DSPIC33EP64GS708-E/PT - 16-bit 70 MIPS Digital Power DSC | Microchip
部品番号: DSPIC33EP64GS708-E/PT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.92 | $6.92 |
| 10 | $6.3 | $63.00 |
| 100 | $5.55 | $555.00 |
| 500 | $5.05 | $2,525.00 |
| 1,000 | $4.65 | $4,650.00 |
DSPIC33EP64GS708-E/PT 概要
A digital signal controller combines the computational throughput of a DSP with the deterministic control and peripheral set of a microcontroller. Within the power-management hierarchy, the dsPIC33EP GS series targets digital switch-mode power supplies (SMPS) and power-conversion systems, sitting above general-purpose MCUs in control-loop capability while remaining programmable in C like any PIC/dsPIC device.
Key features include an interconnected high-speed PWM module purpose-built for multi-phase and multi-loop power conversion, high-speed ADC with an integrated programmable gain amplifier (PGA), and on-chip comparators that close fast protection loops without CPU intervention. Dual-partition Flash supports live field firmware updates, important for grid-tied and server power products that cannot tolerate downtime. The GS-series peripheral interconnect allows ADC sample events to trigger PWM updates within a single control period at converter switching frequencies of hundreds of kilohertz.
Architecturally, the dsPIC DSC core provides DSP-class multiply-accumulate (MAC) instructions and dual operand fetch, so Proportional-Integral (PI) and 3p3z compensator loops execute efficiently at 70 MIPS, leaving headroom for housekeeping tasks such as communication and housekeeping sequencing.
Typical applications include AC-DC converters and interleaved power factor correction (PFC), DC-DC converters and LLC resonant stages, solar micro-inverters, and automotive AEC-Q100 qualified power modules.
When designing with this device, budget ADC sampling and PWM dead time carefully at high switching frequency, and use the on-chip comparators for cycle-by-cycle current limiting rather than software-only protection.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP64GS708-E/PT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP64GS708-E/PT （同一形状・フットプリント） — 相違点: Operating Temperature, Functional Safety Support, Series, Target Applications, Package.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP64GS708-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.95 / 個
データシートを見る →DSPIC33EP128GS708-E/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.6 / 個
データシートを見る →DSPIC33EP32GS708-E/PT
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP64GS808-E/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.85 / 個
データシートを見る →DSPIC33EP128GS808-E/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.9 / 個
データシートを見る →DSPIC33EP64GS708-E/PT 最大定格＆電気的特性
| Core Processor | dsPIC33EP 16-bit DSC |
| Core Size | 16-bit |
| Maximum Speed | 70 MIPS |
| Program Memory Size | 64KB (64K x 8) Flash |
| RAM Size | 8KB |
| 電源電圧 | 3.3 V |
| パッケージ | 80-TQFP (12x12 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +125C (E grade) |
| Qualification | AEC-Q100, Automotive |
| Feature Set | Interconnected high-speed PWM, high-speed ADC with PGA, comparators |
| Flash Architecture | Dual-partition Flash (live update) |
| Target Applications | Digital power, SMPS, power conversion |
| Functional Safety Support | Functional Safety (FuSa) package per DigiKey listing |
| Terminal Form | Gull wing |
| Number of Terminals | 80 |
| Packaging | Tray |
DSPIC33EP64GS708-E/PT 80-tqfp (12x12 mm) ピン配置ガイド
DSPIC33EP64GS708-E/PT (80-tqfp (12x12 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP64GS708-E/PT.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP64GS708-E/PT の用途: 6 件s: AC-DC Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters and LLC Resonant Stages, Solar Micro-Inverters and MPPT, Automotive Power Conversion, Industrial Motor Control and Digital Lighting.
AC-DC Power Supplies
The DSPIC33EP64GS708-E/PT controls off-line AC-DC converters where the interconnected high-speed PWM generates interleaved or single-phase switching patterns at hundreds of kilohertz while the high-speed ADC with PGA samples input current, output voltage, and bulk-bus voltage every switching cycle. Its 70 MIPS dsPIC core executes PI and 3p3z compensators in firmware, and the on-chip comparators provide hardware cycle-by-cycle overcurrent trip independent of software latency. Dual-partition Flash allows firmware field updates without downtime in server and telecom rectifiers. The AEC-Q100 qualification also enables automotive AC-DC auxiliary supplies.
おすすめ
Interleaved Power Factor Correction (PFC)
For interleaved boost PFC stages, the DSPIC33EP64GS708-E/PT drives multiple PWM phases with precise inter-phase phase shift and independent dead-time control from the GS-series high-speed PWM. The ADC with programmable gain amplifier conditions low-level inductor current signals directly, and hardware comparator fault inputs blank and trip outputs during inrush or inductor saturation events. The 70 MIPS core maintains average-current-mode control loops across universal input ranges. Microchip's Interleaved PFC reference design for the dsPIC33EP GS family demonstrates a universal-input unit producing a single high-voltage DC output up to 350W, providing a proven starting design for this exact controller.
おすすめ
DC-DC Converters and LLC Resonant Stages
The DSPIC33EP64GS708-E/PT suits digitally controlled synchronous buck, boost, half-bridge, and LLC resonant converters where PWM frequency, phase shift, and dead time must adapt with load and input voltage. The GS-series PWM supports frequency modulation and phase-shift topologies in hardware, while the high-speed ADC closes voltage and current loops each cycle and the comparators protect against overcurrent without CPU intervention. Onboard PGA gain settings let one ADC front end serve both low-voltage sense dividers and shunt-based current sensing, reducing external analog components and BOM cost in telecom and server power boards.
