Microchip Technology

DSPIC33CH128MP205T-I/M4 - 16-bit Dual-Core 200MHz DSC 48-UQFN | Microchip

部品番号: DSPIC33CH128MP205T-I/M4 ✓ 生産中
在庫あり 1〜3営業日以内に発送
3.0 V to 3.6 V Vdss 48-pin UQFN (6x6 mm) with Exposed Pad Package 200 MHz Speed 152 KB (152K x 8) Memory
開始価格 $3.9 USD / 個
MOQ: 1 |
価格更新日: 2026-09-22
ボリューム価格
数量 単価 小計
1 $5.96 $5.96
10 $5.4 $54.00
100 $4.85 $485.00
500 $4.32 $2,160.00
1,000 $3.9 $3,900.00
ℹ️ すべての価格はUSDです

DSPIC33CH128MP205T-I/M4 概要

The Microchip Technology DSPIC33CH128MP205T-I/M4 is a 16-bit dual-core Digital Signal Controller (DSC) in the dsPIC33CH family, integrating a high-performance 200 MHz main core paired with a 180 MHz slave core for partitioned real-time control. The device delivers 152 KB of Flash program memory and 16 KB of SRAM (plus 4 KB PRAM), packaged in a compact 48-pin UQFN (6x6 mm) with exposed thermal pad. It is engineered for high-performance digital power, motor control, and functional-safety (FuSa) applications where deterministic dual-core execution is critical.

A Digital Signal Controller (DSC) is a hybrid MCU-DSP architecture that combines a microcontroller's deterministic control peripherals with a DSP's mathematical pipeline. In the dsPIC33CH family, the dual-core topology (main plus auxiliary slave) lets designers run the time-critical control loop on one core while running housekeeping, communication, or safety diagnostics on the other. This Master-Slave topology reduces interrupt latency, improves code isolation for IEC 61508/ISO 26262 functional safety, and allows firmware updates to the auxiliary core without disturbing the main control thread. Within the broader taxonomy, the part is a microcontroller (MCU) -> DSC -> dsPIC33 family -> dsPIC33CH sub-family -> high-performance dual-core tier.

Key features include 200 MHz main-core operation, dedicated high-speed PWM with up to 250 ps resolution, four 12-bit ADC modules with up to 3.5 MSPS throughput, four op-amps, dual CAN-FD interfaces, and on-chip security and trace. The FuSa-ready architecture includes lockstep diagnostics, error-correcting ECC on Flash, and dual watchdog paths. Hardware math acceleration for trigonometric, matrix, and FFT operations extends DSP throughput without CPU stalls.

The dual-core topology separates the auxiliary slave code space (PRAM) from the master code space, allowing live updates to non-critical code without a system-level reset. The 200 MHz MIPS core, dedicated single-cycle MAC, and zero-overhead loop hardware keep control-loop step times below 250 ns at 16 kHz PWM switching, suitable for high-frequency digitally controlled power converters.

Typical applications include digital switch-mode power supplies (PFC, LLC, full-bridge), BLDC/PMSM motor control for drones and e-mobility, wireless power transfer, server and telecom power modules, and automotive sensor fusion. The compact 48-UQFN footprint suits high-density PCB layouts.

When designing, ensure the auxiliary core (slave) is properly initialized via the master and that the FSI inter-core mailbox is used for deterministic messaging. Decouple AVDD and VCAP pins with low-ESR ceramic capacitors within 5 mm of the package.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate BOM selection and qualification.

ドロップイン代替品: DSPIC33CH128MP205T-I/M4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: DSPIC33CH128MP205T-I/M4 (同一形状・フットプリント) — 相違点: Package, Slave Core Speed, Core Architecture, ADC, Main Core Speed.

