DSPIC33EP256GP502-H/MM - 256KB 60 MIPS DSC | Microchip
部品番号: DSPIC33EP256GP502-H/MM ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.68 | $5.68 |
| 10 | $5.12 | $51.20 |
| 100 | $4.55 | $455.00 |
| 500 | $4.1 | $2,050.00 |
| 1,000 | $3.72 | $3,720.00 |
DSPIC33EP256GP502-H/MM 概要
A digital signal controller combines the deterministic control flow of a microcontroller with the DSP engine (single-cycle MAC, divide, modulo addressing) of a digital signal processor. Within the power-management hierarchy, a DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33 family a common choice for closed-loop control systems such as digital power conversion and motor drives.
Key features include the dsPIC33E 16-bit core running at up to 60 MIPS on this speed/temperature grade, 256KB of self-programmable FLASH, 16-32KB of SRAM (distributor listings report 16KB and 32KB variants of the family; see validation note), and rich analog integration with on-chip op amps, a CTMU charge-time measurement unit and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing.
The architecture provides a flexible interrupt system, multiple PGECx/PGEDx In-Circuit Serial Programming (ICSP) debug channel pairs, and enhanced CAN communication, positioning the device for fieldbus-connected embedded nodes. Hi-speed PWM peripherals support switching power stages and actuator control, while the advanced analog block reduces external component count in sensor front ends.
Typical applications include automotive control modules, industrial automation and motor control, CAN-based communication nodes, digital power supplies, and precision sensor systems that exploit the on-chip op amps and CTMU for capacitive or time-domain measurements.
Design consideration: verify the exact SRAM figure for your speed and temperature ordering code against the family datasheet before locking the memory map, and use any matched PGECx/PGEDx pair for ICSP while keeping all VDD and VSS pins connected.
This page synthesizes distributor pricing, drop-in family alternatives, pinout guidance and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP256GP502-H/MM — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP256GP502-H/MM （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Qualification, SRAM, Lifecycle Status.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP256GP502-I/MM
✅ ドロップイン✓ 在庫あり
$3.79 / 個
データシートを見る →DSPIC33EP256GP502-E/MM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33EP128GP502-H/MM
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33EP64GP502-H/MM
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP128MC202T-E/MM
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.41 / 個
データシートを見る →DSPIC33EP256GP502-H/MM 最大定格＆電気的特性
| Core | 16-bit dsPIC33E DSC |
| Core Speed | 60 MIPS |
| Program Memory | 256KB (85.5K x 24) FLASH |
| SRAM | 32KB (some distributor listings state 16KB - verify against family datasheet) |
| 電源電圧 | 3.3 V (3.0 V to 3.6 V) |
| Connectivity | CAN, I2C, SPI, UART/USART, IrDA, LIN |
| Analog Peripherals | On-chip Op Amps, CTMU, ADC |
| Timing Peripherals | Hi-Speed PWM, Timers, RTCC |
| Special Peripherals | Peripheral Trigger Generator (PTG) |
| 動作温度 | -40C to +150C (-H grade) |
| Qualification | AEC-Q100 (Automotive) |
| パッケージ | 28-QFN-S (6x6 mm), exposed pad |
| 実装タイプ | Surface Mount |
| Debug / Programming | ICSP via multiple PGECx/PGEDx pairs |
| ライフサイクル状態 | In Production (per Microchip product page) |
| Series | dsPIC 33EP (dsPIC33EP256GP502) |
DSPIC33EP256GP502-H/MM ピン構成
| ピン 1 | MCLR — Master Clear (reset) input / programming voltage |
| ピン 2 | AN0/RB0 — Analog input 0 / digital I/O PORTB bit 0 |
| ピン 3 | AN1/RB1 — Analog input 1 / digital I/O PORTB bit 1 |
| ピン 4 | AN2/RB2 — Analog input 2 / digital I/O PORTB bit 2 |
| ピン 5 | AN3/RB3 — Analog input 3 / digital I/O PORTB bit 3 |
| ピン 6 | VSS — Ground reference |
| ピン 7 | VDD — Positive supply (3.0V-3.6V) |
| ピン 8 | AN4/RB4 — Analog input 4 / digital I/O PORTB bit 4 |
| ピン 9 | AN5/RB5 — Analog input 5 / digital I/O PORTB bit 5 |
| ピン 10 | VSS — Ground reference |
| ピン 11 | OSC1/RC12 — Oscillator crystal input / external clock input |
| ピン 12 | OSC2/RC15 — Oscillator crystal output / clock output |
| ピン 13 | PGED1/RB6 — ICSP data channel 1 / AN6 / digital I/O |
| ピン 14 | PGEC1/RB7 — ICSP clock channel 1 / AN7 / digital I/O |
| ピン 15 | AN8/RB8 — Analog input 8 / external interrupt INT0 / digital I/O |
