C8051F506-IM - 50MHz 8051 32KB Flash Automotive MCU | Silicon Labs
Référence : C8051F506-IM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.83 | $5,83 |
| 10 | $5.25 | $52,50 |
| 100 | $4.68 | $468,00 |
| 500 | $4.2 | $2 100,00 |
| 1 000 | $3.75 | $3 750,00 |
C8051F506-IM Présentation
An 8051 microcontroller is a Harvard-architecture 8-bit CPU originally introduced by Intel in 1980 and now widely licensed and extended by Silicon Labs (formerly Cygnal), Nuvoton, and others. The C8051F50x family belongs to the broader Mixed-Signal ISP Flash MCU Family - a hypernym hierarchy that places it under 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. Modern 8051 cores from Silicon Labs achieve up to 50 MIPS throughput and integrate analog peripherals such as ADC, DAC, comparators, voltage references, and communication controllers onto a single die, eliminating external analog components.
Key features of the C8051F506-IM include 32 KB (32K x 8) Flash, 4.25 KB RAM (256 bytes standard + 4 KB AUX RAM), a 12-bit ADC with up to 25 channels, an on-chip temperature sensor, two analog comparators, integrated CAN 2.0B and LIN 2.1 controllers, and 25 digital I/O lines. The 50 MHz core delivers 50 MIPS instruction throughput, making it suitable for real-time control loops. On-chip oscillators (24 MHz internal) eliminate external crystals in many designs.
Typical applications include automotive body controllers and sensor nodes, LIN/CAN-connected ECUs, industrial CANopen or DeviceNet slaves, brushless DC motor control, and low-power sensor hubs. The AEC-Q100 grade and 125 °C capability let designers deploy the same firmware into under-hood and cabin environments. The wide 1.8 V-5.25 V supply range also enables direct connection to Li-ion or 3.3 V digital rails without level shifters.
When designing with the C8051F506-IM, place the bypass capacitors (one 0.1 µF plus one 4.7 µF bulk) within 5 mm of the VDD pin to minimize digital switching noise on the analog reference. For automotive applications, follow the Silicon Labs EMC guidelines for CAN bus termination (typically 120 Ω split termination) and route LIN bus traces away from switching nodes.
This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes that go beyond what is in the manufacturer datasheet, helping engineers shorten evaluation cycles and make informed replacement decisions.
Alternatives de remplacement direct pour C8051F506-IM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
C8051F500-IM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
C8051F502-IM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
C8051F504-IM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
C8051F505-IM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
C8051F567-IM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
C8051F581-IM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
C8051F506-IM Valeurs maximales et caractéristiques électriques
| Core Architecture | 8051 (8-bit, 1-cycle CIP-51) |
| Maximum Core Frequency | 50 MHz (50 MIPS) |
| Program Flash Memory | 32 KB (32K x 8), in-system programmable |
| RAM | 4.25 KB total (256 B SRAM + 4 KB AUX RAM) |
| Operating Voltage Range | 1.8 V to 5.25 V |
| Plage de température de fonctionnement | -40 °C to +125 °C (AEC-Q100) |
| Boîtier | 32-QFN (5x5 mm) |
| Digital I/O Pins | 25 |
| ADC | 12-bit, up to 25 channels |
| Analog Comparators | 2 |
| Communication Interfaces | CAN 2.0B, LIN 2.1, UART, SPI, I2C/SMBus |
| On-Chip Oscillator | 24 MHz internal (±2% accuracy) |
| On-Chip Temperature Sensor | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| AEC-Q100 Qualification | Qualified (automotive grade) |
Configuration des broches de C8051F506-IM
| Broche 1 | P0.0 — Port 0.0 digital I/O |
| Broche 2 | P0.1 — Port 0.1 digital I/O |
| Broche 3 | P0.2 — Port 0.2 digital I/O |
| Broche 4 | P0.3 — Port 0.3 digital I/O |
| Broche 5 | P0.4 — Port 0.4 digital I/O |
| Broche 6 | P0.5 — Port 0.5 digital I/O |
| Broche 7 | P0.6 — Port 0.6 digital I/O |
