nodes.
This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes that go beyond what is in the manufacturer datasheet, helping engineers shorten evaluation cycles and make informed replacement decisions.
ドロップイン代替品: C8051F506-IM — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
C8051F500-IM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
C8051F502-IM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
C8051F504-IM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
C8051F505-IM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
C8051F567-IM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
C8051F581-IM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
C8051F506-IM 最大定格＆電気的特性
| Core Architecture | 8051 (8-bit, 1-cycle CIP-51) |
| Maximum Core Frequency | 50 MHz (50 MIPS) |
| Program Flash Memory | 32 KB (32K x 8), in-system programmable |
| RAM | 4.25 KB total (256 B SRAM + 4 KB AUX RAM) |
| Operating Voltage Range | 1.8 V to 5.25 V |
| 動作温度範囲 | -40 °C to +125 °C (AEC-Q100) |
| パッケージ | 32-QFN (5x5 mm) |
| Digital I/O Pins | 25 |
| ADC | 12-bit, up to 25 channels |
| Analog Comparators | 2 |
| Communication Interfaces | CAN 2.0B, LIN 2.1, UART, SPI, I2C/SMBus |
| On-Chip Oscillator | 24 MHz internal (±2% accuracy) |
| On-Chip Temperature Sensor | Yes |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| AEC-Q100 Qualification | Qualified (automotive grade) |
C8051F506-IM ピン構成
| ピン 1 | P0.0 — Port 0.0 digital I/O |
| ピン 2 | P0.1 — Port 0.1 digital I/O |
| ピン 3 | P0.2 — Port 0.2 digital I/O |
| ピン 4 | P0.3 — Port 0.3 digital I/O |
| ピン 5 | P0.4 — Port 0.4 digital I/O |
| ピン 6 | P0.5 — Port 0.5 digital I/O |
| ピン 7 | P0.6 — Port 0.6 digital I/O |
| ピン 8 | P0.7 — Port 0.7 digital I/O |
| ピン 9 | VIO — I/O supply voltage |
| ピン 10 | GND — Ground |
| ピン 11 | P1.0 — Port 1.0 digital I/O |
| ピン 12 | P1.1 — Port 1.1 digital I/O |
| ピン 13 | P1.2 — Port 1.2 digital I/O |
| ピン 14 | P1.3 — Port 1.3 digital I/O |
| ピン 15 | P1.4 — Port 1.4 digital I/O |
| ピン 16 | P1.5 — Port 1.5 digital I/O |
| ピン 17 | P1.6 — Port 1.6 digital I/O |
| ピン 18 | P1.7 — Port 1.7 digital I/O |
| ピン 19 | P2.0 — Port 2.0 digital I/O |
| ピン 20 | P2.1 — Port 2.1 digital I/O |
| ピン 21 | P2.2 — Port 2.2 digital I/O |
| ピン 22 | P2.3 — Port 2.3 digital I/O |
| ピン 23 | P2.4 — Port 2.4 digital I/O |
| ピン 24 | P2.5 — Port 2.5 digital I/O |
| ピン 25 | P2.6 — Port 2.6 digital I/O |
| ピン 26 | P2.7 — Port 2.7 digital I/O |
| ピン 27 | VDD — Digital supply voltage |
| ピン 28 | GND — Ground |
| ピン 29 | RST — Reset input (active low) |
| ピン 30 | C2CK — C2 debug clock |
| ピン 31 | C2D — C2 debug data |
| ピン 32 | EP — Exposed pad (connect to GND) |
主な用途
C8051F506-IM の用途: 7 件s: Automotive Body Control Module, LIN Sensor Node / Smart Sensor, Industrial CANopen / DeviceNet Slave, Brushless DC (BLDC) Motor Control, Battery Management Slave / Cell Monitor, HVAC Climate Control Interface, Industrial Sensor Hub / IoT Edge Node.
Automotive Body Control Module
The C8051F506-IM suits automotive BCMs where its 50 MHz CIP-51 core and integrated CAN 2.0B plus LIN 2.1 controllers consolidate multiple bus interfaces onto one chip. AEC-Q100 qualification and the -40 °C to +125 °C operating range allow deployment in cabin or under-hood environments. 32 KB Flash accommodates typical BCM firmware with comfort-feature state machines, while 25 digital I/O pins drive body loads directly or via FET pre-drivers. Compared to a discrete MCU + external CAN/LIN transceiver stack, the C8051F506-IM reduces BOM count and PCB area, critical for cost-sensitive body electronics where each module ships in millions annually.
おすすめ
LIN Sensor Node / Smart Sensor
The C8051F506-IM is a strong fit for LIN 2.1 sensor nodes (window lift, seat position, rain/light, temperature) because the on-chip LIN controller eliminates an external LIN ASIC. Operating from 1.8 V to 5.25 V lets the node survive automotive load-dump events and 12 V battery transients when paired with a regulator. The 12-bit ADC with up to 25 channels handles multiple analog sensors without an external mux. AEC-Q100 + 125 °C operation removes the need for derating in sealed cabin modules, while 32 KB Flash fits LIN stack plus application firmware. The QFN-32 5x5 mm footprint enables compact sensor housings.
おすすめ
Industrial CANopen / DeviceNet Slave
For industrial CANopen or DeviceNet slave controllers, the C8051F506-IM combines the on-chip CAN 2.0B controller with 50 MIPS throughput, sufficient for stack processing plus real-time PDO handling. The 1.8 V to 5.25 V supply allows direct 3.3 V or 5 V operation from industrial 24 V rails via a simple switching regulator. 25 digital I/O pins drive valves, opto-isolators, and indicator LEDs directly. AEC-Q100 over-stress margin gives extended reliability in factory-floor environments with high EMI. The 12-bit ADC monitors analog feedback (pressure, position) without an external ADC, simplifying BOM.
