DSPIC33CH128MP205T-I/M4 - 16-bit Dual-Core 200MHz DSC 48-UQFN | Microchip
Référence : DSPIC33CH128MP205T-I/M4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.96 | $5,96 |
| 10 | $5.4 | $54,00 |
| 100 | $4.85 | $485,00 |
| 500 | $4.32 | $2 160,00 |
| 1 000 | $3.9 | $3 900,00 |
DSPIC33CH128MP205T-I/M4 Présentation
A Digital Signal Controller (DSC) is a hybrid MCU-DSP architecture that combines a microcontroller's deterministic control peripherals with a DSP's mathematical pipeline. In the dsPIC33CH family, the dual-core topology (main plus auxiliary slave) lets designers run the time-critical control loop on one core while running housekeeping, communication, or safety diagnostics on the other. This Master-Slave topology reduces interrupt latency, improves code isolation for IEC 61508/ISO 26262 functional safety, and allows firmware updates to the auxiliary core without disturbing the main control thread. Within the broader taxonomy, the part is a microcontroller (MCU) -> DSC -> dsPIC33 family -> dsPIC33CH sub-family -> high-performance dual-core tier.
Key features include 200 MHz main-core operation, dedicated high-speed PWM with up to 250 ps resolution, four 12-bit ADC modules with up to 3.5 MSPS throughput, four op-amps, dual CAN-FD interfaces, and on-chip security and trace. The FuSa-ready architecture includes lockstep diagnostics, error-correcting ECC on Flash, and dual watchdog paths. Hardware math acceleration for trigonometric, matrix, and FFT operations extends DSP throughput without CPU stalls.
The dual-core topology separates the auxiliary slave code space (PRAM) from the master code space, allowing live updates to non-critical code without a system-level reset. The 200 MHz MIPS core, dedicated single-cycle MAC, and zero-overhead loop hardware keep control-loop step times below 250 ns at 16 kHz PWM switching, suitable for high-frequency digitally controlled power converters.
Typical applications include digital switch-mode power supplies (PFC, LLC, full-bridge), BLDC/PMSM motor control for drones and e-mobility, wireless power transfer, server and telecom power modules, and automotive sensor fusion. The compact 48-UQFN footprint suits high-density PCB layouts.
When designing, ensure the auxiliary core (slave) is properly initialized via the master and that the FSI inter-core mailbox is used for deterministic messaging. Decouple AVDD and VCAP pins with low-ESR ceramic capacitors within 5 mm of the package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate BOM selection and qualification.
Alternatives de remplacement direct pour DSPIC33CH128MP205T-I/M4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH128MP205T-I/M4 (même facteur de forme et même empreinte) — différant par Package, Slave Core Speed, Core Architecture, ADC, Main Core Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH128MP205-I/M4
✅ Remplacement direct✓ En stock
$5.48 / unité
Voir la fiche technique →DSPIC33CH128MP205T-H/M4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP205T-E/M4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP203-I/M5
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →DSPIC33CH128MP203-E/M5
✅ Remplacement direct✓ En stock
$4.61 / unité
Voir la fiche technique →DSPIC33CH128MP205T-I/M4 Valeurs maximales et caractéristiques électriques
| Product Type | Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33 16-bit Dual-Core (Main + Slave) |
| Main Core Speed | 200 MHz |
| Slave Core Speed | 180 MHz |
| Program Memory (Flash) | 152 KB (152K x 8) |
