DSPIC33CK256MP608-I/PT - 100MHz DSC, 256KB Flash, CAN FD | Microchip
部品番号: DSPIC33CK256MP608-I/PT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.97 | $1.97 |
| 10 | $1.87 | $18.70 |
| 100 | $1.77 | $177.00 |
| 500 | $1.68 | $840.00 |
| 1,000 | $1.57 | $1,570.00 |
DSPIC33CK256MP608-I/PT 概要
A digital signal controller combines the compute architecture of a digital signal processor (DSP) with the peripheral integration and deterministic control flow of a microcontroller (MCU). DSCs sit within the broader power management and embedded control hierarchy, bridging general-purpose MCUs and full DSPs for real-time closed-loop applications such as motor control and digital power conversion.
Key features of the dsPIC33CK256MP608 include the dsPIC33C 100 MHz core with DSP-enhanced instruction execution, dual-panel flash that allows program execution from one panel while erasing or writing the other, and an integrated Controller Area Network Flexible Data-rate (CAN FD) module. Analog integration includes on-chip operational amplifiers and 12-bit ADCs, while the high-resolution PWM peripherals target switch-mode power conversion and precise motor phase driving.
Technically, the dsPIC33CK core executes most instructions in a single cycle at 100 MHz, and the dual-panel flash architecture removes flash erase stalls from real-time control loops - a key advantage over single-panel MCUs in current-loop applications running at tens to hundreds of kHz. The peripheral ecosystem (PWM, ADC, op-amps, comparators) can be interconnected for autonomous operation with reduced CPU intervention.
Typical applications include precision PMSM and BLDC motor control, digital power supplies and totem-pole PFC stages, solar micro-inverters, and battery chargers - all systems where CAN FD connectivity, fast 12-bit ADC sampling, and deterministic PWM control are decisive.
Design consideration: the I-suffix part is rated to +85C ambient; for extended-temperature systems to +125C, select the E-suffix variant. Verify startup configuration (FICD/oscillator fuses) when migrating within the family.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: DSPIC33CK256MP608-I/PT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33CK256MP608-I/PT （同一形状・フットプリント） — 相違点: Package, Core, Operating Temperature, Supply Voltage, ADC Resolution.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33CK512MP608-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.12 / 個
データシートを見る →DSPIC33CK128MP608-I/PT
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33CK256MP608-E/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.25 / 個
データシートを見る →DSPIC33CK256MP608-I/PT 最大定格＆電気的特性
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | 100 MHz |
| Flash Memory | 256 KB (dual panel) |
| RAM | 64 KB |
| データバス幅 | 16 bit |
| 電源電圧 | 3.6 V (max operating) |
| CAN Interface | CAN FD |
| Analog Peripherals | Integrated op-amps, 12-bit ADCs |
| PWM Peripherals | High-resolution PWM |
| パッケージ | 80-TQFP (12x12 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (I grade) |
| Product Family | dsPIC33C digital signal controllers |
| Debug Support | 8 hardware breakpoints (per tool vendor) |
| Programming | ICSP (In-Circuit Serial Programming) |
DSPIC33CK256MP608-I/PT 80-tqfp (12x12 mm) ピン配置ガイド
DSPIC33CK256MP608-I/PT (80-tqfp (12x12 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33CK256MP608-I/PT.
詳細は データシート をご参照ください。
主な用途
DSPIC33CK256MP608-I/PT の用途: 6 件s: Precision PMSM/BLDC Motor Control, Digital Power Supplies and Totem-Pole PFC, Solar Micro-Inverters, Battery Chargers and BMS Nodes, Industrial Automation and Sensing Nodes, Automotive-Adjacent Control Modules.
Precision PMSM/BLDC Motor Control
The dsPIC33CK256MP608 is purpose-built for field-oriented control (FOC) of PMSM and BLDC motors. Its 100 MHz single-cycle DSP core executes current-loop math with deterministic latency, while the dual-panel 256 KB flash eliminates erase/write stalls inside 20-100 kHz control loops. High-resolution PWM outputs drive three-phase inverters with fine duty resolution, and on-chip 12-bit ADCs sample phase currents synchronized to PWM triggers, minimizing measurement jitter. Integrated op-amps can amplify shunt currents on-chip, removing external amplifier stages. The CAN FD module links the drive into industrial or automotive networks for command and diagnostics. Performance consideration: budget CPU cycles for the fast inner current loop; peripheral interconnection can offload ADC-to-PWM housekeeping from software.
おすすめ
Digital Power Supplies and Totem-Pole PFC
In digitally controlled power supplies, LLC converters, and totem-pole PFC stages, the dsPIC33CK256MP608 provides the high-resolution PWM edges and fast 12-bit ADC sampling needed for peak-current-mode and voltage-mode control at switching frequencies of 100 kHz and above. The 100 MHz core sustains control-law computation with headroom, while dual-panel flash permits field firmware updates (such as compensation retuning) without interrupting the running converter. On-chip comparators and op-amps support autonomous cycle-by-cycle current limiting independent of software latency. Design consideration: configure the ADC to sample synchronized to PWM off-times to avoid switching-noise corruption; the peripheral trigger system makes this deterministic without CPU intervention, which improves THD in PFC front ends.
