DSPIC33EP64GS708-E/PT - 16-bit 70 MIPS Digital Power DSC | Microchip
MPN: DSPIC33EP64GS708-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.92 | $6.92 |
| 10 | $6.3 | $63.00 |
| 100 | $5.55 | $555.00 |
| 500 | $5.05 | $2,525.00 |
| 1,000 | $4.65 | $4,650.00 |
DSPIC33EP64GS708-E/PT Overview
A digital signal controller combines the computational throughput of a DSP with the deterministic control and peripheral set of a microcontroller. Within the power-management hierarchy, the dsPIC33EP GS series targets digital switch-mode power supplies (SMPS) and power-conversion systems, sitting above general-purpose MCUs in control-loop capability while remaining programmable in C like any PIC/dsPIC device.
Key features include an interconnected high-speed PWM module purpose-built for multi-phase and multi-loop power conversion, high-speed ADC with an integrated programmable gain amplifier (PGA), and on-chip comparators that close fast protection loops without CPU intervention. Dual-partition Flash supports live field firmware updates, important for grid-tied and server power products that cannot tolerate downtime. The GS-series peripheral interconnect allows ADC sample events to trigger PWM updates within a single control period at converter switching frequencies of hundreds of kilohertz.
Architecturally, the dsPIC DSC core provides DSP-class multiply-accumulate (MAC) instructions and dual operand fetch, so Proportional-Integral (PI) and 3p3z compensator loops execute efficiently at 70 MIPS, leaving headroom for housekeeping tasks such as communication and housekeeping sequencing.
Typical applications include AC-DC converters and interleaved power factor correction (PFC), DC-DC converters and LLC resonant stages, solar micro-inverters, and automotive AEC-Q100 qualified power modules.
When designing with this device, budget ADC sampling and PWM dead time carefully at high switching frequency, and use the on-chip comparators for cycle-by-cycle current limiting rather than software-only protection.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64GS708-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GS708-E/PT (same form factor and footprint) — differing in Operating Temperature, Functional Safety Support, Series, Target Applications, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GS708-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.95 / Unit
View Datasheet →DSPIC33EP128GS708-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.6 / Unit
View Datasheet →DSPIC33EP32GS708-E/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GS808-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.85 / Unit
View Datasheet →DSPIC33EP128GS808-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.9 / Unit
View Datasheet →DSPIC33EP64GS708-E/PT Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33EP 16-bit DSC |
| Core Size | 16-bit |
| Maximum Speed | 70 MIPS |
| Program Memory Size | 64KB (64K x 8) Flash |
| RAM Size | 8KB |
| Supply Voltage | 3.3 V |
| Package | 80-TQFP (12x12 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | AEC-Q100, Automotive |
| Feature Set | Interconnected high-speed PWM, high-speed ADC with PGA, comparators |
| Flash Architecture | Dual-partition Flash (live update) |
| Target Applications | Digital power, SMPS, power conversion |
| Functional Safety Support | Functional Safety (FuSa) package per DigiKey listing |
| Terminal Form | Gull wing |
| Number of Terminals | 80 |
| Packaging | Tray |
DSPIC33EP64GS708-E/PT 80-tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP64GS708-E/PT (80-tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GS708-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GS708-E/PT is suitable for 6 applications: AC-DC Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters and LLC Resonant Stages, Solar Micro-Inverters and MPPT, Automotive Power Conversion, Industrial Motor Control and Digital Lighting.
AC-DC Power Supplies
The DSPIC33EP64GS708-E/PT controls off-line AC-DC converters where the interconnected high-speed PWM generates interleaved or single-phase switching patterns at hundreds of kilohertz while the high-speed ADC with PGA samples input current, output voltage, and bulk-bus voltage every switching cycle. Its 70 MIPS dsPIC core executes PI and 3p3z compensators in firmware, and the on-chip comparators provide hardware cycle-by-cycle overcurrent trip independent of software latency. Dual-partition Flash allows firmware field updates without downtime in server and telecom rectifiers. The AEC-Q100 qualification also enables automotive AC-DC auxiliary supplies.
Recommended
Interleaved Power Factor Correction (PFC)
For interleaved boost PFC stages, the DSPIC33EP64GS708-E/PT drives multiple PWM phases with precise inter-phase phase shift and independent dead-time control from the GS-series high-speed PWM. The ADC with programmable gain amplifier conditions low-level inductor current signals directly, and hardware comparator fault inputs blank and trip outputs during inrush or inductor saturation events. The 70 MIPS core maintains average-current-mode control loops across universal input ranges. Microchip's Interleaved PFC reference design for the dsPIC33EP GS family demonstrates a universal-input unit producing a single high-voltage DC output up to 350W, providing a proven starting design for this exact controller.
Recommended
DC-DC Converters and LLC Resonant Stages
The DSPIC33EP64GS708-E/PT suits digitally controlled synchronous buck, boost, half-bridge, and LLC resonant converters where PWM frequency, phase shift, and dead time must adapt with load and input voltage. The GS-series PWM supports frequency modulation and phase-shift topologies in hardware, while the high-speed ADC closes voltage and current loops each cycle and the comparators protect against overcurrent without CPU intervention. Onboard PGA gain settings let one ADC front end serve both low-voltage sense dividers and shunt-based current sensing, reducing external analog components and BOM cost in telecom and server power boards.