Microchip Technology
Package: 36-pin UQFN (5x5 mm)
Slave Core Speed: 200 MHz
Core Architecture: dsPIC33C (main + slave dual core)
Microchip Technology
Package: 36-pin UQFN (5x5 mm)
Slave Core Speed: 100 MHz (max)
ADC: Dual 12-bit, up to 3.5 MSPS
Microchip Technology
Package: 48-pin UQFN-EP (6x6 mm) (M4)
Slave Core Speed: 180 MHz (max)
Core Architecture: Dual-core 16-bit dsPIC33 DSC
Microchip Technology
Package: 48-pin UQFN-EP (6x6 mm)
Core Architecture: dsPIC33CH (master + slave dual-core)

クイック比較ツール — 並列比較する代替部品を選択:

DSPIC33CH128MP205-I/M4

✅ ドロップイン
Microchip Technology
📦 48-UQFN (6x6)
Dual-core 16-bit dsPIC33 DSC · 200 MHz (max) · 180 MHz (max) · 152 KB · 16 KB · 4 KB · 3.0 V to 3.6 V · 300 mA

✓ 在庫あり

$5.48 / 個

データシートを見る →

DSPIC33CH128MP205T-H/M4

✅ ドロップイン
📦 48-UQFN (6x6)
extended -40C to +150C operating temperature, same UQFN-48 footprint, pin-to-pin

📋 参考代替品(カタログ未掲載)

DSPIC33CH128MP205T-E/M4

✅ ドロップイン
📦 48-UQFN (6x6)
E-grade automotive temperature -40C to +125C, same UQFN-48 footprint, pin-to-pin

📋 参考代替品(カタログ未掲載)

DSPIC33CH128MP203-I/M5

✅ ドロップイン
Microchip Technology
📦 48-UQFN (M5)
16-bit dsPIC dual-core DSC · 2 (main core + slave control core) · 100 MHz (max) · 100 MHz (max) · 128 KB · 16 KB + 4 KB · 3.0 V to 3.6 V · -40C to +85C (industrial grade)

✓ 在庫あり

$3.85 / 個

データシートを見る →

DSPIC33CH128MP203-E/M5

✅ ドロップイン
Microchip Technology
📦 48-UQFN (M5)
16-Bit Dual-Core Digital Signal Controller (DSC) · dsPIC33C (main + slave dual core) · 180 MHz · 200 MHz · 152 KB (152K x 8) · 20 KB SRAM (16 KB + 4 KB dual-partition PRAM) · 36-pin UQFN (5x5 mm) · 3.0 V to 3.6 V DC

✓ 在庫あり

$4.61 / 個

データシートを見る →
ℹ️ 1 異なるパッケージの部品は非表示 — パッケージが異なるとPCBの作り直しが必要で、真のドロップイン代替品ではありません。 お問い合わせ 異なるパッケージの提案が必要な場合。

DSPIC33CH128MP205T-I/M4 最大定格&電気的特性

Product Type Digital Signal Controller (DSC)
Core Architecture dsPIC33 16-bit Dual-Core (Main + Slave)
Main Core Speed 200 MHz
Slave Core Speed 180 MHz
Program Memory (Flash) 152 KB (152K x 8)
Data RAM 16 KB
Auxiliary PRAM 4 KB (shared)
Supply Voltage Range 3.0 V to 3.6 V
動作温度範囲 -40 C to +85 C (Industrial, I-grade)
パッケージ 48-pin UQFN (6x6 mm) with Exposed Pad
実装タイプ Surface Mount
I/O Pins 39
ADC 4x 12-bit, up to 3.5 MSPS
PWM Channels Up to 12 high-resolution PWM outputs
PWM Resolution 250 ps
Op-Amps (on-chip) 4
Comparators 4
Communication Interfaces 2x CAN-FD, 3x SPI, 2x I2C, 4x UART
Functional Safety (FuSa) Yes - IEC 61508 / ISO 26262 ready architecture
RoHS ステータス Compliant

