DSPIC33EP128GP504T-E/ML - 16-bit 60 MIPS DSC 128KB Flash | Microchip
料号： DSPIC33EP128GP504T-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP128GP504T-E/ML 概述
A digital signal controller combines the deterministic control of a microcontroller with the math throughput of a DSP engine. Within the power-management hierarchy, the dsPIC33EP family sits above basic PIC16/PIC18 MCUs and below application-specific dsPIC33CH dual-core parts, offering a single high-performance core, hardware DSP multiply-accumulate instructions, and rich analog peripherals in a single chip. This makes the category the default choice for digital power conversion, motor control, and sensor conditioning.
Key features include the 16-bit dsPIC33E core with DSP instruction extensions, CAN 2.0B connectivity, I2C, SPI, UART/USART with IrDA and LINbus support, the Charge Time Measurement Unit (CTMU) for capacitive touch and time-domain measurements, high-speed PWM outputs for power conversion, and Peripheral Trigger Generators that let ADC conversions fire autonomously from PWM events - a hallmark of digital-power architectures.
Technically, the device integrates a 16-bit pipelined core with a hardware multiplier and DSP engine (40-bit wide accumulator, dual operand fetch), supporting C compilers (XC16) and the MPLAB X IDE ecosystem. In-circuit serial programming (ICSP) and JTAG boundary scan (IEEE 1149.2 compatible, per the family datasheet) support production programming and board-level test.
Typical applications include digital power supplies and PFC stages, BLDC/PMSM motor control, industrial sensing nodes, and automotive-adjacent subsystems requiring CAN - all leveraging the fast ADC, PWM, and CTMU peripherals.
Design consideration: the E temperature grade extends ambient operation to +125C, but verify total power dissipation and theta-JA of the 44-QFN with an exposed pad; a solid ground pour is required for thermal and signal-integrity performance.
This page synthesizes verified distributor data, same-family drop-in options, and practical design guidance not consolidated in the manufacturer datasheet.
直接替换替代料： DSPIC33EP128GP504T-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP128GP504T-E/ML （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, RAM, Core, Connectivity.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP128GP504-E/ML
✅ 直接替换✓ 有现货
$3.28 / 个
查看数据手册 →DSPIC33EP128GP504T-I/ML
✅ 直接替换✓ 有现货
$3.92 / 个
查看数据手册 →DSPIC33EP128GP504T-E/TL
✅ 直接替换✓ 有现货
$4.05 / 个
查看数据手册 →DSPIC33EP256GP504T-E/ML
✅ 直接替换✓ 有现货
$5.75 / 个
查看数据手册 →DSPIC33EP128GP504T-E/ML 最大额定值与电气特性
| Core | dsPIC33E, 16-bit |
| Max Core Speed | 60 MIPS |
| Program Memory | 128KB (43K x 24) FLASH |
| RAM | 8KB |
| Connectivity | CAN, I2C, SPI, UART/USART, IrDA, LINbus |
| 封装 | 44-QFN (8x8 mm), exposed pad |
| 工作温度 | -40C to +125C (extended, E grade) |
| 安装类型 | Surface Mount |
| Special Peripherals | CTMU, Peripheral Trigger Generator, high-speed PWM, op amps |
| Programming | ICSP, JTAG boundary scan (IEEE 1149.2 compatible) |
| Packaging | Tape & Reel (T suffix) |
| Family | dsPIC33EP General Purpose (GP) |
| 数据总线宽度 | 16 bit |
DSPIC33EP128GP504T-E/ML 44-qfn (8x8 mm), exposed pad 引脚配置指南
DSPIC33EP128GP504T-E/ML（44-qfn (8x8 mm), exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP128GP504T-E/ML.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP128GP504T-E/ML 适用于 6 应用s: Digital Power Supplies and PFC, BLDC / PMSM Motor Control, Industrial Sensing and IoT Nodes, Automotive-Adjacent CAN Nodes, Test and Measurement Instrumentation, Audio Signal Processing and Embedded Control.
Digital Power Supplies and PFC
The DSPIC33EP128GP504T-E/ML fits digital switch-mode power supplies and power-factor-correction stages because its high-speed PWM modules pair directly with fast ADC sampling through the Peripheral Trigger Generator, allowing current-loop compensation to run at switching frequency with deterministic latency. The 16-bit DSP engine executes PID and 3P3Z compensator math with single-cycle multiply-accumulate on a 40-bit accumulator, achieving the loop bandwidth that analog controllers deliver without their component drift. Placed as the sole supervisory controller, it handles soft-start, fault latching, and PMBus-style telemetry over UART or I2C. The -40C to +125C E-grade rating suits power electronics where ambient near the controller routinely exceeds +85C.
推荐
BLDC / PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EP128GP504T-E/ML provides the standard FOC recipe: high-speed PWM drives a three-phase inverter gate stage, the ADC samples phase currents synchronized to PWM center via the Peripheral Trigger Generator, and the DSP engine executes Clarke/Park transforms and PI current loops at multi-kHz rates. The integrated op-amp peripherals can condition shunt currents, reducing external component count. CAN connectivity links the drive to a higher-level network controller, while CTMU supports sensorless commutation schemes. The extended -40C to +125C temperature range covers sealed motor-drive enclosures where controller ambient tracks the power stage.
