DSPIC33EP128GP504T-E/ML - 16-bit 60 MIPS DSC 128KB Flash | Microchip
部品番号: DSPIC33EP128GP504T-E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP128GP504T-E/ML 概要
A digital signal controller combines the deterministic control of a microcontroller with the math throughput of a DSP engine. Within the power-management hierarchy, the dsPIC33EP family sits above basic PIC16/PIC18 MCUs and below application-specific dsPIC33CH dual-core parts, offering a single high-performance core, hardware DSP multiply-accumulate instructions, and rich analog peripherals in a single chip. This makes the category the default choice for digital power conversion, motor control, and sensor conditioning.
Key features include the 16-bit dsPIC33E core with DSP instruction extensions, CAN 2.0B connectivity, I2C, SPI, UART/USART with IrDA and LINbus support, the Charge Time Measurement Unit (CTMU) for capacitive touch and time-domain measurements, high-speed PWM outputs for power conversion, and Peripheral Trigger Generators that let ADC conversions fire autonomously from PWM events - a hallmark of digital-power architectures.
Technically, the device integrates a 16-bit pipelined core with a hardware multiplier and DSP engine (40-bit wide accumulator, dual operand fetch), supporting C compilers (XC16) and the MPLAB X IDE ecosystem. In-circuit serial programming (ICSP) and JTAG boundary scan (IEEE 1149.2 compatible, per the family datasheet) support production programming and board-level test.
Typical applications include digital power supplies and PFC stages, BLDC/PMSM motor control, industrial sensing nodes, and automotive-adjacent subsystems requiring CAN - all leveraging the fast ADC, PWM, and CTMU peripherals.
Design consideration: the E temperature grade extends ambient operation to +125C, but verify total power dissipation and theta-JA of the 44-QFN with an exposed pad; a solid ground pour is required for thermal and signal-integrity performance.
This page synthesizes verified distributor data, same-family drop-in options, and practical design guidance not consolidated in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP128GP504T-E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP128GP504T-E/ML （同一形状・フットプリント） — 相違点: Operating Temperature, Package, RAM, Core, Connectivity.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP128GP504-E/ML
✅ ドロップイン✓ 在庫あり
$3.28 / 個
データシートを見る →DSPIC33EP128GP504T-I/ML
✅ ドロップイン✓ 在庫あり
$3.92 / 個
データシートを見る →DSPIC33EP128GP504T-E/TL
✅ ドロップイン✓ 在庫あり
$4.05 / 個
データシートを見る →DSPIC33EP256GP504T-E/ML
✅ ドロップイン✓ 在庫あり
$5.75 / 個
データシートを見る →DSPIC33EP128GP504T-E/ML 最大定格＆電気的特性
| Core | dsPIC33E, 16-bit |
| Max Core Speed | 60 MIPS |
| Program Memory | 128KB (43K x 24) FLASH |
| RAM | 8KB |
| Connectivity | CAN, I2C, SPI, UART/USART, IrDA, LINbus |
| パッケージ | 44-QFN (8x8 mm), exposed pad |
| 動作温度 | -40C to +125C (extended, E grade) |
| 実装タイプ | Surface Mount |
| Special Peripherals | CTMU, Peripheral Trigger Generator, high-speed PWM, op amps |
| Programming | ICSP, JTAG boundary scan (IEEE 1149.2 compatible) |
| Packaging | Tape & Reel (T suffix) |
| Family | dsPIC33EP General Purpose (GP) |
| データバス幅 | 16 bit |
DSPIC33EP128GP504T-E/ML 44-qfn (8x8 mm), exposed pad ピン配置ガイド
DSPIC33EP128GP504T-E/ML (44-qfn (8x8 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP128GP504T-E/ML.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP128GP504T-E/ML の用途: 6 件s: Digital Power Supplies and PFC, BLDC / PMSM Motor Control, Industrial Sensing and IoT Nodes, Automotive-Adjacent CAN Nodes, Test and Measurement Instrumentation, Audio Signal Processing and Embedded Control.
Digital Power Supplies and PFC
The DSPIC33EP128GP504T-E/ML fits digital switch-mode power supplies and power-factor-correction stages because its high-speed PWM modules pair directly with fast ADC sampling through the Peripheral Trigger Generator, allowing current-loop compensation to run at switching frequency with deterministic latency. The 16-bit DSP engine executes PID and 3P3Z compensator math with single-cycle multiply-accumulate on a 40-bit accumulator, achieving the loop bandwidth that analog controllers deliver without their component drift. Placed as the sole supervisory controller, it handles soft-start, fault latching, and PMBus-style telemetry over UART or I2C. The -40C to +125C E-grade rating suits power electronics where ambient near the controller routinely exceeds +85C.
おすすめ
BLDC / PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EP128GP504T-E/ML provides the standard FOC recipe: high-speed PWM drives a three-phase inverter gate stage, the ADC samples phase currents synchronized to PWM center via the Peripheral Trigger Generator, and the DSP engine executes Clarke/Park transforms and PI current loops at multi-kHz rates. The integrated op-amp peripherals can condition shunt currents, reducing external component count. CAN connectivity links the drive to a higher-level network controller, while CTMU supports sensorless commutation schemes. The extended -40C to +125C temperature range covers sealed motor-drive enclosures where controller ambient tracks the power stage.