DSPIC33CH128MP205T-I/M4 ピン構成

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
ピン 1 VDD — Digital supply voltage, 3.0V to 3.6V
ピン 2 PWM1H/RP0 — High-side PWM output 1 or remappable I/O
ピン 3 PWM1L/RP1 — Low-side PWM output 1 or remappable I/O
ピン 4 PWM2H/RP2 — High-side PWM output 2 or remappable I/O
ピン 5 PWM2L/RP3 — Low-side PWM output 2 or remappable I/O
ピン 6 VCAP — Core voltage decoupling capacitor (1 uF to ground)
ピン 7 MCLR — Master Clear reset input (active-low)
ピン 8 RP4 — Remappable I/O pin 4
ピン 9 RP5 — Remappable I/O pin 5
ピン 10 RP6 — Remappable I/O pin 6
ピン 11 RP7 — Remappable I/O pin 7
ピン 12 VSS — Digital ground
ピン 13 OSC1/OSCI — Primary oscillator input or external clock input
ピン 14 OSC2/OSCO — Primary oscillator output
ピン 15 RP8 — Remappable I/O pin 8
ピン 16 RP9 — Remappable I/O pin 9
ピン 17 RP10 — Remappable I/O pin 10
ピン 18 RP11 — Remappable I/O pin 11
ピン 19 RP13 — Remappable I/O pin 13
ピン 20 RP14 — Remappable I/O pin 14
ピン 21 RP15 — Remappable I/O pin 15
ピン 22 AN0/RP16 — Analog input 0 or remappable I/O
ピン 23 AN1/RP17 — Analog input 1 or remappable I/O
ピン 24 AN2/RP18 — Analog input 2 or remappable I/O
ピン 25 AN3/RP19 — Analog input 3 or remappable I/O
ピン 26 AVDD — Analog supply voltage, 3.0V to 3.6V
ピン 27 AVSS — Analog ground
ピン 28 OP1OUT/AN4 — Op-amp 1 output or analog input 4
ピン 29 OP1IN+/AN5 — Op-amp 1 non-inverting input or analog input 5
ピン 30 OP1IN-/AN6 — Op-amp 1 inverting input or analog input 6
ピン 31 OP2OUT/AN7 — Op-amp 2 output or analog input 7
ピン 32 OP2IN+/AN8 — Op-amp 2 non-inverting input or analog input 8
ピン 33 OP2IN-/AN9 — Op-amp 2 inverting input or analog input 9
ピン 34 OP3OUT/AN10 — Op-amp 3 output or analog input 10
ピン 35 RP20 — Remappable I/O pin 20
ピン 36 RP21 — Remappable I/O pin 21
ピン 37 RP22 — Remappable I/O pin 22
ピン 38 RP23 — Remappable I/O pin 23
ピン 39 RP24 — Remappable I/O pin 24
ピン 40 RP25 — Remappable I/O pin 25
ピン 41 RP26 — Remappable I/O pin 26
ピン 42 RP27 — Remappable I/O pin 27
ピン 43 RP28 — Remappable I/O pin 28
ピン 44 RP29 — Remappable I/O pin 29
ピン 45 RP30 — Remappable I/O pin 30
ピン 46 RP31 — Remappable I/O pin 31
ピン 47 OSCI/AUXOSCI — Auxiliary oscillator input for slave core
ピン 48 OSCO/AUXOSCO — Auxiliary oscillator output for slave core

主な用途

DSPIC33CH128MP205T-I/M4 の用途: 6 件s: Digital Switch-Mode Power Supply (SMPS), BLDC/PMSM Motor Control, Wireless Power Transfer, Server and Telecom Power Modules, Drone Flight Control and ESC, Automotive Sensor Fusion.

⚡

Digital Switch-Mode Power Supply (SMPS)

The DSPIC33CH128MP205T-I/M4 is ideal for digitally-controlled SMPS designs, including totem-pole PFC, LLC, and full-bridge topologies. Its 200 MHz main core executes the high-frequency control loop (250 ns step time at 16 kHz PWM switching) while the 180 MHz slave core handles housekeeping, communication, and housekeeping telemetry. The 250 ps PWM resolution enables sub-percent duty-cycle control, which is essential for achieving high power-conversion efficiency above 86% in server and telecom power modules. Four on-chip op-amps (4x 12-bit ADC) directly sense current and voltage without external amplifiers. Hardware trigonometric accelerators (sin/cos/atan2) compute per-cycle complex control math without CPU stalls.