おすすめ
Brushless DC (BLDC) Motor Control
BLDC motor control in HVAC fans, water pumps, or small e-mobility drives benefits from the C8051F506-IM's 50 MIPS throughput, which executes sensorless or Hall-sensor commutation algorithms in real time. The 12-bit ADC samples back-EMF or phase current with 25-channel flexibility, while two on-chip analog comparators generate hardware overcurrent protection. PWM-driven GPIO timers handle FET pre-drive without external logic. AEC-Q100 grade and +125 °C tolerance suit under-hood pumps and fans. The wide 1.8 V to 5.25 V supply supports both 3.3 V logic FET drivers and 5 V gate-drive rails.
おすすめ
Battery Management Slave / Cell Monitor
In Li-ion battery management architectures the C8051F506-IM can serve as a slave cell-monitoring controller communicating over CAN or LIN to a master BMS. Its 1.8 V minimum supply allows operation directly from a single Li-ion cell stack, while the on-chip 12-bit ADC (up to 25 channels) multiplexes cell voltage and NTC thermistor inputs. AEC-Q100 + 125 °C operation handles the high-ambient conditions of pack-mounted electronics. The on-chip temperature sensor provides a secondary die-temperature readout. 32 KB Flash stores calibration tables, lookup curves, and diagnostic logs.
おすすめ
HVAC Climate Control Interface
HVAC climate control panels benefit from the C8051F506-IM's 12-bit ADC for NTC temperature sensing and 25 GPIO pins for keypad scanning, LED drivers, and display multiplexing. The on-chip CAN/LIN interfaces integrate the panel into vehicle networks without external controllers. 32 KB Flash fits menu state machines, calibration curves, and CAN/LIN stack. The wide 1.8 V to 5.25 V supply and +125 °C operation tolerate dashboard thermal stress. Compared to a discrete 8051 plus external ADC design, the C8051F506-IM reduces PCB area, allowing thinner bezel-less climate modules.
おすすめ
Industrial Sensor Hub / IoT Edge Node
For industrial IoT edge nodes and sensor hubs, the C8051F506-IM aggregates multiple analog sensors via its 25-channel 12-bit ADC and reports over CAN or LIN to a higher-level controller. The on-chip temperature sensor and comparators enable health-monitoring and over-current protection without external components. The 1.8 V to 5.25 V supply allows battery or PoL regulator input. AEC-Q100 qualification plus 125 °C capability translates to longer field life in industrial cabinets. Firmware benefits from the 32 KB Flash for protocol stacks and application logic, while 50 MIPS handles local edge processing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: C8051F506-IM — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | C8051F500-IM | C8051F502-IM | C8051F504-IM | C8051F567-IM |
|---|---|---|---|---|---|
| Package | 32-QFN (5x5 mm) | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Core | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz |
| Flash | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB |
| CAN 2.0B | Yes | Yes | No (LIN only) | Yes | Yes |
| LIN 2.1 | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 | Qualified, +125 °C | Qualified, +125 °C | Qualified, +125 °C | Qualified, +125 °C | Qualified, +125 °C |
| Operating Voltage | 1.8 V to 5.25 V | 1.8 V to 5.25 V | 1.8 V to 5.25 V | 1.8 V to 5.25 V | 1.8 V to 5.25 V |
主な差別化要因
- Integrated CAN 2.0B plus LIN 2.1 controllers in same 32-QFN 5x5 mm package （vs C8051F502-IM)
- AEC-Q100 grade up to +125 °C with 32 KB Flash in compact QFN-32 （vs C8051F567-IM)
- 50 MIPS throughput with 25-channel 12-bit ADC and 2 analog comparators （vs C8051F504-IM)
設計ノート
Place a 0.1 µF ceramic bypass within 5 mm of the VDD pin and a 4.7 µF bulk capacitor on the same net. The C8051F506-IM includes an internal 5 mA LDO for the core; decoupling at the VIO pin is required even when VIO = VDD. Connect the exposed pad (pin 32) directly to the ground plane with at least 5 thermal vias to reduce die-to-case thermal resistance.
C2D is a bidirectional open-drain pin - external 4.7 kΩ pull-up to VIO is required for in-system programming. RST must be pulled high via 4.7 kΩ; leaving it floating may cause spurious resets during cranking pulses. Do not exceed the absolute maximum supply voltage of 5.25 V even briefly during load-dump transients.
For CAN bus signals, route the differential pair (CAN_TX, CAN_RX to external transceiver) as a 100 Ω differential pair with no stubs and ground it via 120 Ω split termination at the bus ends. Keep LIN bus traces short and away from switching power traces; place the LIN ESD protection within 10 mm of the connector. The on-chip ADC channels are not multiplexed with LIN/CAN, so analog signals can be routed independently.
Estimated: at maximum +125 °C ambient and full 50 MHz operation with all peripherals enabled, junction-to-ambient thermal resistance for the 32-QFN 5x5 mm is approximately 35 °C/W on a 4-layer JEDEC test board. Designers planning continuous full-load operation should verify with silicon-specific characterization data from Silicon Labs, especially for sealed automotive enclosures with limited convection.
コンプライアンス情報
AEC-Q100 qualified per Silicon Labs product page. RoHS and REACH compliant per distributor listings. Halogen-free and lead-free per Silicon Labs material declarations.