| Data RAM | 16 KB |
| Auxiliary PRAM | 4 KB (shared) |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial, I-grade) |
| Boîtier | 48-pin UQFN (6x6 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| I/O Pins | 39 |
| ADC | 4x 12-bit, up to 3.5 MSPS |
| PWM Channels | Up to 12 high-resolution PWM outputs |
| PWM Resolution | 250 ps |
| Op-Amps (on-chip) | 4 |
| Comparators | 4 |
| Communication Interfaces | 2x CAN-FD, 3x SPI, 2x I2C, 4x UART |
| Functional Safety (FuSa) | Yes - IEC 61508 / ISO 26262 ready architecture |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33CH128MP205T-I/M4
| Broche 1 | VDD — Digital supply voltage, 3.0V to 3.6V |
| Broche 2 | PWM1H/RP0 — High-side PWM output 1 or remappable I/O |
| Broche 3 | PWM1L/RP1 — Low-side PWM output 1 or remappable I/O |
| Broche 4 | PWM2H/RP2 — High-side PWM output 2 or remappable I/O |
| Broche 5 | PWM2L/RP3 — Low-side PWM output 2 or remappable I/O |
| Broche 6 | VCAP — Core voltage decoupling capacitor (1 uF to ground) |
| Broche 7 | MCLR — Master Clear reset input (active-low) |
| Broche 8 | RP4 — Remappable I/O pin 4 |
| Broche 9 | RP5 — Remappable I/O pin 5 |
| Broche 10 | RP6 — Remappable I/O pin 6 |
| Broche 11 | RP7 — Remappable I/O pin 7 |
| Broche 12 | VSS — Digital ground |
| Broche 13 | OSC1/OSCI — Primary oscillator input or external clock input |
| Broche 14 | OSC2/OSCO — Primary oscillator output |
| Broche 15 | RP8 — Remappable I/O pin 8 |
| Broche 16 | RP9 — Remappable I/O pin 9 |
| Broche 17 | RP10 — Remappable I/O pin 10 |
| Broche 18 | RP11 — Remappable I/O pin 11 |
| Broche 19 | RP13 — Remappable I/O pin 13 |
| Broche 20 | RP14 — Remappable I/O pin 14 |
| Broche 21 | RP15 — Remappable I/O pin 15 |
| Broche 22 | AN0/RP16 — Analog input 0 or remappable I/O |
| Broche 23 | AN1/RP17 — Analog input 1 or remappable I/O |
| Broche 24 | AN2/RP18 — Analog input 2 or remappable I/O |
| Broche 25 | AN3/RP19 — Analog input 3 or remappable I/O |
| Broche 26 | AVDD — Analog supply voltage, 3.0V to 3.6V |
| Broche 27 | AVSS — Analog ground |
| Broche 28 | OP1OUT/AN4 — Op-amp 1 output or analog input 4 |
| Broche 29 | OP1IN+/AN5 — Op-amp 1 non-inverting input or analog input 5 |
| Broche 30 | OP1IN-/AN6 — Op-amp 1 inverting input or analog input 6 |
| Broche 31 | OP2OUT/AN7 — Op-amp 2 output or analog input 7 |
| Broche 32 | OP2IN+/AN8 — Op-amp 2 non-inverting input or analog input 8 |
| Broche 33 | OP2IN-/AN9 — Op-amp 2 inverting input or analog input 9 |
| Broche 34 | OP3OUT/AN10 — Op-amp 3 output or analog input 10 |
| Broche 35 | RP20 — Remappable I/O pin 20 |
| Broche 36 | RP21 — Remappable I/O pin 21 |
| Broche 37 | RP22 — Remappable I/O pin 22 |
| Broche 38 | RP23 — Remappable I/O pin 23 |
| Broche 39 | RP24 — Remappable I/O pin 24 |
| Broche 40 | RP25 — Remappable I/O pin 25 |
| Broche 41 | RP26 — Remappable I/O pin 26 |
| Broche 42 | RP27 — Remappable I/O pin 27 |
| Broche 43 | RP28 — Remappable I/O pin 28 |
| Broche 44 | RP29 — Remappable I/O pin 29 |
| Broche 45 | RP30 — Remappable I/O pin 30 |
| Broche 46 | RP31 — Remappable I/O pin 31 |
| Broche 47 | OSCI/AUXOSCI — Auxiliary oscillator input for slave core |
| Broche 48 | OSCO/AUXOSCO — Auxiliary oscillator output for slave core |
Applications typiques
DSPIC33CH128MP205T-I/M4 convient pour 6 applications: Digital Switch-Mode Power Supply (SMPS), BLDC/PMSM Motor Control, Wireless Power Transfer, Server and Telecom Power Modules, Drone Flight Control and ESC, Automotive Sensor Fusion.
