DSPIC33EP32GS502-E/MM - 16-bit 70 MIPS DSC 32KB Flash | Microchip
部品番号: DSPIC33EP32GS502-E/MM ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.98 | $4.98 |
| 10 | $4.55 | $45.50 |
| 100 | $3.98 | $398.00 |
| 500 | $3.6 | $1,800.00 |
| 1,000 | $3.25 | $3,250.00 |
DSPIC33EP32GS502-E/MM 概要
A Digital Signal Controller combines the computational throughput of a Digital Signal Processor (DSP) with the peripheral set and deterministic control of a microcontroller (MCU). Within the power-management hierarchy, a DSC such as the dsPIC33EP32GS502 replaces discrete analog control loops, closing voltage and current feedback digitally to achieve tighter regulation, programmable protection and software-defined topologies in Switched-Mode Power Supplies (SMPS).
Key features include the interconnected high-speed PWM module with advanced switching modes (complementary, push-pull, phase-shifted, multi-phase) supporting dead-time insertion and fault handling; a high-speed 10-bit ADC with PGA enabling direct connection of low-amplitude current-shunt signals; on-chip comparators and DAC for hardware-based cycle-by-cycle current limiting; and DMA for low-overhead data transfer.
Architecturally, the device belongs to the dsPIC33EP series (AEC-Q100 qualified, Functional Safety FuSa supported per DigiKey), built on a 16-bit modified Harvard core with DSP instructions (barrel shifter, MAC), operating from a 3.0V to 3.6V supply. The GS (digital power) variant distinguishes itself from the GP (general purpose) family through its power-specific analog and PWM interconnect fabric.
Typical applications include SMPS digital power supplies, 350W interleaved Power Factor Correction (PFC) reference designs from Microchip, DC-DC converters, LED drivers, battery chargers, solar micro-inverters, and automotive power modules.
Design consideration: use the exposed pad as the primary ground path on the PCB, and leverage the PGA to reduce external analog front-end cost; verify loop stability by sampling at PWM-frequency-synchronized rates.
This page synthesizes distributor pricing, drop-in family alternatives, pin-level guidance and design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP32GS502-E/MM — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP32GS502-E/MM （同一形状・フットプリント） — 相違点: Functional Safety, Package.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP32GS502-E/MMVAO
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33EP32GS502-I/MM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33EP64GS502
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP16GS502
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32GS502-E/MM 最大定格＆電気的特性
| Core | 16-bit dsPIC33EP DSC core |
| Max MIPS | 70 MIPS (up to 60 MIPS per DigiKey listing) |
| Program Memory (Flash) | 32 KB (32K x 8) |
| 電源電圧 | 3.0 V to 3.6 V (nominal 3.3 V) |
| パッケージ | 28-QFN-S (6x6 mm), exposed pad |
| 動作温度 | -40C to +125C (E grade) |
| Qualification | Automotive, AEC-Q100 (per Hotenda listing) |
| Functional Safety | FuSa supported (per DigiKey) |
| Series | dsPIC 33EP (GS digital power family) |
| High-Speed PWM | Interconnected high-speed PWM for digital power |
| ADC | High-speed ADC with PGA |
| DAC | On-chip DAC |
| Comparators | On-chip comparators |
| Status | In Production (Microchip) |
| 実装タイプ | Surface Mount |
| Technology | CMOS |
DSPIC33EP32GS502-E/MM 28-qfn-s (6x6 mm), exposed pad ピン配置ガイド
DSPIC33EP32GS502-E/MM (28-qfn-s (6x6 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP32GS502-E/MM.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP32GS502-E/MM の用途: 6 件s: Digital SMPS Power Supplies, Interleaved Power Factor Correction (PFC), LED Drivers and Lighting, Automotive Power Modules, Battery Chargers, Solar Micro-Inverters and DC-DC Converters.
Digital SMPS Power Supplies
The DSPIC33EP32GS502-E/MM was designed by Microchip specifically as the control IC for digital Switched-Mode Power Supplies (SMPS). Its interconnected high-speed PWM generates complementary outputs with programmable dead-time, while the high-speed ADC with PGA samples output voltage and shunt current synchronized to the PWM cycle, enabling digital voltage-mode, current-mode or multi-loop control without external analog error amplifiers. The on-chip DAC and comparators implement hardware cycle-by-cycle overcurrent limiting with sub-microsecond response. Placed as the sole controller in an AC-DC or DC-DC stage, it replaces dozens of analog components, allows firmware-tunable loop compensation, and supports intelligent features such as soft-start profiling and adaptive dead-time that improve efficiency by several percent in typical 100-500W converters.
おすすめ
Interleaved Power Factor Correction (PFC)
Microchip's 350W interleaved PFC reference design demonstrates the DSPIC33EP32GS502 controlling two interleaved boost phases with universal AC input producing a high-voltage DC output. The part's multiple high-speed PWM channels drive the two phase legs with 180-degree interleaving, reducing input ripple current and easing EMI filter design. The high-speed ADC samples inductor currents through the PGA each switching cycle, and digital compensators (implemented in firmware using the DSP MAC instructions at up to 70 MIPS) regulate the DC bus. Cycle-by-cycle comparator protection limits fault currents faster than software could react. Using this DSC, designers achieve power factors above 0.99 and can adapt control parameters across the 90-264 VAC universal input range purely in firmware.