| Broche 8 | P0.7 — Port 0.7 digital I/O |
| Broche 9 | VIO — I/O supply voltage |
| Broche 10 | GND — Ground |
| Broche 11 | P1.0 — Port 1.0 digital I/O |
| Broche 12 | P1.1 — Port 1.1 digital I/O |
| Broche 13 | P1.2 — Port 1.2 digital I/O |
| Broche 14 | P1.3 — Port 1.3 digital I/O |
| Broche 15 | P1.4 — Port 1.4 digital I/O |
| Broche 16 | P1.5 — Port 1.5 digital I/O |
| Broche 17 | P1.6 — Port 1.6 digital I/O |
| Broche 18 | P1.7 — Port 1.7 digital I/O |
| Broche 19 | P2.0 — Port 2.0 digital I/O |
| Broche 20 | P2.1 — Port 2.1 digital I/O |
| Broche 21 | P2.2 — Port 2.2 digital I/O |
| Broche 22 | P2.3 — Port 2.3 digital I/O |
| Broche 23 | P2.4 — Port 2.4 digital I/O |
| Broche 24 | P2.5 — Port 2.5 digital I/O |
| Broche 25 | P2.6 — Port 2.6 digital I/O |
| Broche 26 | P2.7 — Port 2.7 digital I/O |
| Broche 27 | VDD — Digital supply voltage |
| Broche 28 | GND — Ground |
| Broche 29 | RST — Reset input (active low) |
| Broche 30 | C2CK — C2 debug clock |
| Broche 31 | C2D — C2 debug data |
| Broche 32 | EP — Exposed pad (connect to GND) |
Applications typiques
C8051F506-IM convient pour 7 applications: Automotive Body Control Module, LIN Sensor Node / Smart Sensor, Industrial CANopen / DeviceNet Slave, Brushless DC (BLDC) Motor Control, Battery Management Slave / Cell Monitor, HVAC Climate Control Interface, Industrial Sensor Hub / IoT Edge Node.
Automotive Body Control Module
The C8051F506-IM suits automotive BCMs where its 50 MHz CIP-51 core and integrated CAN 2.0B plus LIN 2.1 controllers consolidate multiple bus interfaces onto one chip. AEC-Q100 qualification and the -40 °C to +125 °C operating range allow deployment in cabin or under-hood environments. 32 KB Flash accommodates typical BCM firmware with comfort-feature state machines, while 25 digital I/O pins drive body loads directly or via FET pre-drivers. Compared to a discrete MCU + external CAN/LIN transceiver stack, the C8051F506-IM reduces BOM count and PCB area, critical for cost-sensitive body electronics where each module ships in millions annually.
Recommandé
LIN Sensor Node / Smart Sensor
The C8051F506-IM is a strong fit for LIN 2.1 sensor nodes (window lift, seat position, rain/light, temperature) because the on-chip LIN controller eliminates an external LIN ASIC. Operating from 1.8 V to 5.25 V lets the node survive automotive load-dump events and 12 V battery transients when paired with a regulator. The 12-bit ADC with up to 25 channels handles multiple analog sensors without an external mux. AEC-Q100 + 125 °C operation removes the need for derating in sealed cabin modules, while 32 KB Flash fits LIN stack plus application firmware. The QFN-32 5x5 mm footprint enables compact sensor housings.
Recommandé
Industrial CANopen / DeviceNet Slave
For industrial CANopen or DeviceNet slave controllers, the C8051F506-IM combines the on-chip CAN 2.0B controller with 50 MIPS throughput, sufficient for stack processing plus real-time PDO handling. The 1.8 V to 5.25 V supply allows direct 3.3 V or 5 V operation from industrial 24 V rails via a simple switching regulator. 25 digital I/O pins drive valves, opto-isolators, and indicator LEDs directly. AEC-Q100 over-stress margin gives extended reliability in factory-floor environments with high EMI. The 12-bit ADC monitors analog feedback (pressure, position) without an external ADC, simplifying BOM.
Recommandé
Brushless DC (BLDC) Motor Control
BLDC motor control in HVAC fans, water pumps, or small e-mobility drives benefits from the C8051F506-IM's 50 MIPS throughput, which executes sensorless or Hall-sensor commutation algorithms in real time. The 12-bit ADC samples back-EMF or phase current with 25-channel flexibility, while two on-chip analog comparators generate hardware overcurrent protection. PWM-driven GPIO timers handle FET pre-drive without external logic. AEC-Q100 grade and +125 °C tolerance suit under-hood pumps and fans. The wide 1.8 V to 5.25 V supply supports both 3.3 V logic FET drivers and 5 V gate-drive rails.