おすすめ
Solar Micro-Inverters and MPPT
In solar micro-inverter and MPPT applications, the DSPIC33EP64GS708-E/PT executes maximum-power-point-tracking algorithms while simultaneously regulating grid-side current with its DSP-class MAC instructions at 70 MIPS. The dual-partition Flash architecture enables safe field firmware updates on installed units - important for rooftop products with 25-year service expectations. The extended -40C to +125C E-grade temperature rating covers outdoor thermal environments, and the interconnected PWM plus high-speed ADC chain implements the fast inner current loop required for grid-compliant total harmonic distortion performance across varying irradiance conditions throughout the day.
おすすめ
Automotive Power Conversion
The DSPIC33EP64GS708-E/PT is AEC-Q100 qualified and rated -40C to +125C, making it appropriate for automotive DC-DC converters, on-board charger auxiliary stages, LED headlight drivers, and 48V-zone power modules. Hardware fault trip on the high-speed PWM provides fail-safe current limiting required in safety-relevant power paths, while Functional Safety (FuSa) package support referenced in DigiKey listings assists developers building systems under ISO 26262-influenced development flows. The 80-pin TQFP supplies enough PWM channels and ADC inputs for multi-output automotive power boards, and dual-partition Flash supports field updates over the vehicle lifecycle.
おすすめ
Industrial Motor Control and Digital Lighting
Beyond power supplies, the DSPIC33EP64GS708-E/PT drives industrial motor control (BLDC, PMSM, single-phase ACIM) and high-intensity digital lighting ballasts. The GS-series PWM provides the complementary outputs, dead-time insertion, and fault shutdown needed for three-phase bridges, while the 70 MIPS core runs field-oriented control or sensorless estimation algorithms in firmware. The high-speed ADC samples phase currents via the onboard PGA, and the comparators implement hardware overcurrent protection between PWM cycles. The 80-TQFP gull-wing package supports reliable soldering on industrial PCBs subjected to thermal cycling and vibration in factory environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP64GS708-E/PT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP64GS708-I/PT | DSPIC33EP128GS708-E/PT | DSPIC33EP32GS708-E/PT | DSPIC33EP64GS808-E/PT |
|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64KB | 64KB | 128KB | 32KB | 64KB |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (E grade) | Industrial grade (lower upper limit) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| AEC-Q100 Qualification | Yes (Automotive) | No (industrial grade) | Yes (Automotive, AEC-Q100 family) | Yes (Automotive, AEC-Q100 family) | Yes (Automotive, AEC-Q100 family) |
| Digital Power Peripherals | High-speed PWM + ADC/PGA + comparators | Identical (same die) | Identical (same die family) | Identical (same die family) | GS808 peripheral variant |
主な差別化要因
- Digital-power-specific peripheral interconnect （vs DSPIC33EP64GP504)
- Extended automotive temperature grade （vs DSPIC33EP64GS708-I/PT)
- Dual-partition Flash for live field updates （vs DSPIC33EP32GS708-E/PT)
設計ノート
Power the DSPIC33EP64GS708-E/PT from a clean 3.3V rail: place a 0.1uF ceramic capacitor at each VDD/VDDCORE pin pair within 2-3 mm of the pin, plus at least one 4.7uF-10uF bulk capacitor per supply domain. In digital power designs, generate controller VDD with a dedicated low-noise LDO rather than tapping the switching converter output - PWM switching noise on the supply degrades ADC accuracy and comparator thresholds, directly harming control-loop precision.
Never rely on software alone for overcurrent protection. Configure the GS-series comparators and PWM fault inputs for cycle-by-cycle current limiting in hardware so a fault trips the outputs within the same switching period regardless of firmware state. Software-based protection can be blocked by a firmware crash or interrupt storm - in a power converter this means destroyed MOSFETs. Also verify dead-time settings at minimum and maximum die temperature, since MOSFET switching times vary significantly across the -40C to +125C range.
Route current-sense ADC inputs to the PGA as short, differential pairs away from PWM and gate-drive traces, and place a small RC anti-alias filter (e.g., 100 ohm / 1 nF, adjust for your sampling rate) at each analog input. Keep the analog reference clean and star-grounded to the controller ground. On the 80-TQFP, assign PWM outputs to pins with short, direct routes to gate drivers to minimize loop inductance; avoid running gate-drive lines under or parallel to analog sense lines.
Estimated: thermal budget for the 80-TQFP (12x12 mm) should be checked with the datasheet theta-JA value [DATA_NEEDED: theta_JA]; as a planning figure, a well-coppered 4-layer board typically holds TQFP junction rise in the tens of degrees C at sub-watt dissipation typical for a 3.3V DSC. Use solid ground planes and thermal vias under the board to spread heat, especially in sealed automotive enclosures where ambient can reach +85C and junction margin to the 125C limit must be preserved.
コンプライアンス情報
AEC-Q100 automotive qualification and Automotive temperature grade stated in distributor listings (DigiKey, Hotenda, Jotrin). RoHS/REACH/lead-free status not stated in the provided data - verify on the Microchip product page.