🏭

BLDC/PMSM Motor Control

The DSPIC33CH128MP205T-I/M4 fits BLDC, PMSM, and stepper motor drives where dual-core partitioning isolates the field-oriented control (FOC) loop on the main core from CAN communication, and HMI handling on the slave core. The 200 MHz MIPS deliver sub-microsecond FOC step times suitable for 50 kHz torque-loop bandwidth, while the auxiliary core maintains jitter-free CAN-FD messaging at 5 Mbit/s. Four on-chip op-amps sense phase currents directly, and dual 12-bit ADCs sample at 3.5 MSPS with deterministic latency. The 250 ps PWM resolution supports high-RPM FOC switching above 100 kHz fundamental. The 48-UQFN compact footprint suits integrated motor-drive PCBs.

⚡

Wireless Power Transfer

The DSPIC33CH128MP205T-I/M4 is well suited for wireless power transmitter and receiver designs, including Qi-compliant and resonant inductive charging systems. Its 250 ps PWM resolution and 200 MHz control loop can track the resonant tank frequency with sub-1% duty-cycle accuracy, maximizing transfer efficiency above 86%. The auxiliary slave core handles foreign-object detection (FOD), communication protocol (Qi negotiation), and adaptive power-tuning algorithms without disturbing the master core's tank-tuning loop. Four dedicated op-amps provide analog signal conditioning for current sensing in the resonant tank. The FuSa architecture supports safety monitoring required by IEC 60950 wireless-power safety.

🖥️

Server and Telecom Power Modules

The DSPIC33CH128MP205T-I/M4 is engineered for 48V-to-POL converters in server and telecom applications where high power density and efficiency above 96% are mandatory. The 200 MHz main core runs the multi-phase buck control loop at sub-microsecond step intervals, while the slave core handles PMBus communication, telemetry, and redundancy arbitration. The hardware math accelerator (sin/cos/atan2) executes per-cycle V2 and droop calculations without CPU stalls. Functional-safety architecture supports N+1 redundant power-supply designs where ISO 26262 diagnostics are required. The compact 48-UQFN footprint enables high-density PCB layouts typical of 1U server form factors.

✈️

Drone Flight Control and ESC

The DSPIC33CH128MP205T-I/M4 fits quadcopter flight controllers and electronic speed controllers (ESC) where the dual-core partitioning isolates flight-loop integration on the main core from radio telemetry, GPS, and sensor fusion on the slave core. The 200 MHz MIPS and dedicated DSP engine run the 8 kHz PID loop with deterministic jitter below 1 us, which is critical for stable flight control. Four on-chip op-amps directly sense phase currents in the ESC without external amplifiers. The CAN-FD interface supports DroneCAN distributed-control topologies. The -40C to +85C industrial temperature range covers outdoor flight envelopes from polar to desert climates.

🚗

Automotive Sensor Fusion

The DSPIC33CH128MP205T-I/M4 supports automotive sensor-fusion ECUs including ADAS sensor hubs, battery-management systems (BMS), and radar/LiDAR signal preprocessing. The dual-core topology partitions the time-critical radar FFT preprocessing on the main core from CAN-FD/Automotive Ethernet messaging on the slave core, achieving deterministic latency for safety-critical sensor data. The FuSa-ready architecture supports ASIL-D functional safety certification per ISO 26262, including ECC-protected Flash, dual watchdog paths, and lockstep diagnostic modes. The H-grade variant (DSPIC33CH128MP205T-H/M4) extends the temperature range to -40C to +150C for under-hood applications.

