TDA3MV - ADAS Vision SoC | Texas Instruments | Low Power
部品番号: TDA3MV ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29 | $29,000.00 |
TDA3MV 概要
An ADAS SoC is a specialized processor that combines general-purpose CPU cores, digital signal processing (DSP), and dedicated hardware accelerators to handle real-time sensor data from cameras, radar, and lidar. It sits within the broader automotive electronics hierarchy, bridging raw sensor input to actionable driving decisions, and is a critical component in the evolution toward autonomous driving.
Key features include a heterogeneous architecture with multiple processing cores, integrated imaging and vision accelerators, and support for multiple camera inputs. The device is engineered for low power operation, making it suitable for battery-operated and thermally constrained automotive environments. Its 15mm package with ABF substrate ensures reliable operation across the automotive temperature range.
Technically, the TDA3MV leverages TI's advanced process technology to balance performance and power efficiency. The vision acceleration hardware offloads compute-intensive tasks such as object detection and lane departure warning, freeing the CPU for higher-level decision making. The SoC supports secure boot and hardware-enforced isolation, critical for functional safety in automotive systems.
Typical applications include front camera systems, driver monitoring, surround view, and sensor fusion units. The low power profile is particularly advantageous for always-on ADAS features that must operate continuously without excessive thermal load.
When designing with the TDA3MV, engineers should consider the power delivery network and thermal management, as the SoC's performance is directly tied to adequate supply decoupling and heat dissipation. Reference designs from TI provide guidance on optimal layout and component selection.
ドロップイン代替品: TDA3MV — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
TDA3MVRBFABFRQ1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TDA3LX
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TDA3XE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TDA3MA
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TDA3MB
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TDA3MV 仕様
| Core Architecture | ARM Cortex-A15 + DSP + Vision Accelerator |
| パッケージ | FCBGA 15mm (ABF substrate) |
| Silicon Revision | 2.0 |
| 動作温度範囲 | -40C to +125C |
| Supply Voltage (Core) | 0.9V to 1.1V (AVS) |
| I/O Buffer Voltage | 1.8V (VDDS18V) |
| DDR Interface | DDR3/DDR3L |
| Camera Interface | MIPI CSI-2 |
| Vision Acceleration | Embedded Vision Engine (EVE) |
| Security | Secure boot, hardware-enforced isolation |
| Power Management | Multiple power domains, AVS |
| Functional Safety | Supports ASIL-B |
| RoHS | Compliant |
| AEC-Q100 | Qualified (Q1 variant) |
| 実装タイプ | Surface Mount |
TDA3MV ピン構成
| ピン A1 | VDD — Core supply voltage |
| ピン A2 | VSS — Ground |
| ピン B1 | VDDS18V — 1.8V I/O supply |
| ピン C1 | VDDA_ADC — ADC analog supply |
| ピン D1 | VDDA_CSI — CSI analog supply |
| ピン E1 | VDDA_DAC — DAC analog supply |
| ピン F1 | VDDA_DDR_DSP — DDR DSP analog supply |
| ピン G1 | VDDA_GMAC_CORE — GMAC core analog supply |
| ピン H1 | VDDA_OSC — Oscillator analog supply |
| ピン J1 | VDDA_PER — Peripheral analog supply |
| ピン K1 | VDDS_DDR1 — DDR1 supply |
| ピン L1 | VDDS_DDR2 — DDR2 supply |
| ピン M1 | VDDS_DDR3 — DDR3 supply |
| ピン N1 | VDD_DSPEVE — DSPEVE AVS supply |
| ピン P1 | VDDSHV1 — High-voltage I/O supply 1 |
| ピン R1 | VDDSHV2 — High-voltage I/O supply 2 |
主な用途
TDA3MV の用途: 6 件s: Front Camera Systems, Driver Monitoring Systems, Surround View Systems, Sensor Fusion Units, Battery-Operated Surveillance Cameras, Automotive Vision Processing.