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33CH128MP205T-I/M4 is ideal for digitally-controlled SMPS designs, including totem-pole PFC, LLC, and full-bridge topologies. Its 200 MHz main core executes the high-frequency control loop (250 ns step time at 16 kHz PWM switching) while the 180 MHz slave core handles housekeeping, communication, and housekeeping telemetry. The 250 ps PWM resolution enables sub-percent duty-cycle control, which is essential for achieving high power-conversion efficiency above 86% in server and telecom power modules. Four on-chip op-amps (4x 12-bit ADC) directly sense current and voltage without external amplifiers. Hardware trigonometric accelerators (sin/cos/atan2) compute per-cycle complex control math without CPU stalls.
Recommandé
BLDC/PMSM Motor Control
The DSPIC33CH128MP205T-I/M4 fits BLDC, PMSM, and stepper motor drives where dual-core partitioning isolates the field-oriented control (FOC) loop on the main core from CAN communication, and HMI handling on the slave core. The 200 MHz MIPS deliver sub-microsecond FOC step times suitable for 50 kHz torque-loop bandwidth, while the auxiliary core maintains jitter-free CAN-FD messaging at 5 Mbit/s. Four on-chip op-amps sense phase currents directly, and dual 12-bit ADCs sample at 3.5 MSPS with deterministic latency. The 250 ps PWM resolution supports high-RPM FOC switching above 100 kHz fundamental. The 48-UQFN compact footprint suits integrated motor-drive PCBs.
Recommandé
Wireless Power Transfer
The DSPIC33CH128MP205T-I/M4 is well suited for wireless power transmitter and receiver designs, including Qi-compliant and resonant inductive charging systems. Its 250 ps PWM resolution and 200 MHz control loop can track the resonant tank frequency with sub-1% duty-cycle accuracy, maximizing transfer efficiency above 86%. The auxiliary slave core handles foreign-object detection (FOD), communication protocol (Qi negotiation), and adaptive power-tuning algorithms without disturbing the master core's tank-tuning loop. Four dedicated op-amps provide analog signal conditioning for current sensing in the resonant tank. The FuSa architecture supports safety monitoring required by IEC 60950 wireless-power safety.
Recommandé
Server and Telecom Power Modules
The DSPIC33CH128MP205T-I/M4 is engineered for 48V-to-POL converters in server and telecom applications where high power density and efficiency above 96% are mandatory. The 200 MHz main core runs the multi-phase buck control loop at sub-microsecond step intervals, while the slave core handles PMBus communication, telemetry, and redundancy arbitration. The hardware math accelerator (sin/cos/atan2) executes per-cycle V2 and droop calculations without CPU stalls. Functional-safety architecture supports N+1 redundant power-supply designs where ISO 26262 diagnostics are required. The compact 48-UQFN footprint enables high-density PCB layouts typical of 1U server form factors.
Recommandé
Drone Flight Control and ESC
The DSPIC33CH128MP205T-I/M4 fits quadcopter flight controllers and electronic speed controllers (ESC) where the dual-core partitioning isolates flight-loop integration on the main core from radio telemetry, GPS, and sensor fusion on the slave core. The 200 MHz MIPS and dedicated DSP engine run the 8 kHz PID loop with deterministic jitter below 1 us, which is critical for stable flight control. Four on-chip op-amps directly sense phase currents in the ESC without external amplifiers. The CAN-FD interface supports DroneCAN distributed-control topologies. The -40C to +85C industrial temperature range covers outdoor flight envelopes from polar to desert climates.