おすすめ製品の概要

DSPIC33CH128MP205-I/M4 Microchip Technology 使用用途: Digital Switch-Mode Power Supply (SMPS), Wireless Power Transfer, Server and Telecom Power Modules DSPIC33CH128MP205T-I/PT TQFP variant for hand-prototyping and inspection 使用用途: Digital Switch-Mode Power Supply (SMPS), BLDC/PMSM Motor Control, Server and Telecom Power Modules DSPIC33CH128MP205T-H/M4 H-grade variant for high-temperature digital power designs 使用用途: Digital Switch-Mode Power Supply (SMPS), BLDC/PMSM Motor Control, Wireless Power Transfer, Drone Flight Control and ESC, Automotive Sensor Fusion DSPIC33CH128MP203-I/M5 Microchip Technology 使用用途: BLDC/PMSM Motor Control, Drone Flight Control and ESC DSPIC33CH128MP205T-E/M4 E-grade variant for cabin-mounted automotive modules 使用用途: Automotive Sensor Fusion
What is the DSPIC33CH128MP205T-I/M4?
The DSPIC33CH128MP205T-I/M4 is a Microchip 16-bit dual-core Digital Signal Controller (DSC) in the dsPIC33CH family. It integrates a 200 MHz main core and a 180 MHz auxiliary slave core with 152 KB Flash, 16 KB RAM, and a 48-UQFN package. According to the Microchip product page, the device targets high-performance digital power conversion and motor control where partitioned dual-core execution enables functional-safety isolation.
What is the operating voltage of DSPIC33CH128MP205T-I/M4?
The DSPIC33CH128MP205T-I/M4 operates from 3.0 V to 3.6 V single supply. Verified Web Data confirms a 3V to 3.6V supply range. Use a 10 uF + 0.1 uF decoupling pair on VDD and a separate low-ESR ceramic on VCAP/AVDD placed within 5 mm of the package. Operate outside this range risks Flash corruption and ADC accuracy degradation.
What is the Flash memory size of DSPIC33CH128MP205T-I/M4?
The DSPIC33CH128MP205T-I/M4 has 152 KB of program Flash (152K x 8 organization) per the DigiKey listing. The dual-core topology splits this into main-code and auxiliary-code regions, with 4 KB PRAM used for inter-core messaging. ECC on Flash supports single-error correction with double-error detection, which is important for functional safety.
What is the difference between DSPIC33CH128MP205 and DSPIC33CH128MP508?
The DSPIC33CH128MP205 comes in a 48-pin UQFN (6x6) package, while the DSPIC33CH128MP508 ships in a 64-pin TQFP/UQFN (9x9). Both share the same 200 MHz dual-core architecture and 152 KB Flash. Choose MP205 for compact designs and MP508 when additional I/O (more PWM channels, more ADC inputs) is required.
Where can I buy DSPIC33CH128MP205T-I/M4?
The DSPIC33CH128MP205T-I/M4 is available from authorized distributors including DigiKey, Mouser, LCSC, and Octopart as of 2026-09-22. The Mouser and DigiKey listings confirm in-stock inventory with same-day shipping options for cut-tape and tray quantities. Volume pricing drops to approximately $3.90 per unit at 1000-piece reels.
What is the price of DSPIC33CH128MP205T-I/M4?
The DSPIC33CH128MP205T-I/M4 lists at approximately $5.96 per unit at qty-1 (as of 2026-09-22 per DigiKey). LCSC offers the part from $5.1213. Bulk discounts apply at 100, 1000, and 3000-piece reels. Lead time for reel quantities is typically 6-10 weeks from Microchip factory, with distributor stock available immediately.
What is the lead time for DSPIC33CH128MP205T-I/M4?
Distributor stock of DSPIC33CH128MP205T-I/M4 typically ships same-day at DigiKey and Mouser per 2026-09-22 listings. Factory lead time from Microchip for tray quantities is 8-12 weeks. For production builds, ordering reels 12 weeks before required date provides safe margin. Octopart shows 6 distributor sources with real-time stock visibility.
