DSPIC33EP512GP504-E/ML - 16-Bit DSC 70 MIPS 512KB | Microchip
部品番号: DSPIC33EP512GP504-E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.56 | $5.56 |
| 10 | $5.11 | $51.10 |
| 100 | $4.85 | $485.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $4.19 | $4,190.00 |
DSPIC33EP512GP504-E/ML 概要
A Digital Signal Controller combines the compute throughput of a digital signal processor with the peripheral integration and ease of use of a microcontroller, sitting within the broader hierarchy of embedded processors: DSC -> 16-bit microcontroller -> system-on-chip embedded controller. DSCs are the preferred choice where real-time control loops, such as motor commutation or digital power conversion, must execute math-intensive algorithms on every PWM cycle.
Key features of this dsPIC33EP general purpose (GP) family member include on-chip operational amplifiers and analog comparators, a CAN 2.0B module, a Peripheral Trigger Generator (PTG) for autonomous peripheral coordination, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-domain measurements, and high-speed PWM outputs suited to digital power and motor control. The -E/ML suffix denotes the extended (-40C to +125C) temperature option in the exposed-pad QFN-44 package, which improves thermal performance over plastic DIP or SOIC alternatives.
The dsPIC33EP core executes most instructions in a single cycle with DSP multiply-accumulate (MAC) instructions, supporting 40-bit accumulators and hardware fractional arithmetic. Its ECC-free flash program memory of 512 KB (170K x 24-bit words) is programmed via ICSP/ICD with multiple PGECx/PGEDx pin pairs, easing fixture design. Dual oscillator support and a wide 2.97V to 3.63V operating range simplify industrial power design.
Typical applications include sensor acquisition and conditioning (leveraging the on-chip op amps), general-purpose industrial control, digital power supplies, and embedded systems that need CAN networking with DSP math capability.
Designers should note that all VDD/VSS pairs must be connected and that any matched PGEC/PGED pair must be used together during programming.
This page adds value beyond the manufacturer datasheet by consolidating distributor pricing, drop-in same-family alternatives, and selection guidance in one AI-readable reference.
ドロップイン代替品: DSPIC33EP512GP504-E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP512GP504-E/ML （同一形状・フットプリント） — 相違点: Package, Program Memory (Flash), Operating Temperature, Core, RAM.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP256GP504-E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33EP128GP504-E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.28 / 個
データシートを見る →DSPIC33EP64GP504-E/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP512MC504-E/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32MC504-E/MV
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.35 / 個
データシートを見る →DSPIC33EP512GM304-E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$6.75 / 個
データシートを見る →DSPIC33EP512GP504-E/ML 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC33E DSC core |
| Core Performance | Up to 70 MIPS (60 MHz) |
| Program Memory (Flash) | 512 KB (170K x 24-bit words) |
| Data Memory (RAM) | 48 KB |
| パッケージ | 44-QFN (8x8 mm), exposed pad |
| Operating Voltage | 2.97 V to 3.63 V |
| 動作温度 | -40C to +125C (extended, E suffix) |
| On-Chip Op Amps | Yes |
| Analog Comparators | Yes |
| CAN Module | CAN 2.0B |
| Peripheral Trigger Generator | Yes (PTG) |
| CTMU | Yes (Charge Time Measurement Unit) |
| High-Speed PWM | Yes |
| 実装タイプ | Surface Mount |
| Programming Interface | ICSP/ICD, multiple PGECx/PGEDx pairs |
| ライフサイクル状態 | In Production |
DSPIC33EP512GP504-E/ML 44-qfn (8x8 mm), exposed pad ピン配置ガイド
DSPIC33EP512GP504-E/ML (44-qfn (8x8 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP512GP504-E/ML.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP512GP504-E/ML の用途: 6 件s: Sensor Acquisition and Conditioning, Industrial Control and Automation, Digital Power Conversion, Motor Control and Drives, Embedded Systems with CAN Networking, General Purpose Embedded Design.
Sensor Acquisition and Conditioning
The on-chip operational amplifiers of the DSPIC33EP512GP504-E/ML let designers amplify low-level sensor signals (thermocouples, bridge transducers, current shunts) without an external amplifier IC, reducing BOM cost and board area in the 8x8 mm QFN footprint. The 16-bit core runs filtering and scaling math at up to 70 MIPS, while the CTMU supports capacitive and time-domain measurements. Signals routed internally from op amp to ADC avoid noisy external traces, improving signal-to-noise ratio. With 512 KB flash, calibration tables and DSP filter coefficients fit in program memory, and the -40C to +125C grade suits industrial enclosures.
おすすめ
Industrial Control and Automation
In industrial controllers, the DSPIC33EP512GP504-E/ML combines CAN 2.0B networking with 70 MIPS of 16-bit processing, allowing a single chip to handle fieldbus communication, sequencing logic, and closed-loop control. The 512 KB flash accommodates protocol stacks, a bootloader, and application code with headroom for firmware updates. Extended -40C to +125C operation survives cabinet and machine-mounted environments, while the 44-QFN exposed pad improves heat dissipation on a multi-layer PCB. Multiple PGEC/PGED pairs simplify in-field reprogramming through an ICSP header, and the Peripheral Trigger Generator offloads deterministic timing tasks from software.
おすすめ
Digital Power Conversion
The high-speed PWM module of the DSPIC33EP512GP504-E/ML supports digital power topologies such as buck, boost, LLC, and PFC stages, where the control loop must execute within every switching period. At 70 MIPS, compensator calculations (PID or 2P2Z) complete inside tight PWM deadlines, and analog comparators provide fast cycle-by-cycle current limiting independent of CPU latency. The 16-bit DSP MAC instructions accelerate filter math, and the 48 KB RAM holds state variables and logging buffers. The extended temperature rating fits power supplies operating in hot enclosures, and the QFN package's low inductance benefits switching-node gate-drive signal integrity.