おすすめ
LED Drivers and Lighting
Digital LED driver ballasts benefit from the DSPIC33EP32GS502-E/MM's combination of high-resolution PWM dimming and fast current regulation. The high-speed PWM produces constant-current drive for LED strings at 100 kHz-class switching frequencies, while the ADC-with-PGA path measures shunt current and the comparators provide hardware overcurrent shutdown. The 10-bit ADC feedback supports precise dimming and thermal fold-back algorithms executed in firmware, and the -40C to +125C extended temperature grade suits enclosed luminaires with hot internal ambients. Because dimming curves, color temperature mixing and fault policies are firmware parameters, a single hardware design can serve multiple product SKUs, reducing BOM variants for lighting manufacturers and shortening development cycles.
おすすめ
Automotive Power Modules
With AEC-Q100 qualification and the -40C to +125C E-grade temperature rating reported by Hotenda and Microchip USA, the DSPIC33EP32GS502-E/MM is appropriate for automotive power conversion nodes such as LED headlamp drivers, DC-DC auxiliary converters, and battery-management sub-systems. The 28-QFN-S 6x6 mm package with exposed pad provides a low-inductance ground reference and good thermal path on standard PCB copper pours. Functional Safety (FuSa) support noted by DigiKey aids ISO 26262-oriented development, and the MMVAO automotive ordering variant gives traceability expected in vehicle programs. The interconnected PWM/ADC fabric closes current loops cycle-by-cycle, which is essential for automotive converters that must ride through load-dump and cold-crank transients while protecting downstream electronics.
おすすめ
Battery Chargers
Multi-chemistry battery chargers use the DSPIC33EP32GS502-E/MM to implement CC/CV charging profiles, termination detection and protective cutoffs in firmware. The high-speed ADC with PGA measures battery current and voltage at PWM-synchronized points, avoiding switching-noise-corrupted readings, and the on-chip DAC sets comparator thresholds for hardware overcurrent protection. At up to 70 MIPS, the core can simultaneously run the charging state machine, temperature-based charge derating (via NTC ADC channels), and a communication interface to a host. The 32KB Flash accommodates multi-protocol charging logic for Li-ion, lead-acid and NiMH chemistries in one design, while the 28-QFN-S (6x6) footprint keeps charger PCB area compact for portable and embedded charging applications.
おすすめ
Solar Micro-Inverters and DC-DC Converters
Solar micro-inverters and high-voltage DC-DC converters require phase-shifted and resonant-topology control that the DSPIC33EP32GS502-E/MM's high-speed PWM module supports natively, including phase-shifted full-bridge and multi-phase modes with precise dead-time control. The fast ADC samples panel voltage/current and the DC bus each cycle, feeding MPPT (Maximum Power Point Tracking) algorithms that execute comfortably within the 70 MIPS budget. On-chip comparators provide hardware-level protection against transformer saturation or overcurrent events. The extended -40C to +125C rating matches rooftop environmental profiles, and the 6x6 mm QFN-S package suits the compact, sealed enclosures typical of micro-inverters. Firmware-defined control also enables grid-support functions to be updated in the field without hardware changes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP32GS502-E/MM — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP32GS502-E/MMVAO | DSPIC33EP32GS502-I/MM | DSPIC33EP64GS502 | DSPIC33EP16GS502 |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm), exposed pad | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) on -MM variant - same | 28-QFN-S (6x6 mm) on -MM variant - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 32 KB (32K x 8) | 32 KB | 32 KB | 64 KB (+100%) | 16 KB (-50%) |
| Max MIPS | 70 MIPS | 70 MIPS (same die) | 70 MIPS | 70 MIPS | 70 MIPS |
| Digital Power Peripherals | High-speed PWM + ADC with PGA + DAC + comparators | Identical | Identical | Identical | Identical |
主な差別化要因
- Extended temperature range for hot environments （vs DSPIC33EP32GS502-I/MM)
- Automotive traceability （vs DSPIC33EP32GS502-I/MM)
- Balanced 32KB Flash for digital power firmware （vs DSPIC33EP64GS502)
- Power-specific peripheral interconnect （vs DSPIC33EP32GP502 (general purpose family))
設計ノート
The exposed pad on the 28-QFN-S (6x6) package is the primary ground and thermal path. Connect it to a solid ground plane via an array of thermal vias (typically 4-9 vias under the pad). Route high-current PWM outputs (gate drives) with short, wide traces and keep the power loop (input cap - switch - inductor) tight to minimize ringing that could couple into the ADC inputs. Place the VDD/VSS decoupling (0.1 uF ceramic) within 2-3 mm of the supply pins, per Microchip layout guidance in the digital power application notes.
The device operates from 3.0V to 3.6V; power it from a clean 3.3V LDO or filtered rail, not directly from a switching node. Estimated: at 70 MIPS and typical dsPIC33EP core current, consumption is on the order of tens of mA - budget the controller supply separately from gate-drive power. Use an RC or ferrite filter between the 3.3V rail and AVDD to keep ADC noise low; the on-chip PGA amplifies shunt signals, so supply noise directly degrades current-loop accuracy.
Do not assume GPIO equivalence across dsPIC33 variants: the GS family's 28-QFN-S pin map is heavily multiplexed (digital I/O, analog channels, PWM outputs, PPS remapping) and differs from the GP502. Verify every pin assignment against the official 390-page datasheet pin diagram before layout release. Also, the -E grade supports +125C junction while the -I grade stops at +85C - using an -I part in a hot SMPS enclosure is a common field-failure cause. Sample the ADC synchronized to PWM (triggered mode) rather than free-running to avoid switching-noise-corrupted readings.
コンプライアンス情報
AEC-Q100 automotive qualification and -40C to +125C grade per Hotenda product listing. RoHS/REACH/lead-free status not stated in the provided web data - verify on the Microchip product page (microchip.com/en-us/product/dsPIC33EP32GS502).