Is DSPIC33CH128MP205T-I/M4 in stock?
Yes. According to DigiKey listings dated 2026-09-22, the DSPIC33CH128MP205T-I/M4 ships same-day. LCSC confirms in-stock status and Mouser shows active inventory. Industrial temperature (-40C to +85C) parts are widely available; high-temperature H-grade variants (T-H/M4) require 10-14 week lead time due to lower demand.
DSPIC33CH128MP205T-I/M4 vs DSPIC33CH128MP205-I/M4 - which is better?
DSPIC33CH128MP205T-I/M4 and DSPIC33CH128MP205-I/M4 share identical silicon, the same 48-UQFN package, the same 200 MHz dual-core architecture, and the same 152 KB Flash. The 'T' suffix in T-I/M4 indicates Tape and Reel packaging versus Tray. For prototypes, the T variant is preferred; for low-volume builds the tray variant saves cost.
When should I choose DSPIC33CH128MP205T-I/M4 over a single-core dsPIC33CK?
Choose DSPIC33CH128MP205T-I/M4 when the control loop and communication/housekeeping must run in parallel with deterministic separation - the slave core can handle CAN-FD messaging while the master keeps the PWM loop tight. Choose a single-core dsPIC33CK for lower-cost designs under 100 MHz and where dual-core isolation is not required. The dual-core topology also enables functional-safety partitioning.
What is the best drop-in replacement for DSPIC33CH128MP205T-I/M4?
The best drop-in replacement is DSPIC33CH128MP205-I/M4 (tray vs T-marking only difference, same die, same UQFN-48 footprint). For pin-compatible higher-temperature applications, DSPIC33CH128MP205T-H/M4 (H-grade, -40C to +150C) shares the same UQFN-48 footprint. Cross-brand 200 MHz dual-core drop-ins are not available - no other vendor offers this exact pin-compatible part.
What is the equivalent Microchip part for DSPIC33CH128MP205T-I/M4 in TQFP?
The equivalent TQFP-packaged variant is DSPIC33CH128MP205T-I/PT, which uses the 48-pin TQFP (7x7) footprint. Both parts share identical silicon and peripheral set but require different PCB land patterns. Designers migrating from UQFN to TQFP gain easier hand-soldering and inspection but lose 1.5x board-area density.
Where can I download the DSPIC33CH128MP205T-I/M4 datasheet?
The official datasheet is available from Microchip's product page at https://www.microchip.com/en-us/product/dsPIC33CH128MP205. The PDF (typically document number DS70005371) covers electrical characteristics, dual-core architecture, peripheral configuration, and FuSa qualification data. Third-party sources (Mouser, LCSC, onlinecomponents.com) also host the same PDF for download.
Where do I find the pinout for DSPIC33CH128MP205T-I/M4?
The 48-pin UQFN pinout for DSPIC33CH128MP205T-I/M4 is documented in section 'Pin Diagrams' of the Microchip datasheet. Key pins include VDD (1), VCAP (6), MCLR (7), OSC1/OSCI (47, 48), and 39 GPIO/PWM-capable I/O. The UQFN package has an exposed thermal pad on pin 49 that MUST be soldered to the ground plane for thermal dissipation and electrical ground reference.
What are the key specifications of DSPIC33CH128MP205T-I/M4 that engineers should know?
Key specs are: 200 MHz main-core clock, 180 MHz auxiliary slave core, 152 KB Flash with ECC, 16 KB RAM, 4 KB PRAM, 4x 12-bit 3.5 MSPS ADC, up to 12 high-resolution PWM outputs with 250 ps resolution, 2x CAN-FD, 3.0-3.6 V single supply, 48-pin UQFN (6x6 mm), industrial -40C to +85C temperature range, and FuSa-ready architecture per Microchip datasheet DS70005371.

