DSPIC33CK256MP203-E/M5 - 100MHz 16-bit DSC 256KB Flash | Microchip
部品番号: DSPIC33CK256MP203-E/M5 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33CK256MP203-E/M5 概要
A digital signal controller combines the compute characteristics of a microcontroller with the arithmetic throughput of a digital signal processor. Within the power-management hierarchy, the dsPIC33CK family sits at the level of a single-core 16-bit DSC within Microchip's broader digital signal controller portfolio, targeting real-time closed-loop control where a general-purpose MCU lacks deterministic DSP throughput.
Key features include the dsPIC33CK DSC core running DC to 100 MIPS from a 3.0V to 3.6V supply, up to 256 KBytes of program flash with ECC and Live Update dual-partition flash for field firmware upgrades without downtime, and 24 KBytes of data SRAM with Memory Built-In Self-Test (MBIST). The device integrates 3 on-chip operational amplifiers and 3 comparators, offloading external analog signal-conditioning stages in power converters.
The modified Harvard architecture with a high-resolution PWM (HRPWM) module and CAN Flexible Data (CAN FD) interface makes this DSC well suited to digital power supplies, motor control, and advanced sensing and control systems. Functional Safety (FuSa) documentation support further enables safety-relevant industrial designs.
Typical applications include digitally controlled AC-DC and DC-DC power supplies, brushless DC and PMSM motor drives, and power-factor-correction stages where the 100 MIPS core and integrated op-amps execute fast current loops.
Design consideration: the -40C to +150C extended temperature range of the E-grade requires attention to total power dissipation and PCB copper area to stay within junction limits at high ambient temperatures.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: DSPIC33CK256MP203-E/M5 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33CK256MP203-E/M5 （同一形状・フットプリント） — 相違点: Data SRAM, PWM, Package, Program Flash.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33CK256MP203-I/M5
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33CK128MP203-E/M5
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.2 / 個
データシートを見る →DSPIC33CK64MP203-E/M5
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33CK256MP203-E/M5 最大定格＆電気的特性
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | DC to 100 MIPS (100 MHz) |
| Program Flash | 256 KBytes with ECC and Live Update (dual-partition) |
| Data SRAM | 24 KBytes with MBIST |
| Architecture | Modified Harvard, single-core |
| Operating Voltage | 3.0 V to 3.6 V |
| 動作温度 | -40C to +150C (E grade) |
| パッケージ | 36-UQFN (5x5 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| On-chip Op-Amps | 3 |
| On-chip Comparators | 3 |
| PWM | High-Resolution PWM (HRPWM) |
| CAN Interface | CAN Flexible Data (CAN FD) |
| Peripheral Trigger Generator | Yes (PTG) |
| Functional Safety Support | Yes (FuSa package option) |
| Data Program Memory Width | 24-bit instruction word |
DSPIC33CK256MP203-E/M5 36-uqfn (5x5 mm) with exposed pad ピン配置ガイド
DSPIC33CK256MP203-E/M5 (36-uqfn (5x5 mm) with exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33CK256MP203-E/M5.
詳細は データシート をご参照ください。
主な用途
DSPIC33CK256MP203-E/M5 の用途: 6 件s: Digitally Controlled AC-DC Power Supplies, BLDC and PMSM Motor Control, Power Factor Correction (PFC) Stages, Advanced Sensing and Control Systems, Wireless Charging and Resonant Converters, Industrial Communication Nodes with CAN FD.
Digitally Controlled AC-DC Power Supplies
The DSPIC33CK256MP203-E/M5 fits digital AC-DC converter control because its 100 MIPS dsPIC33CK core closes current-mode loops fast enough for flyback, LLC, and totem-pole PFC topologies, while the high-resolution PWM module delivers fine duty-cycle and phase resolution for switching frequencies in the hundreds of kilohertz. The 3 on-chip op-amps buffer shunt or current-transformer signals directly, and the 3 comparators provide hardware overcurrent trip paths that operate independently of software latency. Firmware for soft-start, burst mode, and protection state machines fits comfortably in the 256 KB ECC flash, and dual-partition Live Update allows field firmware updates without dropping the output. Supply is 3.0V to 3.6V, so the controller rails cleanly from a standard auxiliary bias winding regulator.
おすすめ
BLDC and PMSM Motor Control
Sensorless and sensored brushless DC and PMSM drives benefit directly from this DSC. The 100 MIPS core executes field-oriented control (FOC) with single-shunt or three-shunt current reconstruction inside one PWM period, and the integrated op-amps amplify low-level phase-current signals on-chip, removing three external amplifier ICs and their offset matching concerns. High-resolution PWM gives fine voltage-vector resolution that reduces torque ripple and acoustic noise at high electrical speeds. The 24 KB SRAM with MBIST and 256 KB ECC flash support a full FOC stack plus communication, while CAN FD connects the drive to industrial or vehicle networks. The -40C to +150C E-grade suits motor-adjacent mounting where ambient temperatures near the power stage are elevated.
