CMD243 - 26-35GHz GaAs Driver Amp, 15.5dB Gain | Qorvo
部品番号: CMD243 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
CMD243 概要
A driver amplifier MMIC is a semiconductor device that boosts signal power in an RF transmit chain, sitting between the upconverter or modulator and the final high-power amplifier. Within the power management hierarchy of an RF front end, the driver stage defines system linearity and noise contribution, and the CMD243 addresses the K/Ka/Q band segment used by satellite communications, point-to-point radio, and radar systems.
Key features include balanced amplifier architecture for good input and output return loss across the full 26-35 GHz band, +21 dBm P1dB output power that comfortably drives downstream power amplifiers, and a 4.4 dB noise figure that preserves the link budget of the receiver or transmitter chain. The die format enables integration directly into hybrid microwave assemblies, carrier-bonded modules, and hermetic packages.
Technically, the CMD243 is fabricated on Qorvo's GaAs pHEMT MMIC process with full passivation, which provides increased reliability and moisture protection compared with unpassivated die. The balanced topology uses 90-degree hybrids to split and recombine two parallel amplifier stages, improving both match stability and tolerance to bond-wire variation in assembly.
Typical applications include military and space communications systems, VSAT and satellite uplinks in Ka band, point-to-point microwave backhaul, and test instrumentation requiring broadband gain in the 26-35 GHz range where small size and high linearity are needed.
When designing with the CMD243 die, allow sufficient carrier area for bias routing and RF bond wires, and verify thermal dissipation at the +21 dBm output operating point. Exact bias conditions should be confirmed from the manufacturer datasheet before power-up.
This page synthesizes distributor availability, drop-in alternative guidance, and practical die-assembly design notes not found in the manufacturer datasheet.
ドロップイン代替品: CMD243 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
CMD242
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
CMD240
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
CMD243 最大定格＆電気的特性
| Product Type | GaAs MMIC Balanced Driver Amplifier |
| Frequency Range | 26 GHz to 35 GHz |
| Gain | 15.5 dB at 30 GHz |
| Output Power P1dB | +21 dBm at 30 GHz |
| Noise Figure | 4.4 dB at 30 GHz |
| Impedance | 50 ohm matched (RF ports) |
| Technology | GaAs MMIC, fully passivated |
| Package / Form Factor | Bare die |
| External DC Blocks Required | No (50 ohm matched design) |
| External RF Port Matching Required | No |
| Passivation | Full passivation for reliability and moisture protection |
| Application Focus | Military, space and communications systems |
| Frequency Bands | K, Ka, Q |
| Architecture | Balanced driver amplifier |
| 実装タイプ | Die attach / hybrid assembly |
CMD243 bare die ピン配置ガイド
CMD243 (bare die パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: CMD243.
詳細は データシート をご参照ください。
主な用途
CMD243 の用途: 6 件s: Ka-Band Satellite Communications, Military Radar and Electronic Warfare, Point-to-Point Microwave Backhaul, Test and Measurement Instrumentation, VSAT Ground Terminal Transmitters, Space Payload Communications Systems.
Ka-Band Satellite Communications
The CMD243 is ideally suited for satellite uplink and downlink chains operating in the 26-35 GHz Ka and Q band segments, where its +21 dBm P1dB output power and 15.5 dB gain at 30 GHz provide the linear drive levels required by solid-state power amplifiers. Its balanced 50 ohm matched architecture removes the need for external DC blocks and RF port matching, reducing hybrid module complexity. The fully passivated GaAs die offers the reliability and moisture protection demanded by space and ground-terminal hardware. Designers should verify bias conditions from the Qorvo datasheet and provide adequate carrier thermal spreading at the +21 dBm operating point.
おすすめ
Military Radar and Electronic Warfare
Military radar and EW front ends in the 26-35 GHz range benefit directly from the CMD243's combination of small die size and high linearity. The +21 dBm output 1 dB compression point at 30 GHz preserves waveform fidelity for phase-coded and chirped radar signals, while the 4.4 dB noise figure keeps receive-path contribution acceptable in shared-aperture architectures. Because the die is a 50 ohm matched design with full passivation, it integrates cleanly into hermetically sealed T/R modules where small size, repeatability, and environmental robustness drive the design. Bond-wire assembly into a controlled 50 ohm environment supports high-volume module production.