Front Camera Systems
The TDA3MV is ideal for front camera systems in ADAS, providing real-time processing for object detection, lane departure warning, and traffic sign recognition. Its low power consumption and vision acceleration enable continuous operation in thermally constrained environments. The SoC supports multiple camera inputs via MIPI CSI-2, ensuring high-bandwidth data capture. With secure boot and hardware isolation, it meets functional safety requirements for automotive applications.
おすすめ
Driver Monitoring Systems
The TDA3MV excels in driver monitoring systems, using its vision accelerators to analyze driver behavior in real-time. Its low power profile is crucial for always-on operation, and the integrated DSP handles complex algorithms for eye tracking and drowsiness detection. The SoC's secure boot ensures data integrity, while its compact 15mm package fits space-constrained designs. This enables reliable, continuous monitoring without excessive thermal load.
おすすめ
Surround View Systems
The TDA3MV supports surround view systems by processing multiple camera feeds simultaneously, providing a 360-degree view around the vehicle. Its vision acceleration hardware efficiently handles image stitching and object detection, while the low power consumption allows continuous operation. The SoC's multiple MIPI CSI-2 interfaces enable connection to four or more cameras, and its secure boot protects against tampering. This makes it ideal for parking assistance and collision avoidance.
おすすめ
Sensor Fusion Units
The TDA3MV is well-suited for sensor fusion units that combine data from cameras, radar, and lidar. Its heterogeneous architecture with DSP and vision accelerators enables real-time fusion of diverse sensor inputs, while low power consumption is essential for continuous operation. The SoC supports multiple interfaces for sensor connectivity, and its secure boot ensures reliable operation. This enables advanced ADAS features like adaptive cruise control and automatic emergency braking.
おすすめ
Battery-Operated Surveillance Cameras
The TDA3MV is an excellent choice for battery-operated surveillance cameras due to its low power consumption and vision acceleration. It can process video streams locally, reducing the need for constant wireless transmission, thus extending battery life. The SoC's compact package and wide temperature range make it suitable for outdoor use. Its secure boot protects against unauthorized access, ensuring data security in surveillance applications.
おすすめ
Automotive Vision Processing
The TDA3MV is designed for automotive vision processing, handling tasks like lane keeping assist and traffic sign recognition. Its integrated vision accelerators offload compute-intensive algorithms, freeing the CPU for decision-making. The low power consumption is critical for reducing heat in the vehicle cabin, and the secure boot ensures functional safety. The SoC's 15mm package is compact, fitting into small ECU designs, and supports multiple camera inputs for comprehensive vision coverage.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TDA3MV — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TDA3MVRBFABFRQ1 | TDA3LX | TDA3XE |
|---|---|---|---|---|
| Package | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) | FCBGA 15mm (ABF) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Automotive Grade | No (standard) | Yes (AEC-Q100) | No | No |
| Vision Acceleration | Yes | Yes | Yes | Enhanced |
| Power Consumption | Low | Low | Medium | Medium |
| Security Features | Secure boot, hardware isolation | Secure boot, hardware isolation | Secure boot | Secure boot, hardware isolation |
主な差別化要因
- Low power consumption for ADAS SoC （vs TDA3LX)
- Automotive-grade variant available （vs TDA3LX)
- Integrated vision acceleration （vs TDA3LX)
設計ノート
The TDA3MV requires multiple power rails with specific sequencing. Use a dedicated PMIC or discrete regulators to provide core, I/O, and analog supplies. Ensure proper decoupling with 100nF and 10uF capacitors close to each power pin. Follow TI's recommended power-up sequence to avoid latch-up or damage.
The TDA3MV's power dissipation depends on workload. For continuous operation, ensure adequate heat sinking or airflow. The 15mm FCBGA package has a thermal resistance that requires a thermal vias and copper pour on the PCB. Use TI's thermal design guidelines to keep junction temperature below 125C.
For high-speed interfaces like MIPI CSI-2 and DDR3, maintain controlled impedance and minimize trace lengths. Use ground planes and proper termination. Place the SoC close to memory and camera connectors to reduce signal integrity issues. Follow TI's layout recommendations in the datasheet.
コンプライアンス情報
RoHS compliant per TI product page. AEC-Q100 qualified variant available as TDA3MVRBFABFRQ1.
