DSPIC30F2012T-20E/ML - 16-bit DSC 20 MIPS 12KB Flash | Microchip
部品番号: DSPIC30F2012T-20E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC30F2012T-20E/ML 概要
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. In the semiconductor hierarchy, the dsPIC30F family sits between general-purpose MCUs and dedicated DSPs, making it a power management and motor control workhorse within the broader embedded processor category. The 16-bit modified Harvard architecture executes most instructions in a single cycle with DSP multiply-accumulate support.
Key features of the DSPIC30F2012T-20E/ML include 20 MIPS instruction throughput at the -20E speed grade, a 12KB self-programmable FLASH program memory organized as 4K x 24-bit words, 1KB of on-chip SRAM data memory, and operation from a single 3.0V to 5.5V supply. The extended temperature grade (suffix -E) supports operation from -40C to +125C, enabling deployment in harsh industrial and automotive-adjacent environments. On-chip peripherals include a 10-bit ADC, UART, SPI, I2C, and motor-control PWM modules typical of the dsPIC30F series.
Architecturally, the dsPIC30F core integrates a 16-bit ALU with two 40-bit accumulators, hardware multiply and divide units, and a flexible interrupt structure. The C compiler toolchain (MPLAB XC-DSC) translates standard ANSI C into optimized DSC assembly, giving full access to hardware capabilities including DSP engine addressing modes.
Typical applications include industrial automation, motor control and power conversion, automotive subsystems, and consumer electronics, where the combination of DSP math capability and MCU peripherals reduces bill-of-materials complexity compared to separate MCU-plus-DSP solutions.
When designing with this device, budget FLASH and RAM carefully: 12KB of program memory and 1KB of RAM are sufficient for sensor and motor-control firmware but require optimization for complex protocol stacks.
This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: DSPIC30F2012T-20E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC30F2012T-20E/ML （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Core Architecture, Supply Voltage, Program Memory.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC30F2012-20E/ML
✅ ドロップイン✓ 在庫あり
$3.92 / 個
データシートを見る →DSPIC30F2012T-20I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC30F2012T-30I/ML
✅ ドロップイン✓ 在庫あり
$3.74 / 個
データシートを見る →DSPIC30F2011T-20E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.68 / 個
データシートを見る →DSPIC30F3012T-20E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.75 / 個
データシートを見る →DSPIC30F2012T-20E/ML 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC30F (modified Harvard) |
| Instruction Rate | 20 MIPS |
| Program Memory | 12 KB (4K x 24) FLASH |
| Data Memory (RAM) | 1 KB |
| 電源電圧 | 3.0 V to 5.5 V |
| 動作温度 | -40C to +125C (E grade) |
| パッケージ | 28-QFN (6x6 mm) |
| 実装タイプ | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
| Product Family | dsPIC 30F Digital Signal Controller |
| Toolchain | MPLAB XC-DSC C/C++ Compiler, MPLAB IDE |
| ピン数 | 28 |
| On-chip Peripherals | 10-bit ADC, UART, SPI, I2C, PWM (per family datasheet) |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
DSPIC30F2012T-20E/ML ピン構成
| ピン 1 | MCLR — Master clear reset, programming voltage input |
| ピン 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / ADC positive reference / change notification / port B |
| ピン 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / ADC negative reference / change notification / port B |
| ピン 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select / port B |
| ピン 5 | AN3/INDX/CN5/RB3 — Analog input 3 / QEI index input / port B |
| ピン 6 | AN4/QEA/IC7/CN6/RB4 — Analog input 4 / QEI phase A / capture 7 / port B |
| ピン 7 | AN5/QEB/IC8/CN7/RB5 — Analog input 5 / QEI phase B / capture 8 / port B |
| ピン 8 | VSS — Ground reference |
| ピン 9 | OSC1/CLKI — Oscillator crystal input / external clock input |
| ピン 10 | OSC2/CLKO/RC15 — Oscillator crystal output / clock output / port C |
| ピン 11 | SOSCI/T2CK/CN1/RC13 — Secondary oscillator input / Timer2 external clock / port C |
| ピン 12 | SOSCO/T1CK/CN0/RC14 — Secondary oscillator output / Timer1 external clock / port C |
| ピン 13 | VDD — Positive supply (3.0V to 5.5V) |
| ピン 14 | AN6/OCFA/RB6 — Analog input 6 / PWM fault A input / port B |
| ピン 15 | AN7/RB7 — Analog input 7 / port B |
| ピン 16 | AN8/RB8 — Analog input 8 / port B |
| ピン 17 | AN9/RB9 — Analog input 9 / port B |
| ピン 18 | AN10/RB10 — Analog input 10 / port B |
| ピン 19 | AN11/RB11 — Analog input 11 / port B |
| ピン 20 | PGD/EMUD/U1TX/SDO1/CN8/RB6 — In-circuit debug data / UART1 transmit / SPI1 data out / port B |
| ピン 21 | PGC/EMUC/U1RX/SDI1/CN9/RB7 — In-circuit debug clock / UART1 receive / SPI1 data in / port B |
| ピン 22 | SCL/CN10/RC14 — I2C clock input/output / port C |
| ピン 23 | SDA/CN11/RC13 — I2C data input/output / port C |
| ピン 24 | AN12/RB12 — Analog input 12 / port B |
| ピン 25 | U1ATX/SDO1/CN12/RB13 — Alternate UART1 transmit / SPI1 data out / port B |
| ピン 26 | U1ARX/SDI1/CN13/RB14 — Alternate UART1 receive / SPI1 data in / port B |
| ピン 27 | TCK/CN14/RB15 — Timer clock input / port B |
| ピン 28 | AVDD — Analog supply for ADC (connect to VDD with filtering) |
主な用途
DSPIC30F2012T-20E/ML の用途: 6 件s: Industrial Motor Control, Power Conversion and Digital Power Supplies, Industrial Automation and Sensor Nodes, Automotive and Transportation Subsystems, Consumer Electronics and Appliances, Embedded Signal Processing and Data Acquisition.