推荐
Industrial Sensing and IoT Nodes
In industrial sensing nodes, the DSPIC33EP128GP504T-E/ML acts as the intelligent edge controller: the CTMU measures capacitance for touch or proximity sensing and can perform precise time-domain measurements, while SPI and I2C connect external precision ADCs and MEMS sensors. The 128KB FLASH stores protocol stacks and local calibration tables, and the 8KB RAM buffers sensor streams before forwarding over CAN, UART, or LINbus to a gateway. DSP instructions enable on-node FFT-based vibration or acoustic analysis, offloading the host. The QFN-44 footprint with 8x8 mm body fits compact sensor pucks, and the E-grade temperature rating supports outdoor and rooftop installations.
推荐
Automotive-Adjacent CAN Nodes
The DSPIC33EP128GP504T-E/ML is well positioned for off-road, agricultural, and auxiliary automotive-adjacent modules that need CAN 2.0B connectivity and robust analog control but not full ASIL qualification. The integrated CAN controller implements standard and extended frames without external silicon, the high-speed PWM handles lamp ballast, pump, or actuator control, and CTMU enables capacitive human-machine interfaces (touch buttons on a sealed panel). The -40C to +125C operating envelope matches underhood and engine-bay-adjacent ambient conditions. Firmware for CAN descriptors and network management runs comfortably in the 128KB FLASH with room for OTA-style bootloaders over UART or CAN.
推荐
Test and Measurement Instrumentation
Bench and embedded instruments benefit from the DSPIC33EP128GP504T-E/ML's combination of a 60 MIPS DSP core and measurement-oriented peripherals. The CTMU provides precise charge-based time interval and capacitance measurement, the ADC with PTG supports coherent sampling of waveforms, and DSP instructions run windowing and filtering locally. JTAG boundary scan (IEEE 1149.2 compatible) supports board-level production test, while in-circuit programming allows firmware field updates through a UART or I2C bootloader. The 44-QFN (8x8 mm) package keeps probe-head and handheld-instrument boards compact, and the extended temperature grade suits portable instruments used outdoors or in service bays.
推荐
Audio Signal Processing and Embedded Control
Embedded audio products - DSP front ends, amplifier protection, and microphone-array controllers - can exploit the DSP engine's single-cycle MAC and dual operand fetch for biquad filtering, limiters, and adaptive processing at 60 MIPS. The ADC captures line-level or post-AGC signals while PWM generates class-D modulator carriers; UART/I2C manage user interfaces and host communication. The 128KB FLASH holds coefficient tables and multiple tuning presets, switchable at runtime via CTMU capacitive touch inputs. For consumer enclosures the standard operating envelope suffices, while the E-grade -40C to +125C rating covers automotive and outdoor amplifier installations where ambient swings are severe.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP128GP504T-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP128GP504-E/ML | DSPIC33EP128GP504T-I/ML | DSPIC33EP128GP504T-E/TL | DSPIC33EP256GP504T-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Program Memory (FLASH) | 128KB (43K x 24) | 128KB (43K x 24) | 128KB (43K x 24) | 128KB (43K x 24) | 256KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Packaging Format | Tape & Reel (T) | Tray/Tube | Tape & Reel (T) | Tape & Reel / Tray variant | Tape & Reel (T) |
关键差异点
- Extended -40C to +125C temperature rating （对比 DSPIC33EP128GP504T-I/ML)
- Drop-in memory upgrade path within the same footprint （对比 DSPIC33EP256GP504T-E/ML)
- Tape-and-reel delivery for automated assembly （对比 DSPIC33EP128GP504-E/ML)
设计说明
The 44-QFN (8x8) package uses an exposed pad on the underside that must be soldered to a grounded copper pour. Design the PCB with a matching thermal land pattern and an array of thermal vias (typically 4x4 grid of ~0.3 mm vias filled or tented) connecting to internal ground planes. This pour is simultaneously the primary thermal path and the return path for high-frequency PWM switching currents. Skimping on the exposed-pad connection is the most common QFN reliability failure in production - verify with X-ray or cross-section on first articles.
Decouple all VDD pins with 100 nF ceramic capacitors placed within 2 mm of each pin, plus a bulk 4.7 uF to 10 uF capacitor per supply domain. When the core runs at 60 MIPS with PWM outputs driving a gate-driver stage, supply ripple couples into ADC reference measurements; a clean AVDD rail (ferrite bead or RC filter from VDD) measurably improves ADC effective-number-of-bits. Follow the reference design guidance in Microchip's family datasheet power section rather than improvising the decoupling network.
Peripheral Pin Select (PPS) means most digital peripherals are NOT on fixed pins - a pin map copied from a PIC24 or older dsPIC33F design will silently misroute UART or PWM. Also verify temperature grade before substitution: the I-grade variant (DSPIC33EP128GP504T-I/ML) is only rated to +85C versus +125C for this E-grade part, so dropping in the cheaper I-grade in a hot enclosure will cause field failures. Finally, confirm the device ID in programmer scripts when moving between 128GP504 and 256GP504 memory variants.
合规信息
Compliance statuses were not stated in the retrieved distributor data; verify via Microchip product page or DigiKey compliance documents for product 3674425 before green-manufacturing qualification.