おすすめ
Solar Micro-Inverters
Solar micro-inverters demand simultaneous MPPT computation, grid-synchronized current injection, and safety monitoring - a workload the dsPIC33CK256MP608 handles with its 100 MHz DSP core and rich analog front end. The 12-bit ADCs sample PV voltage/current and grid waveforms; high-resolution PWM synthesizes the sinusoidal output through the power stage. The 256 KB dual-panel flash accommodates MPPT algorithms, grid-compliance code, and communication stacks, and supports firmware field updates without dropping energy harvest. Consideration: grid codes require rapid anti-islanding response; the deterministic single-cycle core and hardware comparators help meet mandated trip times without relying solely on software polling loops.
おすすめ
Battery Chargers and BMS Nodes
Battery charging topologies (CC/CV Li-ion, multi-chemistry) benefit from the dsPIC33CK256MP608's combination of accurate 12-bit ADC channels for voltage/current/temperature telemetry and high-resolution PWM for switch-mode charger control. The CAN FD module is decisive in pack-level and vehicle battery systems, where pack telemetry, cell balancing commands, and fault signaling traverse the same bus at data rates beyond classical CAN. Dual-panel flash enables charge-profile updates in the field. Design consideration: sample battery current during PWM off-phases to avoid switching transients; the ADC-PWM trigger interconnect performs this automatically, improving coulomb-counting accuracy across wide load ranges.
おすすめ
Industrial Automation and Sensing Nodes
Within Industry 4.0 networks, the dsPIC33CK256MP608 serves as an intelligent node combining local real-time actuation (via high-resolution PWM and on-chip op-amps driving actuators or valves) with CAN FD connectivity back to PLCs and SCADA systems. The 100 MHz DSP core can perform local signal processing - vibration spectral analysis, sensor fusion, or digital filtering - before transmission, reducing bus traffic. The 64 KB RAM supports buffering of multiple sensor streams. Consideration: the peripheral pin select (PPS) system allows routing UART/SPI/I2C functions to flexible pins, simplifying multi-variant industrial boards built on one PCB footprint.
おすすめ
Automotive-Adjacent Control Modules
For auxiliary automotive systems - pumps, fans, valves, lighting controllers - the dsPIC33CK256MP608 provides deterministic motor or power control with a CAN FD interface compatible with in-vehicle networks. Its -40C to +85C industrial grade suits under-cabin environments; for under-hood exposure choose the pin-compatible E-grade variant rated to +125C. Integrated op-amps reduce BOM for current sensing in DC motor drives. Design consideration: use the E-suffix part (DSPIC33CK256MP608-E/PT) where ambient exceeds 85C, and apply proper AEC-grade qualification practices for components around the DSC since this standard part is not itself AEC-Q100 qualified.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33CK256MP608-I/PT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33CK512MP608-I/PT | DSPIC33CK128MP608-I/PT | DSPIC33CK256MP608-E/PT |
|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB (dual panel) | 512 KB (dual panel) | 128 KB (dual panel) | 256 KB (dual panel) |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB |
| Core Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C |
| CAN FD | Yes | Yes | Yes | Yes |
主な差別化要因
- Best flash-per-dollar for code bases under 256 KB （vs DSPIC33CK512MP608-I/PT)
- Extended temperature capability in the same footprint （vs DSPIC33CK256MP608-E/PT)
- More code headroom than the entry variant （vs DSPIC33CK128MP608-I/PT)
設計ノート
The dsPIC33CK256MP608 operates from a nominal 3.3 V rail (3.6 V maximum). Decouple each VDD pin pair with 0.1 uF ceramics placed within 2 mm of the pins, plus one bulk 10 uF per power domain. Use a clean analog supply (ferrite or LDO isolation from the digital rail) for AVDD to preserve 12-bit ADC accuracy; noisy AVDD directly degrades effective number of bits in current-loop sampling.
The 80-TQFP (12x12 mm, 0.5 mm pitch) requires careful fan-out of high-current PWM traces to the inverter gate drivers. Keep PWM gate-drive traces short and away from analog sense lines to prevent capacitive coupling of switching edges into ADC inputs. Use a solid ground plane with return paths under the DSC; avoid splitting ground under the analog section. Provide programming/debug access to PGC/PGD (ICSP) on a header even in production boards.
Migrating within the dsPIC33CK family requires updating the device selection and linker scripts in MPLAB X - peripherals share the same register map, but flash sizes differ (128/256/512 KB). Note that the I-suffix is rated only to +85C; under-hood designs need the E-suffix. Also, once ICSP writes are inhibited by configuration, the device cannot be reprogrammed - test this workflow only on development units.
コンプライアンス情報
Compliance data not present in provided web data; verify RoHS/REACH status on the official Microchip product page before procurement. Not an automotive AEC-Q100 part per family positioning.