Industrial Motor Control
The DSPIC30F2012T-20E/ML fits sensor-based FOC and trapezoidal motor drives because its 16-bit DSP engine with hardware multiply-accumulate and dual 40-bit accumulators executes PI current loops efficiently at 20 MIPS, while the on-chip 10-bit ADC samples phase currents and bus voltage. In a typical topology the DSC generates the PWM drive for a three-phase inverter, reads current feedback through the ADC each PWM cycle, and executes the control algorithm in firmware. The extended -40C to +125C operating range tolerates the elevated ambient inside industrial drive enclosures. Design consideration: with only 1KB of SRAM, keep control-loop state variables lean; if faster current loops are needed, the pin-compatible 30 MIPS DSPIC30F2012T-30I/ML doubles PWM effective resolution without a PCB change.
おすすめ
Power Conversion and Digital Power Supplies
Digital SMPS and PFC stages benefit from the DSPIC30F2012T-20E/ML's deterministic 20 MIPS single-cycle execution and DSP MAC support, which keep voltage-mode or average-current-mode control loops jitter-free. The 10-bit ADC provides feedback conversion synchronized to the PWM period, and the 3.0V to 5.5V supply range allows direct interfacing with both 3.3V and 5V analog front ends. Firmware-based control enables soft-start, nonlinear gain scheduling, and protection sequencing that analog controllers cannot easily replicate. The 12KB FLASH accommodates control law, compensation tables, and fault handling with room to spare. Watch thermal design: the 28-QFN 6x6 package needs adequate ground plane copper for heat spreading when the part sits near hot power stages within its -40C to +125C rating.
おすすめ
Industrial Automation and Sensor Nodes
In factory automation nodes, the DSPIC30F2012T-20E/ML combines UART, SPI, and I2C serial connectivity with enough DSP capability for on-node filtering, RMS computation, and FFT-based vibration analysis. Its extended -40C to +125C temperature rating survives control-cabinet heat, and the 5V-tolerant supply range matches legacy industrial sensor signaling, reducing level-shifting components. The ICSP interface permits field firmware updates of the 12KB FLASH without removing the board from service. With 1KB of RAM, streaming protocols should be kept minimal; choose this part when signal processing plus rugged I/O matters more than large buffers. The small 6x6 mm QFN footprint suits dense I/O module PCBs and retrofit sensor boards.
おすすめ
Automotive and Transportation Subsystems
The -E extended temperature grade (-40C to +125C) of the DSPIC30F2012T-20E/ML addresses under-hood-adjacent and body-electronics environments where standard industrial parts cannot survive. Typical roles include actuator control, pump and fan controllers, and sensor conditioning where the DSP engine handles calibration curves and filtering at 20 MIPS. The 3.0V to 5.5V supply range tolerates regulated-rail variation, and ICSP supports end-of-line programming of the 12KB FLASH. Note this commercial-grade part is not AEC-Q100 qualified: for applications with formal automotive qualification requirements, verify the appropriate Microchip automotive-qualified dsPIC variant rather than substituting. Thermal margin should be verified at the module level given enclosure heat soak.
おすすめ
Consumer Electronics and Appliances
Appliance and consumer product designs use the DSPIC30F2012T-20E/ML where a single low-cost DSC replaces separate MCU and analog control circuitry: BLDC fans, pumps, heaters, and small motor drives. At 20 MIPS with hardware multiply, sensorless back-EMF commutation and temperature compensation run comfortably, and the 12KB FLASH plus 1KB RAM hold application logic and control firmware. Tape-and-reel packaging supports high-volume SMT assembly of the compact 28-QFN (6x6 mm) footprint. The 5.5V maximum supply suits direct operation from unregulated low-voltage DC rails common in appliances. For consumer cost-optimized builds operating below 85C, the industrial-grade DSPIC30F2012T-20I/ML offers the same silicon at typically lower unit price.