| ピン 16 | AN9/RB9 — Analog input 9 / input capture / digital I/O |
| ピン 17 | AN10/RB10 — Analog input 10 / digital I/O PORTB bit 10 |
| ピン 18 | AN11/RB11 — Analog input 11 / digital I/O PORTB bit 11 |
| ピン 19 | AN12/RB12 — Analog input 12 / digital I/O PORTB bit 12 |
| ピン 20 | AN13/RB13 — Analog input 13 / digital I/O PORTB bit 13 |
| ピン 21 | AN14/RB14 — Analog input 14 / digital I/O PORTB bit 14 |
| ピン 22 | AN15/RB15 — Analog input 15 / digital I/O PORTB bit 15 |
| ピン 23 | VDD — Positive supply (3.0V-3.6V) |
| ピン 24 | VSS — Ground reference |
| ピン 25 | AVDD — Analog positive supply (connect to VDD) |
| ピン 26 | AVSS — Analog ground reference |
| ピン 27 | RP18/RF2 — Remappable peripheral pin (SDA1) / digital I/O |
| ピン 28 | RP19/RF3 — Remappable peripheral pin (SCL1) / digital I/O |
主な用途
DSPIC33EP256GP502-H/MM の用途: 6 件s: Automotive Control Modules, Industrial Automation and Motor Control, CANbus Communication Nodes, Digital Power Conversion, Precision Sensor Systems, Portable and Battery-Powered Instruments.
Automotive Control Modules
The DSPIC33EP256GP502-H/MM fits automotive electronic control units because it combines AEC-Q100 qualification with the -40C to +150C -H temperature grade, covering under-hood and transmission-adjacent thermal environments where commercial-grade MCUs fail. The 60 MIPS 16-bit core executes closed-loop control algorithms with deterministic latency, while the integrated CAN peripheral provides direct in-vehicle network connectivity without an external CAN controller. The 256KB FLASH accommodates diagnostic layers and OTA-resilient bootloader structures typical of automotive firmware. Placed in a 28-QFN-S (6x6 mm) package with exposed pad soldered to a ground pour, the device dissipates minimal power at 3.3V, simplifying thermal design; the principal consideration is supply transient immunity per automotive load-dump requirements.
おすすめ
Industrial Automation and Motor Control
In industrial automation, the DSPIC33EP256GP502-H/MM serves as a compact control node driving actuators, valves and small motors. The dsPIC33E core's DSP engine (single-cycle MAC) executes field-oriented control and PID loops at 60 MIPS, while Hi-Speed PWM peripherals generate the switching waveforms for power stages. The -40C to +150C rating tolerates hot cabinet environments, and the Peripheral Trigger Generator (PTG) sequences ADC sampling and PWM updates autonomously, offloading the CPU. Using the 28-QFN-S MM footprint keeps the controller close to gate drivers, shortening analog traces; designers should place the ADC input filters away from PWM switching noise and use the multiple PGECx/PGEDx pairs for field firmware updates via a production test header.
おすすめ
CANbus Communication Nodes
The DSPIC33EP256GP502-H/MM is well suited as an intelligent CAN node in building automation, agricultural equipment and industrial fieldbus networks, because Enhanced CAN is integrated on-chip and supported by Microchip's application libraries, eliminating external CAN silicon. With 256KB FLASH, the node can host protocol stacks, diagnostics and logging buffers in the on-chip SRAM while maintaining 60 MIPS of headroom for application logic. The -H temperature grade allows mounting near heat sources on the network edge. Typical topology: CAN TX/RX through a transceiver such as the MCP2562 with a 120-ohm termination at the bus ends; the MCU handles filtering and message prioritization in hardware, and the PTG can trigger periodic transmission frames without CPU intervention, lowering worst-case interrupt latency.
おすすめ
Digital Power Conversion
Digital power supplies, LED drivers and battery chargers benefit from the DSPIC33EP256GP502-H/MM's combination of Hi-Speed PWM outputs, fast ADC sampling and a DSP core for control-law computation. The PTG enables autonomous PWM-ADC-PWM loops, achieving consistent control periods that reduce output ripple and improve transient response compared with pure software timing. The -40C to +150C rating allows placement near hot converter stages, though keeping the controller physically separated from the magnetics remains best practice. The 28-QFN-S (6x6 mm) exposed-pad package provides a low-inductance ground reference important for clean ADC readings; connect the pad directly to a solid ground plane and decouple all VDD/AVDD pins with 100nF ceramics placed within 2mm of the pins.