おすすめ
Power Factor Correction (PFC) Stages
In boost or totem-pole PFC front ends, the DSPIC33CK256MP203-E/M5 runs average-current-mode control at switching frequencies where the high-resolution PWM step size keeps THD low. The on-chip comparators implement cycle-by-cycle overcurrent limiting in hardware, which is essential because software-only protection cannot respond within a single switching cycle at 100 kHz-plus frequencies. The PTG (Peripheral Trigger Generator) sequences ADC sampling synchronized to the PWM, ensuring current samples are taken at the correct point in the inductor ripple for clean average-value control. The 256 KB flash accommodates PFC plus auxiliary housekeeping firmware and a CAN FD or UART link for system telemetry, all on one 36-pin 5x5 mm footprint.
おすすめ
Advanced Sensing and Control Systems
Industrial sensing nodes that require on-board signal conditioning and local decision-making match this DSC well. The three integrated op-amps amplify low-level sensor outputs (strain gauge, thermocouple after front end, pressure bridge) without external amplifier ICs, and the 16-bit DSP MAC instructions implement digital filtering and calibration math efficiently at 100 MIPS. The 256 KB flash with ECC retains calibration tables and logging safely across power cycles, and MBIST-backed SRAM suits systems where memory integrity matters. CAN FD, UART, and SPI peripherals link the node to plant networks, while dual-partition Live Update permits firmware feature upgrades in the field. The wide -40C to +150C range allows mounting directly inside hot enclosures near machinery.
おすすめ
Wireless Charging and Resonant Converters
Resonant topologies such as wireless power transmitters and LLC converters require precise frequency and phase control with fast fault response. The high-resolution PWM of the DSPIC33CK256MP203-E/M5 provides the fine frequency-resolution needed to track a resonant tank and maintain ZVS/ZCS conditions across load range, while the comparators and PTG implement hardware-level fault shutdown and synchronized sampling. The 100 MIPS DSP core executes phase/frequency tracking algorithms and foreign-object-detection power-signature analysis within real-time deadlines. The 256 KB ECC flash holds a full feature set including Qi-style protocol layers, and CAN FD or UART links report status to a system host. The compact 36-UQFN (5x5 mm) footprint suits space-constrained transmitter coils PCBs.
おすすめ
Industrial Communication Nodes with CAN FD
The integrated CAN Flexible Data module makes this DSC a strong choice for industrial control nodes that must both run local control loops and exchange data on modern CAN FD networks. The 100 MIPS core handles CAN FD data-phase bit rates and higher protocol stacks alongside deterministic control tasks, while 256 KB ECC flash stores protocol firmware, device profiles, and logging. Live Update dual-partition flash allows network-wide firmware refresh without field downtime. The E-grade -40C to +150C rating supports nodes mounted near drives, actuators, or outdoors in hot enclosures. Combined with the on-chip op-amps for analog front ends, a single DSPIC33CK256MP203-E/M5 can replace separate MCU, DSP, and analog conditioning chips in compact industrial modules.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33CK256MP203-E/M5 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33CK256MP203-I/M5 | DSPIC33CK128MP203-E/M5 | DSPIC33CK64MP203-E/M5 |
|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm) | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Program Flash | 256 KB (ECC, dual-partition) | 256 KB (ECC, dual-partition) | 128 KB (-50%) | 64 KB (-75%) |
| Operating Temperature | -40C to +150C (E grade) | -40C to +85C (I grade) | -40C to +150C (E grade) | -40C to +150C (E grade) |
| On-chip Op-Amps / Comparators | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 |
| CAN FD | Yes | Yes | Yes | Yes |
主な差別化要因
- Extended -40C to +150C temperature rating （vs DSPIC33CK256MP203-I/M5)
- 256 KB ECC flash with Live Update dual-partition （vs DSPIC33CK128MP203-E/M5)
- Integrated 3 op-amps and 3 comparators （vs DSPIC33CK64MP203-E/M5)
設計ノート
Supply the DSPIC33CK256MP203-E/M5 from a clean 3.0V to 3.6V rail (nominal 3.3V). Place a 0.1 uF ceramic decoupling capacitor at each VDD pin as close to the pin as possible, plus bulk capacitance of 4.7 uF to 10 uF near the device. The exposed pad of the 36-UQFN package must be soldered to a grounded copper pour - it is both the thermal path and a major ground return for the on-chip op-amps and comparators. Estimated: at a typical 42.5 mA class supply current from a 3.3 V rail, core dissipation is roughly 0.14 W, so thermal design is dominated by ambient conditions rather than the chip itself.
Route high-resolution PWM outputs away from the op-amp input traces; the HRPWM edges contain fast transitions that can couple into analog sensing lines. Keep the three op-amp input networks short and over a continuous ground plane referenced to the exposed pad ground. Separate the power-stage ground (PWM gate-drive returns, shunt grounds) from the analog ground at a single star point near the exposed pad. Use series termination or controlled slew settings on CAN FD transceiver connections to limit ringing on the bus stub.
Do not substitute the -E grade part with the cheaper -I grade in designs near +85C ambient: the -I part is rated only to +85C while the -E part is rated to +150C, and margins close quickly inside sealed enclosures near power stages. When using Live Update dual-partition flash, always validate the inactive partition before booting from it, or a failed update can brick the unit in the field. Configure the comparators and their DAC references early in bring-up - hardware overcurrent trip paths must be proven on the bench with a current probe before the converter is connected to mains.
コンプライアンス情報
Compliance status was not stated in the verified web data captured as of 2026-09-22; confirm RoHS/REACH status on the official Microchip product page for the exact ordering code before procurement.