おすすめ
Point-to-Point Microwave Backhaul
Point-to-point backhaul radios in K, Ka and Q bands use the CMD243 as a linear driver between the upconverter and the transmit power amplifier. With 15.5 dB of gain and +21 dBm P1dB at 30 GHz, the die supplies enough drive for high-order QAM modulation where linearity directly determines error-vector-magnitude performance. The 50 ohm matched ports eliminate external DC blocks and matching networks, simplifying the RF board layout of compact outdoor-unit assemblies. Full passivation supports the harsh environmental profiles typical of tower-mounted equipment, and the die format allows integration into custom hybrid housings for size-constrained links.
おすすめ
Test and Measurement Instrumentation
Broadband instruments operating at 26-35 GHz, such as signal-generator output stages and BERT transmitters, use the CMD243 to lift signal levels to the +21 dBm class while adding only 4.4 dB of noise figure. The balanced architecture provides stable 50 ohm ports across the full band, which keeps calibration tables simple and flat across 26-35 GHz without external tuning. Because it is a bare-die MMIC, instrument manufacturers can bond the CMD243 directly onto microwave carriers inside custom housings, achieving size and thermal integration impossible with packaged alternatives. Verify bias settings and dissipation against the Qorvo CMD243 datasheet during module design.
おすすめ
VSAT Ground Terminal Transmitters
VSAT and earth-station terminals in Ka band require compact, linear drivers ahead of the block upconverter power stage. The CMD243 meets this need with 15.5 dB gain and +21 dBm P1dB at 30 GHz, providing the drive headroom and linearity for DVB-S2X-class modulation. The 50 ohm matched die needs no external DC blocks, which shortens the BOM and improves production repeatability of the transmit hybrid. Full passivation protects the GaAs die against moisture during module manufacturing and operation, a key reliability factor for outdoor terminals. Designers should confirm supply voltage and current per the manufacturer datasheet before assembly.
おすすめ
Space Payload Communications Systems
Spaceborne communication payloads at K and Ka band value the CMD243's small die size, high linearity, and fully passivated GaAs construction. Qorvo explicitly positions the part for space systems where small size and high linearity are needed. In a payload driver role, the +21 dBm P1dB at 30 GHz supports linear predistortion architectures ahead of traveling-wave-tube or solid-state power amplifiers, while the balanced topology tolerates bond-wire and assembly variation across flight lots. The die format suits hybrid microcircuit construction with hermetic sealing. Flight programs should request full space-grade screening data and bias derating guidance from Qorvo.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: CMD243 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | CMD242 | CMD240 |
|---|---|---|---|
| Package | Bare die | Bare die | Bare die |
| Brand | Qorvo | Qorvo | Qorvo |
| Impedance | 50 ohm matched | 50 ohm matched | 50 ohm matched |
| Passivation | Fully passivated | Fully passivated | Fully passivated |
主な差別化要因
- 50 ohm matched balanced design eliminates external matching （vs CMD242)
- Balanced architecture improves assembly tolerance （vs CMD240)
- Full passivation for moisture protection （vs CMD242)
設計ノート
Because the CMD243 is supplied as bare die, the module carrier defines the electrical interface. Use short, uniform bond wires on the RF ports; the die is a 50 ohm matched design, so any residual bond-wire inductance directly degrades return loss. Verify the die pad layout and bond configuration in the Qorvo CMD243 datasheet before finalizing the carrier artwork, and confirm bias routing current capacity for the operating point.
Estimated: at the +21 dBm P1dB output operating point the CMD243 dissipates a nontrivial amount of DC plus RF power on a small GaAs die, so carrier selection matters. Choose a thermally conductive carrier (e.g., metal-backed substrate or ceramic with heat spreader) and verify junction temperature against the datasheet maximum using the die thermal resistance. Do not rely on ambient convection alone for die-level products.
Two frequent mistakes with die MMICs: powering up before confirming polarity and bias sequence, and skipping ESD control during die handling. Confirm supply voltage, current, and any sequencing requirements from the Qorvo CMD243 datasheet before first power-on, and store and handle die in ESD-safe environments. Also confirm that full passivation is not damaged during die attach and bonding, since it provides the moisture protection.
コンプライアンス情報
Compliance status not stated in the verified web data. Contact Qorvo for RoHS/REACH material declarations for this bare-die MMIC.