おすすめ
Precision Sensor Systems
The on-chip operational amplifiers, CTMU (Charge Time Measurement Unit) and ADC make the DSPIC33EP256GP502-H/MM a strong fit for sensor front ends: bridge sensors, capacitive touch/proximity and time-domain measurements can be conditioned and digitized without external amplifier ICs. The 60 MIPS core applies filtering (IIR/FIR) and calibration math in real time on the 3.3V rail. The -H grade suits outdoor and engine-bay sensor packages. Design considerations: use the on-chip op amps in unity-gain buffering for high-impedance sources, exploit the CTMU for ratiometric capacitive measurement with matched external charge capacitors, and route analog signals on a quiet ground island beneath the AVDD/AVSS pins to preserve effective ADC resolution.
おすすめ
Portable and Battery-Powered Instruments
Handheld measurement and diagnostic instruments use the DSPIC33EP256GP502-H/MM for its dense integration: CAN, I2C, SPI, UART/IrDA and LIN on one 16-bit 60 MIPS core reduce board area, and the 28-QFN-S (6x6 mm) package fits compact enclosures. The 256KB FLASH holds GUI logic, logging and communication stacks without external memory, supporting single-chip BOMs that extend battery life. Operating from a single 3.0V-3.6V lithium cell via an LDO is straightforward; sleep and idle modes reduce average current between measurements. The -40C to +150C range, while beyond handheld requirements, guarantees margin against enclosed solar or vehicular installations. For lowest power, clock the core at reduced MIPS during idle periods and use the UART/IrDA interface for periodic data offload.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP256GP502-H/MM — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP256GP502-I/MM | DSPIC33EP256GP502-E/MM | DSPIC33EP128GP502-H/MM | DSPIC33EP128GP502-H/SO |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6, MM) | 28-QFN-S (6x6, MM) - same | 28-QFN-S (6x6, MM) - same | 28-QFN-S (6x6, MM) - same | SOIC-28 (different footprint) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| FLASH | 256KB | 256KB | 256KB | 128KB | 128KB |
| Operating Temperature | -40C to +150C | -40C to +85C | -40C to +125C | -40C to +150C | -40C to +150C |
| Connectivity | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production |
主な差別化要因
- Highest automotive temperature grade in the family （vs DSPIC33EP256GP502-I/MM)
- Double the program memory of the 128GP variant （vs DSPIC33EP128GP502-H/MM)
- Same-die temperature downgrades enable cost optimization （vs DSPIC33EP256GP502-E/MM)
- General-purpose analog integration vs motor-control variants （vs DSPIC33EP128MC202T-E/MM)
設計ノート
Connect the QFN exposed pad to a solid VSS pour with an array of thermal vias. Connect all VDD pins (7, 23) and AVDD (25) to the 3.3V rail, each decoupled with 100nF ceramic capacitors placed within 2mm of the pin, plus one 4.7uF-10uF bulk capacitor near the supply entry. Keep AVSS/AVSS Analog ground return separate from high-current PWM return paths to preserve ADC accuracy.
ICSP requires matched PGECx/PGEDx pairs: if PGEC2 is used for ICSPCLK, ICSPDAT must connect to PGED2. Mixing channels from different pairs is the most common bring-up failure. Reserve one pair for a programming header on production boards. Additionally, verify the SRAM figure for your exact ordering code against the family datasheet before finalizing the linker memory map.
Estimated: at 60 MIPS with typical I/O loading, core current is on the order of tens of milliamps at 3.3V (well under 0.2W dissipation), so the 28-QFN-S package rarely needs heatsinking. However, for -H grade operation above +125C ambient, verify the junction temperature using the datasheet theta-JA and your PCB copper area, and consider the -E or -I grades if the enclosure stays below +85C/+125C to reduce cost.
Route the oscillator (OSC1/OSC2) traces short and symmetric with ground guarding, keep CAN transceiver stubs under 5cm with proper split termination, and separate analog input routing (RB0-RB15 analog functions) from PWM and clock traces on the top layer. Use a ground plane on layer 2 beneath the controller to provide a low-inductance return for the remappable RP pin signals.
コンプライアンス情報
Distributor listings (DigiKey, Hotenda) explicitly market the part as 'Automotive, AEC-Q100'. RoHS/REACH/lead-free status not stated in provided data - confirm on Microchip's product page.