Recommended
Solar Micro-Inverters and MPPT
In solar micro-inverter and MPPT applications, the DSPIC33EP64GS708-E/PT executes maximum-power-point-tracking algorithms while simultaneously regulating grid-side current with its DSP-class MAC instructions at 70 MIPS. The dual-partition Flash architecture enables safe field firmware updates on installed units - important for rooftop products with 25-year service expectations. The extended -40C to +125C E-grade temperature rating covers outdoor thermal environments, and the interconnected PWM plus high-speed ADC chain implements the fast inner current loop required for grid-compliant total harmonic distortion performance across varying irradiance conditions throughout the day.
Recommended
Automotive Power Conversion
The DSPIC33EP64GS708-E/PT is AEC-Q100 qualified and rated -40C to +125C, making it appropriate for automotive DC-DC converters, on-board charger auxiliary stages, LED headlight drivers, and 48V-zone power modules. Hardware fault trip on the high-speed PWM provides fail-safe current limiting required in safety-relevant power paths, while Functional Safety (FuSa) package support referenced in DigiKey listings assists developers building systems under ISO 26262-influenced development flows. The 80-pin TQFP supplies enough PWM channels and ADC inputs for multi-output automotive power boards, and dual-partition Flash supports field updates over the vehicle lifecycle.
Recommended
Industrial Motor Control and Digital Lighting
Beyond power supplies, the DSPIC33EP64GS708-E/PT drives industrial motor control (BLDC, PMSM, single-phase ACIM) and high-intensity digital lighting ballasts. The GS-series PWM provides the complementary outputs, dead-time insertion, and fault shutdown needed for three-phase bridges, while the 70 MIPS core runs field-oriented control or sensorless estimation algorithms in firmware. The high-speed ADC samples phase currents via the onboard PGA, and the comparators implement hardware overcurrent protection between PWM cycles. The 80-TQFP gull-wing package supports reliable soldering on industrial PCBs subjected to thermal cycling and vibration in factory environments.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GS708-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GS708-I/PT | DSPIC33EP128GS708-E/PT | DSPIC33EP32GS708-E/PT | DSPIC33EP64GS808-E/PT |
|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64KB | 64KB | 128KB | 32KB | 64KB |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (E grade) | Industrial grade (lower upper limit) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| AEC-Q100 Qualification | Yes (Automotive) | No (industrial grade) | Yes (Automotive, AEC-Q100 family) | Yes (Automotive, AEC-Q100 family) | Yes (Automotive, AEC-Q100 family) |
| Digital Power Peripherals | High-speed PWM + ADC/PGA + comparators | Identical (same die) | Identical (same die family) | Identical (same die family) | GS808 peripheral variant |
Key Differentiators
- Digital-power-specific peripheral interconnect (vs DSPIC33EP64GP504)
- Extended automotive temperature grade (vs DSPIC33EP64GS708-I/PT)
- Dual-partition Flash for live field updates (vs DSPIC33EP32GS708-E/PT)
Design Notes
Power the DSPIC33EP64GS708-E/PT from a clean 3.3V rail: place a 0.1uF ceramic capacitor at each VDD/VDDCORE pin pair within 2-3 mm of the pin, plus at least one 4.7uF-10uF bulk capacitor per supply domain. In digital power designs, generate controller VDD with a dedicated low-noise LDO rather than tapping the switching converter output - PWM switching noise on the supply degrades ADC accuracy and comparator thresholds, directly harming control-loop precision.
Never rely on software alone for overcurrent protection. Configure the GS-series comparators and PWM fault inputs for cycle-by-cycle current limiting in hardware so a fault trips the outputs within the same switching period regardless of firmware state. Software-based protection can be blocked by a firmware crash or interrupt storm - in a power converter this means destroyed MOSFETs. Also verify dead-time settings at minimum and maximum die temperature, since MOSFET switching times vary significantly across the -40C to +125C range.
Route current-sense ADC inputs to the PGA as short, differential pairs away from PWM and gate-drive traces, and place a small RC anti-alias filter (e.g., 100 ohm / 1 nF, adjust for your sampling rate) at each analog input. Keep the analog reference clean and star-grounded to the controller ground. On the 80-TQFP, assign PWM outputs to pins with short, direct routes to gate drivers to minimize loop inductance; avoid running gate-drive lines under or parallel to analog sense lines.
Estimated: thermal budget for the 80-TQFP (12x12 mm) should be checked with the datasheet theta-JA value [DATA_NEEDED: theta_JA]; as a planning figure, a well-coppered 4-layer board typically holds TQFP junction rise in the tens of degrees C at sub-watt dissipation typical for a 3.3V DSC. Use solid ground planes and thermal vias under the board to spread heat, especially in sealed automotive enclosures where ambient can reach +85C and junction margin to the 125C limit must be preserved.
Compliance Information
AEC-Q100 automotive qualification and Automotive temperature grade stated in distributor listings (DigiKey, Hotenda, Jotrin). RoHS/REACH/lead-free status not stated in the provided data - verify on the Microchip product page.