Recommandé
Battery Management Slave / Cell Monitor
In Li-ion battery management architectures the C8051F506-IM can serve as a slave cell-monitoring controller communicating over CAN or LIN to a master BMS. Its 1.8 V minimum supply allows operation directly from a single Li-ion cell stack, while the on-chip 12-bit ADC (up to 25 channels) multiplexes cell voltage and NTC thermistor inputs. AEC-Q100 + 125 °C operation handles the high-ambient conditions of pack-mounted electronics. The on-chip temperature sensor provides a secondary die-temperature readout. 32 KB Flash stores calibration tables, lookup curves, and diagnostic logs.
Recommandé
HVAC Climate Control Interface
HVAC climate control panels benefit from the C8051F506-IM's 12-bit ADC for NTC temperature sensing and 25 GPIO pins for keypad scanning, LED drivers, and display multiplexing. The on-chip CAN/LIN interfaces integrate the panel into vehicle networks without external controllers. 32 KB Flash fits menu state machines, calibration curves, and CAN/LIN stack. The wide 1.8 V to 5.25 V supply and +125 °C operation tolerate dashboard thermal stress. Compared to a discrete 8051 plus external ADC design, the C8051F506-IM reduces PCB area, allowing thinner bezel-less climate modules.
Recommandé
Industrial Sensor Hub / IoT Edge Node
For industrial IoT edge nodes and sensor hubs, the C8051F506-IM aggregates multiple analog sensors via its 25-channel 12-bit ADC and reports over CAN or LIN to a higher-level controller. The on-chip temperature sensor and comparators enable health-monitoring and over-current protection without external components. The 1.8 V to 5.25 V supply allows battery or PoL regulator input. AEC-Q100 qualification plus 125 °C capability translates to longer field life in industrial cabinets. Firmware benefits from the 32 KB Flash for protocol stacks and application logic, while 50 MIPS handles local edge processing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour C8051F506-IM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | C8051F500-IM | C8051F502-IM | C8051F504-IM | C8051F567-IM |
|---|---|---|---|---|---|
| Package | 32-QFN (5x5 mm) | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Core | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz | CIP-51 8051, 50 MHz |
| Flash | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB |
| CAN 2.0B | Yes | Yes | No (LIN only) | Yes | Yes |
| LIN 2.1 | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 | Qualified, +125 °C | Qualified, +125 °C | Qualified, +125 °C | Qualified, +125 °C | Qualified, +125 °C |
| Operating Voltage | 1.8 V to 5.25 V | 1.8 V to 5.25 V | 1.8 V to 5.25 V | 1.8 V to 5.25 V | 1.8 V to 5.25 V |
Principaux différenciateurs
- Integrated CAN 2.0B plus LIN 2.1 controllers in same 32-QFN 5x5 mm package (vs C8051F502-IM)
- AEC-Q100 grade up to +125 °C with 32 KB Flash in compact QFN-32 (vs C8051F567-IM)
- 50 MIPS throughput with 25-channel 12-bit ADC and 2 analog comparators (vs C8051F504-IM)
Notes de conception
Place a 0.1 µF ceramic bypass within 5 mm of the VDD pin and a 4.7 µF bulk capacitor on the same net. The C8051F506-IM includes an internal 5 mA LDO for the core; decoupling at the VIO pin is required even when VIO = VDD. Connect the exposed pad (pin 32) directly to the ground plane with at least 5 thermal vias to reduce die-to-case thermal resistance.
C2D is a bidirectional open-drain pin - external 4.7 kΩ pull-up to VIO is required for in-system programming. RST must be pulled high via 4.7 kΩ; leaving it floating may cause spurious resets during cranking pulses. Do not exceed the absolute maximum supply voltage of 5.25 V even briefly during load-dump transients.
For CAN bus signals, route the differential pair (CAN_TX, CAN_RX to external transceiver) as a 100 Ω differential pair with no stubs and ground it via 120 Ω split termination at the bus ends. Keep LIN bus traces short and away from switching power traces; place the LIN ESD protection within 10 mm of the connector. The on-chip ADC channels are not multiplexed with LIN/CAN, so analog signals can be routed independently.
Estimated: at maximum +125 °C ambient and full 50 MHz operation with all peripherals enabled, junction-to-ambient thermal resistance for the 32-QFN 5x5 mm is approximately 35 °C/W on a 4-layer JEDEC test board. Designers planning continuous full-load operation should verify with silicon-specific characterization data from Silicon Labs, especially for sealed automotive enclosures with limited convection.
Informations de conformité
AEC-Q100 qualified per Silicon Labs product page. RoHS and REACH compliant per distributor listings. Halogen-free and lead-free per Silicon Labs material declarations.