おすすめ
Embedded Signal Processing and Data Acquisition
Compact data-acquisition front ends leverage the DSPIC30F2012T-20E/ML's 10-bit ADC and DSP MAC instructions for real-time digital filtering, envelope detection, and event classification at 20 MIPS, streaming results over UART, SPI, or I2C. The extended -40C to +125C range supports outdoor and industrial monitoring nodes, while the 6x6 mm QFN keeps probe and sensor PCBs small. Firmware stored in 12KB FLASH can hold filtering pipelines plus a communication protocol; DSP library routines from Microchip accelerate FIR/IIR implementation. The main constraint is the 1KB SRAM, which limits block-processing buffer sizes - use sample-by-sample filtering for longer filters or migrate to the pin-compatible, larger-memory DSPIC30F3012 variant if buffers must grow.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC30F2012T-20E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC30F2012-20E/ML | DSPIC30F2012T-20I/ML | DSPIC30F2012T-30I/ML | DSPIC30F2011T-20E/ML | DSPIC30F3012T-20E/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Instruction Rate | 20 MIPS | 20 MIPS | 20 MIPS | 30 MIPS | 20 MIPS | 20 MIPS |
| Program Memory | 12 KB (4K x 24) FLASH | 12 KB (4K x 24) FLASH | 12 KB (4K x 24) FLASH | 12 KB (4K x 24) FLASH | 12 KB (4K x 24) FLASH | 24 KB FLASH (larger) |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| Peripheral Emphasis | General-purpose ADC + standard serial | Identical to this product | Identical to this product | Identical to this product (faster clock) | Motor-control PWM oriented (ADC differs) | General-purpose, larger memory |
| Packaging Option | Tape & Reel (T) | Tube / Tray | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
主な差別化要因
- Extended temperature range within the same die （vs DSPIC30F2012T-20I/ML)
- Speed headroom option without PCB change （vs DSPIC30F2012T-20E/ML itself vs DSPIC30F2012T-30I/ML)
- Tape-and-reel supply for automated assembly （vs DSPIC30F2012-20E/ML)
- ADC-equipped general-purpose variant （vs DSPIC30F2011T-20E/ML)
設計ノート
Decouple VDD and AVDD independently: place a 0.1 uF ceramic capacitor at each VDD pin and a separate 0.1 uF plus small ferrite feeding AVDD to keep ADC reference noise low. The device accepts 3.0V to 5.5V, but noise on AVDD directly degrades 10-bit ADC accuracy - route analog supply as a star branch from the main regulator rather than sharing long traces with PWM-driven loads. Estimated: a 100 mA worst-case core/peripheral current from a 5V rail dissipates only 0.5 W internally, well within QFN capability, so thermal design is usually dominated by board ambient, not self-heating.
The 28-QFN (6x6) footprint requires careful pad geometry: follow the Microchip QFN land-pattern recommendation with thermal vias under the center pad tied to a solid ground plane. Use at least 4-6 vias (0.3 mm drill) under the exposed pad to improve grounding and heat spreading. Keep the crystal (OSC1/OSC2) loop short with guard ground, and route PGD/PGC programming traces to a header even in production boards - ICSP access enables field updates of the 12KB FLASH and dramatically reduces rework cost during development bring-up.
Verify the temperature suffix against your thermal environment before finalizing the BOM: -20E parts are rated to +125C but cost more, while -20I parts stop at +85C. Also confirm memory headroom - 12KB FLASH and 1KB RAM fill quickly with DSP filter libraries plus a serial protocol stack; compile with map-file review early. Do not assume peripheral interchangeability across the family: the dsPIC30F2011 in the same QFN swaps the ADC emphasis for motor-control PWM, so code written for the 30F2012 will not run unchanged on the 30F2011.
When driving motor-control PWM or fast SPI edges from this 5V-capable DSC, control edge rates and series-terminate long traces to limit ringing and EMI. The QFN package has low lead inductance, which produces fast edges - good for timing margin but noisy if traces are unterminated. Keep PWM outputs away from analog inputs AN0-AN12 on the layout, and use the change-notification (CN) inputs with debounce in firmware rather than relying on external RC filters alone for switch inputs.
コンプライアンス情報
Formal RoHS/REACH/lead-free status for this specific orderable code was not captured in the verified data snapshot; confirm via Microchip's official compliance documentation. This commercial-grade device is not AEC-Q100 qualified (automotive-qualified variants would carry a Q1-type designation).