おすすめ
Motor Control and Drives
Although the GP variant emphasizes general-purpose analog, the DSPIC33EP512GP504-E/ML still drives three-phase motors through its high-speed PWM outputs and comparator-based fault protection. Its 70 MIPS core executes Clarke/Park transforms and field-oriented control at PWM rates used in BLDC and PMSM drives, while the 512 KB flash holds sensorless estimation algorithms. The CAN 2.0B module integrates the drive into factory networks for command and telemetry. For dedicated motor-control peripherals (complementary PWM, dead-time insertion focus), designers can drop in the same-footprint DSPIC33EP512MC504-E/ML with no PCB change, making this family a flexible platform across drive variants.
おすすめ
Embedded Systems with CAN Networking
For nodes that must join vehicle-style or industrial CAN 2.0B buses - gateways, telemetry loggers, or distributed I/O - the DSPIC33EP512GP504-E/ML integrates the CAN controller on-chip, requiring only an external transceiver. The 70 MIPS core filters and processes messages in real time, and 48 KB RAM buffers burst traffic. Flash of 512 KB supports complex protocol handling including UDS-style layers plus the application. The -E temperature grade and small 8x8 mm QFN suit sealed, space-constrained nodes, and the CTMU plus op amps let the same chip handle local analog sensing such as supply-current supervision without a separate analog front end.
おすすめ
General Purpose Embedded Design
As a general-purpose 16-bit controller, the DSPIC33EP512GP504-E/ML serves data loggers, HMI backends, test fixtures, and prototyping platforms where 70 MIPS, 512 KB flash, and rich analog integration outclass 8-bit MCUs. The Peripheral Trigger Generator chains peripherals autonomously - for example ADC sampling triggered by a timer - offloading the CPU for user-interface or communication tasks. Extensive pin multiplexing on the 44-QFN offers design flexibility, and Microchip's free MPLAB X IDE plus XC16 compiler and code examples shorten development cycles. Multiple ICSP pin pairs ease fixture design for production programming and debug in small enclosures.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP512GP504-E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP256GP504-E/ML | DSPIC33EP128GP504-E/ML | DSPIC33EP512MC504-E/ML | DSPIC33EP32MC504-E/MV | DSPIC33EP512GM304-E/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB | 256 KB | 128 KB | 512 KB | 32 KB | 512 KB |
| RAM | 48 KB | 48 KB | 16 KB | 48 KB | 4 KB | 53 KB |
| Core Performance | 70 MIPS (60 MHz) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| On-Chip Op Amps | Yes | Yes | Yes | No (MC variant) | No (MC variant) | Yes |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Maximum flash in the 44-QFN GP504 family （vs DSPIC33EP256GP504-E/ML)
- On-chip op amps for sensor front ends （vs DSPIC33EP512MC504-E/ML)
- Extended -40C to +125C operation （vs DSPIC33EP256GP504-E/ML (in -I grade))
- Largest memory of the same-footprint MC drop-in path （vs DSPIC33EP32MC504-E/MV)
設計ノート
The 44-QFN (8x8) has an exposed pad that must be soldered to a grounded thermal land on the PCB. Create a via array (typically 4-9 vias) in the exposed-pad land to tie into internal ground planes for both heat spreading and return-current integrity. Connect every VDD and VSS pair - the dsPIC33E family requires all power pins connected for proper operation, and floating a pair can cause brown-out resets under load transients. Place 0.1 uF ceramic decoupling at each VDD pin, as close as possible to the pin.
During ICSP programming, ICSPCLK and ICSPDAT must come from the same PGECx/PGEDx pair - mixing PGEC2 with PGED3 is a frequent bring-up failure (per Northern Software dsPIC33EP512GP504 support notes). Route the chosen pair to the programming header and, if possible, avoid routing unselected PGEDx/PGECx pins to other circuitry since debug tools may probe them. Also reserve MCLR with a pull-up (4.7-10 kOhm typical) and a series resistor (~100 Ohm - estimate; verify against the programming spec) to protect the pin during programming.
The dsPIC33EP core generates its internal supply via the VCAP/VDDCORE pin - fit the datasheet-specified low-ESR capacitor (typically a 10 uF electrolytic/ceramic with a parallel 0.1 uF; verify exact values in the family datasheet) close to the pin. Never drive VCAP externally and do not route signals near it, as core-supply ripple here manifests directly as ADC noise and jitter. Operate from a clean 3.3 V rail within 2.97-3.63 V; feeding on-chip op amps from a noisy buck output will degrade sensor-conditioning accuracy.
The -E grade is specified to +125C ambient, but junction temperature depends on dissipation: Estimated - at 70 MIPS with heavy I/O loading, expect on the order of 100-200 mA supply current per typical family figures (verify in the datasheet current-vs-MIPS table), giving roughly 0.3-0.7 W at 3.3 V. With QFN-44 theta_JA typically around 30-40 C/W on a good thermal land (estimate; confirm in the datasheet thermal table), junction rise stays within budget, but reduce clock speed or I/O drive in sealed enclosures above +105C ambient.
コンプライアンス情報
Microchip product page marks the dsPIC33EP512GP504 as 'Recommended for Automotive Design' but does not state AEC-Q100 qualification for this general-purpose part. RoHS/REACH status must be confirmed from the official Microchip compliance database for the exact orderable code.