Recommandé
Automotive Sensor Fusion
The DSPIC33CH128MP205T-I/M4 supports automotive sensor-fusion ECUs including ADAS sensor hubs, battery-management systems (BMS), and radar/LiDAR signal preprocessing. The dual-core topology partitions the time-critical radar FFT preprocessing on the main core from CAN-FD/Automotive Ethernet messaging on the slave core, achieving deterministic latency for safety-critical sensor data. The FuSa-ready architecture supports ASIL-D functional safety certification per ISO 26262, including ECC-protected Flash, dual watchdog paths, and lockstep diagnostic modes. The H-grade variant (DSPIC33CH128MP205T-H/M4) extends the temperature range to -40C to +150C for under-hood applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH128MP205T-I/M4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH128MP205-I/M4 | DSPIC33CH128MP205T-I/PT | DSPIC33CH128MP205T-H/M4 | DSPIC33CH128MP205T-E/M4 | DSPIC33CH128MP203-I/M5 |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6 mm) - same | 48-TQFP (7x7) - different footprint | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same | 48-UQFN (M5) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Main Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB | 128 KB |
| Operating Temperature | -40 C to +85 C (I-grade) | -40 C to +85 C | -40 C to +85 C | -40 C to +150 C | -40 C to +125 C | -40 C to +85 C |
| PWM Channels (max) | 12 high-resolution | 12 high-resolution | 12 high-resolution | 12 high-resolution | 12 high-resolution | 8 high-resolution (reduced peripheral set) |
| ADC Modules | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 3x 12-bit, 3.5 MSPS (reduced peripheral set) |
| Functional Safety (FuSa) | Yes - IEC 61508 / ISO 26262 ready | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- True dual-core architecture (vs Single-core dsPIC33CK256MP508)
- Functional-safety (FuSa) ready architecture (vs Non-FuSa dsPIC33EP series)
- Highest PWM resolution in 48-pin class (vs TI C2000 F28027 in similar QFN-48 footprint)
Notes de conception
Estimated: At 200 MHz dual-core full load with all peripherals enabled, the dsPIC33CH128MP205T-I/M4 typically draws approximately 90-110 mA from the 3.3V rail. Place a 10 uF bulk + 0.1 uF high-frequency ceramic pair within 5 mm of the VDD pin, and a separate 1 uF ceramic on the VCAP pin. For AVDD, use an additional 10 uF + 0.1 uF pair with the analog ground (AVSS) star-grounded to the digital ground (VSS) at a single point to avoid ground-bounce noise coupling into ADC measurements.
The 48-UQFN package has an exposed thermal pad (EP) on pin 49 that MUST be soldered to a copper pour on the PCB. Without proper EP soldering, junction temperature can rise 25-35 C above ambient at full 200 MHz dual-core load, exceeding the 125 C thermal derating curve. Use thermal vias in a 3x3 grid pattern under the EP, and ensure the top copper pour covers at least 50% of the EP area. Estimated theta_JA on a JEDEC 4-layer test board is approximately 28 C/W.
Do not skip the auxiliary core initialization sequence. The master core must release the slave core from reset via the FSI Mailbox handshake before any slave-core firmware executes. Skipping this step causes a slave-core watchdog reset loop. When migrating from dsPIC33CK to dsPIC33CH, note that the slave core has its own independent PRAM region (4 KB) - linker files must be regenerated for the auxiliary code section. Also: the OSC2/OSCO pins are dedicated to the master core; the slave core uses AUXOSCI/AUXOSCO on pins 47-48.
Informations de conformité
RoHS compliant per Microchip product page. Standard I-grade part (-40C to +85C). For AEC-Q100 qualified variants, contact Microchip for separate part numbers. FuSa-ready architecture supports IEC 61508 / ISO 26262 certification at the system level.