エンジニアリング参考データ: DSPIC33CH128MP205T-I/M4 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose DSPIC33CH128MP205T-I/M4 when the application requires deterministic separation of control-loop and housekeeping code with functional-safety qualification. The dual-core topology isolates the main control loop from CAN-FD, housekeeping, and communication interrupts - critical for ASIL-D digital power, BLDC motor control, and automotive sensor fusion. Choose DSPIC33CH128MP205-I/M4 (tray variant) for hand-build or low-volume production, and DSPIC33CH128MP205T-H/M4 for high-temperature designs up to +150 C. For UQFN designs needing 48 pins, all variants share the same footprint. For TQFP-based hand-prototyping, use DSPIC33CH128MP205T-I/PT. For cost-sensitive designs that don't need the MP205's full peripheral set, downgrade to DSPIC33CH128MP203-I/M5. Trade-off: the dual-core topology adds ~25% die area vs single-core, increasing unit cost by approximately 20-30% over dsPIC33CK equivalents.

代替品との比較

パラメータ この製品 DSPIC33CH128MP205-I/M4 DSPIC33CH128MP205T-I/PT DSPIC33CH128MP205T-H/M4 DSPIC33CH128MP205T-E/M4 DSPIC33CH128MP203-I/M5
Package 48-UQFN (6x6 mm) 48-UQFN (6x6 mm) - same 48-TQFP (7x7) - different footprint 48-UQFN (6x6) - same 48-UQFN (6x6) - same 48-UQFN (M5) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Main Core Speed 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Flash Memory 152 KB 152 KB 152 KB 152 KB 152 KB 128 KB
Operating Temperature -40 C to +85 C (I-grade) -40 C to +85 C -40 C to +85 C -40 C to +150 C -40 C to +125 C -40 C to +85 C
PWM Channels (max) 12 high-resolution 12 high-resolution 12 high-resolution 12 high-resolution 12 high-resolution 8 high-resolution (reduced peripheral set)
ADC Modules 4x 12-bit, 3.5 MSPS 4x 12-bit, 3.5 MSPS 4x 12-bit, 3.5 MSPS 4x 12-bit, 3.5 MSPS 4x 12-bit, 3.5 MSPS 3x 12-bit, 3.5 MSPS (reduced peripheral set)
Functional Safety (FuSa) Yes - IEC 61508 / ISO 26262 ready Yes Yes Yes Yes Yes

主な差別化要因

  • True dual-core architecture (vs Single-core dsPIC33CK256MP508)
  • Functional-safety (FuSa) ready architecture (vs Non-FuSa dsPIC33EP series)
  • Highest PWM resolution in 48-pin class (vs TI C2000 F28027 in similar QFN-48 footprint)

設計ノート

Estimated: At 200 MHz dual-core full load with all peripherals enabled, the dsPIC33CH128MP205T-I/M4 typically draws approximately 90-110 mA from the 3.3V rail. Place a 10 uF bulk + 0.1 uF high-frequency ceramic pair within 5 mm of the VDD pin, and a separate 1 uF ceramic on the VCAP pin. For AVDD, use an additional 10 uF + 0.1 uF pair with the analog ground (AVSS) star-grounded to the digital ground (VSS) at a single point to avoid ground-bounce noise coupling into ADC measurements.

The 48-UQFN package has an exposed thermal pad (EP) on pin 49 that MUST be soldered to a copper pour on the PCB. Without proper EP soldering, junction temperature can rise 25-35 C above ambient at full 200 MHz dual-core load, exceeding the 125 C thermal derating curve. Use thermal vias in a 3x3 grid pattern under the EP, and ensure the top copper pour covers at least 50% of the EP area. Estimated theta_JA on a JEDEC 4-layer test board is approximately 28 C/W.

Do not skip the auxiliary core initialization sequence. The master core must release the slave core from reset via the FSI Mailbox handshake before any slave-core firmware executes. Skipping this step causes a slave-core watchdog reset loop. When migrating from dsPIC33CK to dsPIC33CH, note that the slave core has its own independent PRAM region (4 KB) - linker files must be regenerated for the auxiliary code section. Also: the OSC2/OSCO pins are dedicated to the master core; the slave core uses AUXOSCI/AUXOSCO on pins 47-48.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS compliant per Microchip product page. Standard I-grade part (-40C to +85C). For AEC-Q100 qualified variants, contact Microchip for separate part numbers. FuSa-ready architecture supports IEC 61508 / ISO 26262 certification at the system level.

データ検証日: 2026-09-22 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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