おすすめ
Industrial Sensing and IoT Nodes
In industrial sensing nodes, the DSPIC33EP128GP504T-E/ML acts as the intelligent edge controller: the CTMU measures capacitance for touch or proximity sensing and can perform precise time-domain measurements, while SPI and I2C connect external precision ADCs and MEMS sensors. The 128KB FLASH stores protocol stacks and local calibration tables, and the 8KB RAM buffers sensor streams before forwarding over CAN, UART, or LINbus to a gateway. DSP instructions enable on-node FFT-based vibration or acoustic analysis, offloading the host. The QFN-44 footprint with 8x8 mm body fits compact sensor pucks, and the E-grade temperature rating supports outdoor and rooftop installations.
おすすめ
Automotive-Adjacent CAN Nodes
The DSPIC33EP128GP504T-E/ML is well positioned for off-road, agricultural, and auxiliary automotive-adjacent modules that need CAN 2.0B connectivity and robust analog control but not full ASIL qualification. The integrated CAN controller implements standard and extended frames without external silicon, the high-speed PWM handles lamp ballast, pump, or actuator control, and CTMU enables capacitive human-machine interfaces (touch buttons on a sealed panel). The -40C to +125C operating envelope matches underhood and engine-bay-adjacent ambient conditions. Firmware for CAN descriptors and network management runs comfortably in the 128KB FLASH with room for OTA-style bootloaders over UART or CAN.
おすすめ
Test and Measurement Instrumentation
Bench and embedded instruments benefit from the DSPIC33EP128GP504T-E/ML's combination of a 60 MIPS DSP core and measurement-oriented peripherals. The CTMU provides precise charge-based time interval and capacitance measurement, the ADC with PTG supports coherent sampling of waveforms, and DSP instructions run windowing and filtering locally. JTAG boundary scan (IEEE 1149.2 compatible) supports board-level production test, while in-circuit programming allows firmware field updates through a UART or I2C bootloader. The 44-QFN (8x8 mm) package keeps probe-head and handheld-instrument boards compact, and the extended temperature grade suits portable instruments used outdoors or in service bays.
おすすめ
Audio Signal Processing and Embedded Control
Embedded audio products - DSP front ends, amplifier protection, and microphone-array controllers - can exploit the DSP engine's single-cycle MAC and dual operand fetch for biquad filtering, limiters, and adaptive processing at 60 MIPS. The ADC captures line-level or post-AGC signals while PWM generates class-D modulator carriers; UART/I2C manage user interfaces and host communication. The 128KB FLASH holds coefficient tables and multiple tuning presets, switchable at runtime via CTMU capacitive touch inputs. For consumer enclosures the standard operating envelope suffices, while the E-grade -40C to +125C rating covers automotive and outdoor amplifier installations where ambient swings are severe.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP128GP504T-E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP128GP504-E/ML | DSPIC33EP128GP504T-I/ML | DSPIC33EP128GP504T-E/TL | DSPIC33EP256GP504T-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Program Memory (FLASH) | 128KB (43K x 24) | 128KB (43K x 24) | 128KB (43K x 24) | 128KB (43K x 24) | 256KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Packaging Format | Tape & Reel (T) | Tray/Tube | Tape & Reel (T) | Tape & Reel / Tray variant | Tape & Reel (T) |
主な差別化要因
- Extended -40C to +125C temperature rating （vs DSPIC33EP128GP504T-I/ML)
- Drop-in memory upgrade path within the same footprint （vs DSPIC33EP256GP504T-E/ML)
- Tape-and-reel delivery for automated assembly （vs DSPIC33EP128GP504-E/ML)
設計ノート
The 44-QFN (8x8) package uses an exposed pad on the underside that must be soldered to a grounded copper pour. Design the PCB with a matching thermal land pattern and an array of thermal vias (typically 4x4 grid of ~0.3 mm vias filled or tented) connecting to internal ground planes. This pour is simultaneously the primary thermal path and the return path for high-frequency PWM switching currents. Skimping on the exposed-pad connection is the most common QFN reliability failure in production - verify with X-ray or cross-section on first articles.
Decouple all VDD pins with 100 nF ceramic capacitors placed within 2 mm of each pin, plus a bulk 4.7 uF to 10 uF capacitor per supply domain. When the core runs at 60 MIPS with PWM outputs driving a gate-driver stage, supply ripple couples into ADC reference measurements; a clean AVDD rail (ferrite bead or RC filter from VDD) measurably improves ADC effective-number-of-bits. Follow the reference design guidance in Microchip's family datasheet power section rather than improvising the decoupling network.
Peripheral Pin Select (PPS) means most digital peripherals are NOT on fixed pins - a pin map copied from a PIC24 or older dsPIC33F design will silently misroute UART or PWM. Also verify temperature grade before substitution: the I-grade variant (DSPIC33EP128GP504T-I/ML) is only rated to +85C versus +125C for this E-grade part, so dropping in the cheaper I-grade in a hot enclosure will cause field failures. Finally, confirm the device ID in programmer scripts when moving between 128GP504 and 256GP504 memory variants.
コンプライアンス情報
Compliance statuses were not stated in the retrieved distributor data; verify via Microchip product page or DigiKey compliance documents for product 3674425 before green-manufacturing qualification.